JP2020537330A - 導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法 - Google Patents

導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法 Download PDF

Info

Publication number
JP2020537330A
JP2020537330A JP2020514197A JP2020514197A JP2020537330A JP 2020537330 A JP2020537330 A JP 2020537330A JP 2020514197 A JP2020514197 A JP 2020514197A JP 2020514197 A JP2020514197 A JP 2020514197A JP 2020537330 A JP2020537330 A JP 2020537330A
Authority
JP
Japan
Prior art keywords
contact portion
conductive
terminal
terminals
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020514197A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020537330A5 (https=
Inventor
カッパーサイト、セオドア、ジェイ．
ナイアエシュ、オミッド
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クリック アンド ソッファ インダストリーズ、インク．, クリック アンド ソッファ インダストリーズ、インク． filed Critical クリック アンド ソッファ インダストリーズ、インク．
Publication of JP2020537330A publication Critical patent/JP2020537330A/ja
Publication of JP2020537330A5 publication Critical patent/JP2020537330A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
    • H01R25/161—Details
    • H01R25/162—Electrical connections between or with rails or bus-bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H01R4/187—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping combined with soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H01R4/625—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2020514197A 2017-10-13 2018-10-12 導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法 Pending JP2020537330A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762572055P 2017-10-13 2017-10-13
US62/572,055 2017-10-13
PCT/US2018/055552 WO2019075289A1 (en) 2017-10-13 2018-10-12 CONDUCTIVE TERMINALS, OMNIBUS BARS, AND METHODS OF PREPARING THE SAME, AND METHODS OF ASSEMBLING POWER MODULES THEREOF

Publications (2)

Publication Number Publication Date
JP2020537330A true JP2020537330A (ja) 2020-12-17
JP2020537330A5 JP2020537330A5 (https=) 2021-10-28

Family

ID=66097146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514197A Pending JP2020537330A (ja) 2017-10-13 2018-10-12 導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法

Country Status (4)

Country Link
US (1) US20190115704A1 (https=)
JP (1) JP2020537330A (https=)
CN (1) CN111201683A (https=)
WO (1) WO2019075289A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4681866A3 (en) * 2017-04-04 2026-04-29 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
US10957892B2 (en) 2018-08-23 2021-03-23 Rivian Ip Holdings, Llc Busbars having stamped fusible links
US10944090B2 (en) 2018-08-23 2021-03-09 Rivian Ip Holdings, Llc Layered busbars having integrated fusible links
EP4403292A3 (en) 2018-11-28 2024-11-06 Kulicke and Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
USD924810S1 (en) 2019-01-04 2021-07-13 Intel Corporation Busbar
USD960111S1 (en) * 2020-02-25 2022-08-09 Transportation Ip Holdings, Llc Rectifier busbar
US11850676B2 (en) * 2020-06-03 2023-12-26 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins
DE102020124171A1 (de) * 2020-09-16 2022-03-17 Danfoss Silicon Power Gmbh Elektronisches Modul und Verfahren zum Verbinden von mehreren Leitern mit einem Substrat
DE102022207269A1 (de) * 2022-07-18 2024-01-18 Zf Friedrichshafen Ag Verfahren und Vorrichtung zum Herstellen einer Anschlussvorrichtung zum Anschließen zumindest eines elektrischen oder elektronischen Bauteils für ein elektrisches oder elektronisches Modul
DE102023209022A1 (de) 2023-09-18 2025-03-20 Robert Bosch Gesellschaft mit beschränkter Haftung Verbindungsanordnung, insbesondere zur Verwendung in Elektrofahrzeugen oder Hybridfahrzeugen und Verfahren zur Herstellung einer Verbindungsanordnung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005259880A (ja) * 2004-03-10 2005-09-22 Fuji Electric Holdings Co Ltd 半導体装置
JP2008103502A (ja) * 2006-10-18 2008-05-01 Toyota Motor Corp 回路体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH526203A (it) * 1968-11-06 1972-07-31 Olivetti & Co Spa Procedimento di montaggio di uno o più circuiti elettronici integrati in un contenitore
US7056414B2 (en) * 1999-10-07 2006-06-06 Aisin Seiki Kabushiki Kaisha Connecting method for metal material and electric conductive plastic material and product thereby
JP4659262B2 (ja) * 2001-05-01 2011-03-30 富士通セミコンダクター株式会社 電子部品の実装方法及びペースト材料
AT502005B1 (de) * 2005-06-01 2007-03-15 Outokumpu Copper Neumayer Gmbh Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement
JP4577509B2 (ja) * 2005-06-22 2010-11-10 トヨタ自動車株式会社 パワー半導体モジュール及びその製造方法
JP2013051366A (ja) * 2011-08-31 2013-03-14 Hitachi Ltd パワーモジュール及びその製造方法
CN202726328U (zh) * 2012-08-09 2013-02-13 四川飞龙电子材料有限公司 压纹整形的焊接用银合金片材
JP6033011B2 (ja) * 2012-09-12 2016-11-30 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
CN103357999A (zh) * 2013-07-27 2013-10-23 何强 一种针对不匹配材料的电阻焊、螺柱焊焊接技术
CN104659011A (zh) * 2013-11-20 2015-05-27 西安永电电气有限责任公司 一种igbt模块的芯片焊接结构
DE102014006360B4 (de) * 2014-04-30 2019-03-07 Ellenberger & Poensgen Gmbh Elektrische Schaltung
KR20160040865A (ko) * 2014-10-06 2016-04-15 현대모비스 주식회사 차량 내의 금속 인쇄회로기판 실장용 버스 바
JP6406983B2 (ja) * 2014-11-12 2018-10-17 三菱電機株式会社 半導体装置およびその製造方法
WO2016199621A1 (ja) * 2015-06-11 2016-12-15 三菱電機株式会社 電力用半導体装置の製造方法および電力用半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005259880A (ja) * 2004-03-10 2005-09-22 Fuji Electric Holdings Co Ltd 半導体装置
JP2008103502A (ja) * 2006-10-18 2008-05-01 Toyota Motor Corp 回路体

