JP2020524407A - 半導体レーザーダイオード - Google Patents
半導体レーザーダイオード Download PDFInfo
- Publication number
- JP2020524407A JP2020524407A JP2019570091A JP2019570091A JP2020524407A JP 2020524407 A JP2020524407 A JP 2020524407A JP 2019570091 A JP2019570091 A JP 2019570091A JP 2019570091 A JP2019570091 A JP 2019570091A JP 2020524407 A JP2020524407 A JP 2020524407A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- laser diode
- semiconductor
- cladding layer
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
- H01S5/04253—Electrodes, e.g. characterised by the structure characterised by the material having specific optical properties, e.g. transparent electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1014—Tapered waveguide, e.g. spotsize converter
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017113389.5 | 2017-06-19 | ||
| DE102017113389.5A DE102017113389B4 (de) | 2017-06-19 | 2017-06-19 | Halbleiterlaserdiode |
| PCT/EP2018/065185 WO2018234068A1 (de) | 2017-06-19 | 2018-06-08 | Halbleiterlaserdiode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020524407A true JP2020524407A (ja) | 2020-08-13 |
| JP2020524407A5 JP2020524407A5 (enExample) | 2020-09-24 |
Family
ID=62631062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019570091A Pending JP2020524407A (ja) | 2017-06-19 | 2018-06-08 | 半導体レーザーダイオード |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US11336078B2 (enExample) |
| JP (1) | JP2020524407A (enExample) |
| CN (2) | CN114243448B (enExample) |
| DE (1) | DE102017113389B4 (enExample) |
| WO (1) | WO2018234068A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017113389B4 (de) * | 2017-06-19 | 2021-07-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode |
| CN112997407B (zh) | 2018-10-30 | 2024-05-17 | 埃赛力达加拿大有限公司 | 采用引线框架和薄介电层掩膜焊垫限定的低电感激光驱动器封装 |
| US11264778B2 (en) | 2018-11-01 | 2022-03-01 | Excelitas Canada, Inc. | Quad flat no-leads package for side emitting laser diode |
| WO2020142292A1 (en) * | 2018-12-31 | 2020-07-09 | Nlight, Inc. | Method, system, apparatus for differential current injection |
| DE102019102499A1 (de) | 2019-01-31 | 2020-08-06 | Forschungsverbund Berlin E.V. | Vorrichtung zur Erzeugung von Laserstrahlung |
| DE102019106536B4 (de) * | 2019-03-14 | 2024-11-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode und Verfahren zur Herstellung einer Halbleiterlaserdiode |
| JP7407027B2 (ja) * | 2020-03-09 | 2023-12-28 | パナソニックホールディングス株式会社 | 半導体発光素子 |
| DE102020108941B4 (de) | 2020-03-31 | 2022-05-25 | Ferdinand-Braun-Institut gGmbH, Leibniz- Institut für Höchstfrequenztechnik | Diodenlaser mit verrringerter Strahldivergenz |
| FR3109020B1 (fr) * | 2020-04-06 | 2022-02-25 | Scintil Photonics | Dispositif photonique pour etablir un rayonnement lumineux comprenant un mode optique dans un guide d'onde |
| DE102022106173A1 (de) * | 2022-03-16 | 2023-09-21 | Ams-Osram International Gmbh | Licht emittierende diode |
| DE102022110694A1 (de) | 2022-05-02 | 2023-11-02 | Ams-Osram International Gmbh | Optoelektronisches halbleiterlaserbauelement und verfahren zur herstellung eines optoelektronischen halbleiterlaserbauelements |
| FR3150347A1 (fr) * | 2023-06-22 | 2024-12-27 | Thales | Composant optoélectronique à semi-conducteur ayant une dissipation thermique améliorée |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11220212A (ja) * | 1998-02-02 | 1999-08-10 | Toshiba Corp | 光素子、光素子の駆動方法及び半導体レーザ素子 |
