JP2020536393A5 - - Google Patents
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- JP2020536393A5 JP2020536393A5 JP2020519333A JP2020519333A JP2020536393A5 JP 2020536393 A5 JP2020536393 A5 JP 2020536393A5 JP 2020519333 A JP2020519333 A JP 2020519333A JP 2020519333 A JP2020519333 A JP 2020519333A JP 2020536393 A5 JP2020536393 A5 JP 2020536393A5
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- Prior art keywords
- memory
- machine
- energy particles
- activation source
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- 238000002407 reforming Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims 11
- 230000004913 activation Effects 0.000 claims 9
- 238000000034 method Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 5
- 230000004907 flux Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 5
- 238000010926 purge Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023093589A JP7682948B2 (ja) | 2017-10-06 | 2023-06-07 | 高エネルギー原子層エッチング |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762569443P | 2017-10-06 | 2017-10-06 | |
| US62/569,443 | 2017-10-06 | ||
| US201762599613P | 2017-12-15 | 2017-12-15 | |
| US62/599,613 | 2017-12-15 | ||
| US16/148,939 US10763083B2 (en) | 2017-10-06 | 2018-10-01 | High energy atomic layer etching |
| US16/148,939 | 2018-10-01 | ||
| PCT/US2018/054001 WO2019070737A1 (en) | 2017-10-06 | 2018-10-02 | HIGH-ENERGY ATOMIC LAYER ETCHING |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023093589A Division JP7682948B2 (ja) | 2017-10-06 | 2023-06-07 | 高エネルギー原子層エッチング |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020536393A JP2020536393A (ja) | 2020-12-10 |
| JP2020536393A5 true JP2020536393A5 (https=) | 2022-01-11 |
| JP7293211B2 JP7293211B2 (ja) | 2023-06-19 |
Family
ID=65994055
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020519333A Active JP7293211B2 (ja) | 2017-10-06 | 2018-10-02 | 高エネルギー原子層エッチング |
| JP2023093589A Active JP7682948B2 (ja) | 2017-10-06 | 2023-06-07 | 高エネルギー原子層エッチング |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023093589A Active JP7682948B2 (ja) | 2017-10-06 | 2023-06-07 | 高エネルギー原子層エッチング |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10763083B2 (https=) |
| EP (1) | EP3692567B1 (https=) |
| JP (2) | JP7293211B2 (https=) |
| KR (1) | KR20200053623A (https=) |
| TW (1) | TWI808998B (https=) |
| WO (1) | WO2019070737A1 (https=) |
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| US10566212B2 (en) | 2016-12-19 | 2020-02-18 | Lam Research Corporation | Designer atomic layer etching |
| WO2019190781A1 (en) | 2018-03-30 | 2019-10-03 | Lam Research Corporation | Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials |
| KR102678588B1 (ko) | 2018-11-14 | 2024-06-27 | 램 리써치 코포레이션 | 차세대 리소그래피에서 유용한 하드 마스크들을 제조하기 위한 방법들 |
| US12211691B2 (en) | 2018-12-20 | 2025-01-28 | Lam Research Corporation | Dry development of resists |
| JP7345382B2 (ja) * | 2018-12-28 | 2023-09-15 | 東京エレクトロン株式会社 | プラズマ処理装置及び制御方法 |
| US11518674B2 (en) * | 2019-02-04 | 2022-12-06 | Ut-Battelle, Llc | Atomic-scale e-beam sculptor |
| US11270893B2 (en) * | 2019-04-08 | 2022-03-08 | International Business Machines Corporation | Layer-by-layer etching of poly-granular metal-based materials for semiconductor structures |