Also Published As

Publication number Publication date
WO2019075289A1 (en) 2019-04-18
CN111201683A (zh) 2020-05-26
US20190115704A1 (en) 2019-04-18

Similar Documents

Publication Publication Date Title
JP2020537330A (ja) 導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法
JP7541806B2 (ja) 超音波溶接システムおよび当該システムを使用する方法
KR101377108B1 (ko) 파워 모듈 및 그 제조 방법
CN110891726B (zh) 超声焊接系统及其使用方法
CN100550478C (zh) 电池用电极
JP4943917B2 (ja) 溶接装置及び溶接方法
US20080061450A1 (en) Bonding wire and bond using a bonding wire
US20150325930A1 (en) Method for producing an electrically conductive bond between an electrical line and an electrically conductive component and assembly produced using the method
US11777299B2 (en) Method for manufacturing a wiring system
JP6602544B2 (ja) 接合方法
JP2007234694A (ja) 半導体装置及び半導体装置の外部接続端子と外部電極との接合方法
CN106132623B (zh) 电阻焊接装置和电阻焊接方法以及用于凸出焊接的突起的形状
JP5465195B2 (ja) 超音波接合方法
CN102881606A (zh) 芯片焊接装置
CN115255601A (zh) 超声波焊接设备
CN101190475B (zh) 超声波焊接治具
CN223638365U (zh) 导电引脚、功率模块以及超声焊接系统
CN114175223A (zh) 功率半导体模块和形成功率半导体模块的方法
CN214978469U (zh) 焊接接头和扭矩式超声波焊接机
CN106575740B (zh) 用于通过使用导体引线在储能电池和导体板结构之间形成电触点接通的装置以及方法
JP5879771B2 (ja) 金属結合方法
JP2018069308A (ja) 超音波接合ツール
JP6164423B2 (ja) バスバーユニット
JP2024106812A (ja) 半導体装置及びその製造方法
JP2005011899A (ja) リードフレーム及びそれを用いた電子部品

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210916

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210916

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211105

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220826

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220906

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20221206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230306

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230704