| JP2004031823A (ja) * | 2002-06-27 | 2004-01-29 | Furukawa Electric Co Ltd:The | 半導体レーザ装置、半導体レーザモジュールおよび光ファイバ増幅器 |
| JP2010080960A (ja) * | 2008-09-24 | 2010-04-08 | Palo Alto Research Center Inc | 半導体発光デバイス |
| JP2012044171A (ja) * | 2010-08-20 | 2012-03-01 | Chi Mei Lighting Technology Corp | 発光ダイオード構造及びその製造方法 |
| US20150194788A1 (en) * | 2012-07-24 | 2015-07-09 | Osram Opto Semiconductors Gmbh | Ridge laser |
| JP2016201474A (ja) * | 2015-04-10 | 2016-12-01 | 日本電信電話株式会社 | リッジ導波路型半導体レーザ |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6990132B2 (en) | 2003-03-20 | 2006-01-24 | Xerox Corporation | Laser diode with metal-oxide upper cladding layer |
| DE10339985B4 (de) | 2003-08-29 | 2008-12-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer transparenten Kontaktschicht und Verfahren zu dessen Herstellung |
| CN101431215A (zh) * | 2003-12-22 | 2009-05-13 | 松下电器产业株式会社 | 半导体激光装置和激光投影装置 |
| US7279751B2 (en) | 2004-06-21 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and manufacturing method thereof |
| GB2432456A (en) | 2005-11-21 | 2007-05-23 | Bookham Technology Plc | High power semiconductor laser diode |
| US8729580B2 (en) * | 2005-12-06 | 2014-05-20 | Toshiba Techno Center, Inc. | Light emitter with metal-oxide coating |
| JP5072372B2 (ja) | 2007-01-16 | 2012-11-14 | 株式会社東芝 | 遠隔監視・診断システム |
| DE102007029370A1 (de) | 2007-05-04 | 2008-11-06 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
| JP5020866B2 (ja) * | 2007-05-07 | 2012-09-05 | キヤノン株式会社 | 垂直共振器型面発光レーザ |
| JP2009088425A (ja) | 2007-10-03 | 2009-04-23 | Sony Corp | 半導体レーザおよびその製造方法 |
| DE102008014093B4 (de) * | 2007-12-27 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Kantenemittierender Halbleiterlaserchip mit zumindest einer Strombarriere |
| JP5084540B2 (ja) * | 2008-02-06 | 2012-11-28 | キヤノン株式会社 | 垂直共振器型面発光レーザ |
| KR100945993B1 (ko) * | 2008-03-06 | 2010-03-09 | 삼성전기주식회사 | 반도체 레이저 다이오드 |
| DE102008035784A1 (de) * | 2008-07-31 | 2010-02-11 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| DE102008052405A1 (de) * | 2008-10-21 | 2010-04-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| DE102009015314B4 (de) * | 2009-03-27 | 2023-04-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaservorrichtung |
| US20100327300A1 (en) | 2009-06-25 | 2010-12-30 | Koninklijke Philips Electronics N.V. | Contact for a semiconductor light emitting device |
| DE102010002966B4 (de) * | 2010-03-17 | 2020-07-30 | Osram Opto Semiconductors Gmbh | Laserdiodenanordnung und Verfahren zum Herstellen einer Laserdiodenanordnung |
| DE102011054954A1 (de) * | 2011-10-31 | 2013-05-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronischer Halbleiterlaser |
| JP6414464B2 (ja) | 2014-12-24 | 2018-10-31 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| DE102015116336B4 (de) * | 2015-09-28 | 2020-03-19 | Osram Opto Semiconductors Gmbh | Halbleiterlaser |
| DE102015116335B4 (de) | 2015-09-28 | 2024-10-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser |
| CN105811242A (zh) | 2016-04-28 | 2016-07-27 | 中国科学院长春光学精密机械与物理研究所 | 周期性金属接触增益耦合分布反馈半导体激光器 |
| DE102016125857B4 (de) | 2016-12-29 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode |
| DE102017113389B4 (de) * | 2017-06-19 | 2021-07-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode |
-
2017