| US11935758B2 (en) | 2019-04-29 | 2024-03-19 | Lam Research Corporation | Atomic layer etching for subtractive metal etch |
| TWI910974B (zh) | 2019-06-26 | 2026-01-01 | 美商蘭姆研究公司 | 利用鹵化物化學品的光阻顯影 |
| WO2021021486A1 (en) | 2019-07-31 | 2021-02-04 | Lam Research Corporation | Chemical etch nonvolatile materials for mram patterning |
| US11817295B2 (en) * | 2019-08-14 | 2023-11-14 | Tokyo Electron Limited | Three-phase pulsing systems and methods for plasma processing |
| CN114200776A (zh) | 2020-01-15 | 2022-03-18 | 朗姆研究公司 | 用于光刻胶粘附和剂量减少的底层 |
| JP7450455B2 (ja) * | 2020-05-13 | 2024-03-15 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| CN113808931A (zh) * | 2020-06-11 | 2021-12-17 | 中国科学院微电子研究所 | 圆弧形鳍顶形成方法及鳍式场效应晶体管 |
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| JP7504686B2 (ja) * | 2020-07-15 | 2024-06-24 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
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| WO2022103764A1 (en) | 2020-11-13 | 2022-05-19 | Lam Research Corporation | Process tool for dry removal of photoresist |
| US12577466B2 (en) | 2020-12-08 | 2026-03-17 | Lam Research Corporation | Photoresist development with organic vapor |
| GB202020822D0 (en) * | 2020-12-31 | 2021-02-17 | Spts Technologies Ltd | Method and apparatus |
| WO2022169509A1 (en) * | 2021-02-03 | 2022-08-11 | Lam Research Corporation | Etch selectivity control in atomic layer etching |
| KR20230085050A (ko) * | 2021-12-06 | 2023-06-13 | (주)선재하이테크 | 진공 챔버용 플렉시블 진공자외선 이오나이저 |
| CN118843924A (zh) * | 2022-03-18 | 2024-10-25 | 东京毅力科创株式会社 | 等离子体处理方法和等离子体处理装置 |
| JP2025509701A (ja) * | 2022-03-22 | 2025-04-11 | ラム リサーチ コーポレーション | 高速原子層エッチ |
| JP2025509700A (ja) * | 2022-03-22 | 2025-04-11 | ラム リサーチ コーポレーション | 炭素含有層の高エネルギー原子層エッチ |
| CN117157734A (zh) * | 2022-03-29 | 2023-12-01 | 株式会社国际电气 | 衬底处理方法、半导体器件的制造方法、程序及衬底处理装置 |
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| US20260060018A1 (en) * | 2022-08-31 | 2026-02-26 | Lam Research Corporation | Nitride thermal atomic layer etch |
| KR102797232B1 (ko) * | 2022-11-28 | 2025-04-23 | 성균관대학교산학협력단 | 원자층 식각 방법 |
| TW202439443A (zh) * | 2023-03-27 | 2024-10-01 | 日商東京威力科創股份有限公司 | 蝕刻方法及電漿處理裝置 |
| US20250087497A1 (en) * | 2023-09-13 | 2025-03-13 | Hitachi High-Tech Corporation | Plasma processing method |
| KR102775721B1 (ko) * | 2024-02-15 | 2025-03-05 | 오스 주식회사 | 원자층 식각을 위한 기판 처리 장치 |
| TWI892868B (zh) * | 2024-10-17 | 2025-08-01 | 態金材料科技股份有限公司 | 雷射改質並藉金屬玻璃微粒子轟擊之乾式蝕刻法 |
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-
2018
- 2018-10-01 US US16/148,939 patent/US10763083B2/en active Active
- 2018-10-02 JP JP2020519333A patent/JP7293211B2/ja active Active
- 2018-10-02 KR KR1020207012786A patent/KR20200053623A/ko not_active Ceased
- 2018-10-02 WO PCT/US2018/054001 patent/WO2019070737A1/en not_active Ceased
- 2018-10-02 EP EP18864801.8A patent/EP3692567B1/en active Active
- 2018-10-03 TW TW107134919A patent/TWI808998B/zh active
-
2020
- 2020-08-31 US US17/008,244 patent/US20200402770A1/en not_active Abandoned
-
2023
- 2023-06-07 JP JP2023093589A patent/JP7682948B2/ja active Active
-
2024
- 2024-04-03 US US18/626,025 patent/US20240274408A1/en active Pending
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