JP2020534695A - 合金拡散障壁層 - Google Patents
合金拡散障壁層 Download PDFInfo
- Publication number
- JP2020534695A JP2020534695A JP2020516384A JP2020516384A JP2020534695A JP 2020534695 A JP2020534695 A JP 2020534695A JP 2020516384 A JP2020516384 A JP 2020516384A JP 2020516384 A JP2020516384 A JP 2020516384A JP 2020534695 A JP2020534695 A JP 2020534695A
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- JP
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- Prior art keywords
- metal
- copper
- barrier layer
- solder
- weight percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000004888 barrier function Effects 0.000 title claims abstract description 155
- 238000009792 diffusion process Methods 0.000 title claims abstract description 29
- 239000000956 alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 95
- 229910052802 copper Inorganic materials 0.000 claims abstract description 95
- 239000010949 copper Substances 0.000 claims abstract description 95
- 229910000679 solder Inorganic materials 0.000 claims abstract description 93
- 229910052751 metal Inorganic materials 0.000 claims abstract description 81
- 239000002184 metal Substances 0.000 claims abstract description 81
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000002923 metal particle Substances 0.000 claims abstract description 57
- 238000004377 microelectronic Methods 0.000 claims abstract description 51
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 44
- 239000011733 molybdenum Substances 0.000 claims abstract description 44
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 42
- 239000010937 tungsten Substances 0.000 claims abstract description 42
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 37
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 24
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 24
- 239000010941 cobalt Substances 0.000 claims abstract description 24
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 24
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 16
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 46
- 239000011135 tin Substances 0.000 claims description 27
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 22
- 229910052718 tin Inorganic materials 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 20
- 229910000765 intermetallic Inorganic materials 0.000 claims description 16
- 150000002739 metals Chemical class 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 17
- -1 lantern Chemical compound 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000000080 wetting agent Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- FEBFYWHXKVOHDI-UHFFFAOYSA-N [Co].[P][W] Chemical compound [Co].[P][W] FEBFYWHXKVOHDI-UHFFFAOYSA-N 0.000 description 1
- ACVSDIKGGNSZDR-UHFFFAOYSA-N [P].[W].[Ni] Chemical compound [P].[W].[Ni] ACVSDIKGGNSZDR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- LHLROOPJPUYVKD-UHFFFAOYSA-N iron phosphanylidynenickel Chemical compound [Fe].[Ni]#P LHLROOPJPUYVKD-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- ICAKDTKJOYSXGC-UHFFFAOYSA-K lanthanum(iii) chloride Chemical compound Cl[La](Cl)Cl ICAKDTKJOYSXGC-UHFFFAOYSA-K 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SIBIBHIFKSKVRR-UHFFFAOYSA-N phosphanylidynecobalt Chemical compound [Co]#P SIBIBHIFKSKVRR-UHFFFAOYSA-N 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
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- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
Description
Claims (20)
- マイクロ電子デバイスであって、
リフロー構造を含み、
前記リフロー構造が、
銅含有部材、
前記銅含有部材上の障壁層であって、金属粒子と前記金属粒子間の拡散障壁充填材とを含む前記障壁層、及び
前記障壁層上のはんだ部材であって、リフロー温度が150℃〜400℃である前記はんだ部材、
を含み、
前記金属粒子が、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択される、少なくとも10重量パーセントの第1の金属を含み、