- 2017-06-19 DE DE102017113389.5A patent/DE102017113389B4/de active Active
-
2018
- 2018-06-08 US US16/611,372 patent/US11336078B2/en active Active
- 2018-06-08 CN CN202111420786.9A patent/CN114243448B/zh active Active
- 2018-06-08 WO PCT/EP2018/065185 patent/WO2018234068A1/de not_active Ceased
- 2018-06-08 CN CN201880040771.XA patent/CN110770985B/zh active Active
- 2018-06-08 JP JP2019570091A patent/JP2020524407A/ja active Pending
-
2022
- 2022-04-14 US US17/720,794 patent/US11695253B2/en active Active
-
2023
- 2023-05-24 US US18/322,661 patent/US12062887B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11220212A (ja) * | 1998-02-02 | 1999-08-10 | Toshiba Corp | 光素子、光素子の駆動方法及び半導体レーザ素子 |
| JP2004031823A (ja) * | 2002-06-27 | 2004-01-29 | Furukawa Electric Co Ltd:The | 半導体レーザ装置、半導体レーザモジュールおよび光ファイバ増幅器 |
| JP2010080960A (ja) * | 2008-09-24 | 2010-04-08 | Palo Alto Research Center Inc | 半導体発光デバイス |
| JP2012044171A (ja) * | 2010-08-20 | 2012-03-01 | Chi Mei Lighting Technology Corp | 発光ダイオード構造及びその製造方法 |
| US20150194788A1 (en) * | 2012-07-24 | 2015-07-09 | Osram Opto Semiconductors Gmbh | Ridge laser |
| JP2016201474A (ja) * | 2015-04-10 | 2016-12-01 | 日本電信電話株式会社 | リッジ導波路型半導体レーザ |
Also Published As
| Publication number | Publication date |
|---|---|
| US11695253B2 (en) | 2023-07-04 |
| US11336078B2 (en) | 2022-05-17 |
| US12062887B2 (en) | 2024-08-13 |
| CN110770985A (zh) | 2020-02-07 |
| DE102017113389B4 (de) | 2021-07-29 |
| US20220239069A1 (en) | 2022-07-28 |
| DE102017113389A1 (de) | 2018-12-20 |
| CN114243448A (zh) | 2022-03-25 |
| US20230299562A1 (en) | 2023-09-21 |
| CN110770985B (zh) | 2021-12-17 |
| WO2018234068A1 (de) | 2018-12-27 |
| CN114243448B (zh) | 2024-08-02 |
| US20200161836A1 (en) | 2020-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12062887B2 (en) | Semiconductor laser diode | |
| US11626707B2 (en) | Semiconductor laser diode | |
| JP6337036B2 (ja) | 半導体レーザダイオード | |
| JP2009200478A (ja) | 半導体レーザ素子およびその製造方法 | |
| JP5377725B1 (ja) | 半導体発光素子 | |
| JP2013042107A (ja) | 半導体レーザ素子 | |
| JP7604595B2 (ja) | 半導体レーザダイオードおよび半導体レーザダイオードの製造方法 | |
| TWI586060B (zh) | 光電半導體本體及光電元件 | |
| JP5717640B2 (ja) | オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 | |
| JP5865870B2 (ja) | 半導体発光素子 | |
| US20250192521A1 (en) | Light-emitting diode | |
| JP7639043B2 (ja) | 半導体レーザーダイオード | |
| JP2010098001A (ja) | 半導体レーザ装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191218 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191218 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201223 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210201 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210427 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20211004 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220128 |
|
| C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20220128 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20220209 |
|
| C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20220216 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20220401 |
|
| C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20220412 |
|
| C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20221108 |
|
| C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20230105 |
|
| C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20230201 |
|
| C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20230201 |