前記金属粒子が、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択される、前記第1の金属とは異なる、少なくとも10重量パーセントの第2の金属を含み、
前記障壁層が、タングステン及びモリブデンからなる群から選択される、少なくとも1つの金属を含み、前記障壁層におけるタングステン及びモリブデンの組み合わせ濃度が2重量パーセントより大きく、15重量パーセント未満であり、前記拡散障壁充填材におけるタングステン及びモリブデンの組み合わせ濃度が、前記金属粒子におけるタングステン及びモリブデンの組み合わせ濃度より高い、
マイクロ電子デバイス。 - 請求項1に記載のマイクロ電子デバイスであって、前記金属粒子が少なくとも10重量パーセントのニッケルを含み、前記金属粒子が少なくとも10重量パーセントのコバルトを含み、前記金属粒子が1重量パーセント未満のランタン、及びセリウムを含む、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記障壁層が1重量パーセント未満のモリブデンを含む、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記障壁層が2ミクロン〜20ミクロンの厚みである、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記リフロー構造がパンプ接合構造であり、前記銅含有部材が銅含有ピラーであり、前記はんだ部材がはんだバンプである、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記リフロー構造がリードフレーム上のはんだ接続であり、前記銅含有部材が前記リードフレームの銅含有端子である、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記はんだが少なくとも25重量パーセントの錫を含む、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記リフロー構造が前記障壁層と前記はんだ部材との間の金属間化合物を含み、前記金属間化合物が、前記はんだ部材からの金属と、前記金属粒子からの少なくとも2つの金属とを含む、マイクロ電子デバイス。
- 請求項8に記載のマイクロ電子デバイスであって、前記金属間化合物が、Ni3Sn4よりも可鍛性がある、マイクロ電子デバイス。
- 請求項1に記載のマイクロ電子デバイスであって、前記リフロー構造が、銅及び錫を含む金属間化合物を含まない、マイクロ電子デバイス。
- マイクロ電子デバイスを形成する方法であって、
銅含有部材を提供すること、
障壁めっき槽を提供することであって、前記障壁めっき槽が、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択される第1の金属と、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択される、前記第1の金属とは異なる第2の金属と、タングステン及びモリブデンからなる群から選択される第3の金属とを含む、前記障壁めっき槽を提供すること、
前記障壁めっき槽からの前記第1の金属、前記第2の金属、及び前記第3の金属を同時に前記銅含有障壁層上にめっきすることによって、前記銅含有部材上に障壁層を形成することであって、前記障壁層が、金属粒子と前記金属粒子間の拡散障壁充填材とを含む、前記障壁層を形成すること、及び
前記障壁層上に150℃〜400℃のリフロー温度を有するはんだ部材を形成すること、
を含み、
前記金属粒子が、少なくとも10重量パーセントの第1の金属及び少なくとも10重量パーセントの、前記第1の金属とは異なる第2の金属を含み、前記第1の金属及び前記第2の金属の各々が、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択され、
前記障壁層におけるタングステン及びモリブデンの組み合わせ濃度が2重量パーセントより大きく、15重量パーセント未満であり、
前記拡散障壁充填材におけるタングステン及びモリブデンの組み合わせ濃度が前記金属粒子におけるタングステンとモリブデンの組み合わせ濃度よりも高い、
方法。 - 請求項11に記載の方法であって、前記障壁めっき槽が、ニッケル及びコバルトを含み、ランタン及びセリウムを本質的に含まない、方法。
- 請求項11に記載の方法であって、前記障壁めっき槽が、タングステンを含み、モリブデンを本質的に含まない、方法。
- 請求項11に記載の方法であって、
前記第1の金属、前記第2の金属、及び前記第3の金属を同時にめっきすることが、逆方向パルスめっきプロセスを用いて成され、順方向電流密度の大きさが逆方向電流密度の大きさよりも大きく、
前記第1の金属、前記第2の金属、及び前記第3の金属が、前記順方向電流密度によって前記障壁めっき槽からめっきされ、前記逆方向電流密度によって前記障壁層から金属が除去される、
方法。 - 請求項11に記載の方法であって、
前記銅含有部材が銅含有ピラーであり、
前記銅含有ピラーを提供することがアンダーバンプメタライゼーション(UBM)層上に銅をめっきすることを含み、
前記はんだ部材がはんだバンプであり、
前記はんだ部材を形成することが前記障壁層上にはんだバンプをめっきすることを含む、
方法。 - 請求項11に記載の方法であって、前記銅含有部材がリードフレームの銅含有端子である、方法。
- マイクロ電子デバイスを形成する方法であって、
リフロー構造を提供することであって、
前記リフロー構造を提供することが、銅含有部材、前記銅含有部材上の障壁層であって、金属粒子と前記金属粒子間の拡散障壁充填材とを含む前記障壁層、及び前記障壁層上の150℃〜400℃のリフロー温度を有するはんだ部材を含み、
前記金属粒子が、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択される少なくとも10重量パーセントの第1の金属を含み、
前記金属粒子が、ニッケル、コバルト、ランタン、及びセリウムからなる群から選択される、第1の金属とは異なる、少なくとも10重量パーセントの第2の金属を含み、
前記障壁層がタングステン及びモリブデンからなる群から選択される少なくとも1つの金属を含み、
前記障壁層におけるタングステン及びモリブデンの組み合わせ濃度が2重量パーセントより大きく、15重量パーセント未満であり、
前記拡散障壁充填材におけるタングステンとモリブデンの濃度が前記金属粒子におけるタングステンとモリブデンの濃度よりも高い、前記リフロー構造を提供すること、及び
前記はんだ部材が前記障壁層と前記マイクロ電子デバイスの部材との間に接続を形成するように、前記リフロー構造を前記リフロー温度を上回って加熱すること、
を含む、方法。 - 請求項17に記載の方法であって、前記リフロー構造がパンプ接合構造であり、前記銅含有部材が銅含有ピラーであり、前記はんだ部材がはんだバンプである、方法。
- 請求項17に記載の方法であって、前記リフロー構造がリードフレーム上のはんだ接続であり、前記銅含有部材が前記リードフレームの銅含有端子である、方法。
- 請求項17に記載の方法であって、前記金属粒子が少なくとも10重量パーセントのニッケルを含み、前記金属粒子が少なくとも10重量パーセントのコバルトを含み、前記金属粒子が1重量パーセント未満のランタン及びセリウムを含み、前記障壁層が1重量パーセント未満のモリブデンである、方法。
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- 2018-09-20 WO PCT/US2018/051874 patent/WO2019060496A1/en active Application Filing
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US20190088608A1 (en) | 2019-03-21 |
CN111052362A (zh) | 2020-04-21 |
JP7185375B2 (ja) | 2022-12-07 |
US10424552B2 (en) | 2019-09-24 |
CN111052362B (zh) | 2023-04-21 |
US20200020656A1 (en) | 2020-01-16 |
WO2019060496A1 (en) | 2019-03-28 |
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