JP2020522728A5 - - Google Patents

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Publication number
JP2020522728A5
JP2020522728A5 JP2019561901A JP2019561901A JP2020522728A5 JP 2020522728 A5 JP2020522728 A5 JP 2020522728A5 JP 2019561901 A JP2019561901 A JP 2019561901A JP 2019561901 A JP2019561901 A JP 2019561901A JP 2020522728 A5 JP2020522728 A5 JP 2020522728A5
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JP
Japan
Prior art keywords
flexible
layer
coated substrate
substrate according
mox
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2019561901A
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English (en)
Japanese (ja)
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JP7282688B2 (ja
JPWO2018204944A5 (enrdf_load_stackoverflow
JP2020522728A (ja
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Priority claimed from ATGM104/2017U external-priority patent/AT15574U3/de
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Publication of JP2020522728A publication Critical patent/JP2020522728A/ja
Publication of JP2020522728A5 publication Critical patent/JP2020522728A5/ja
Publication of JPWO2018204944A5 publication Critical patent/JPWO2018204944A5/ja
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Publication of JP7282688B2 publication Critical patent/JP7282688B2/ja
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JP2019561901A 2017-05-11 2018-04-19 金属層を有する層状構造を備えたフレキシブル部品 Active JP7282688B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM104/2017 2017-05-11
ATGM104/2017U AT15574U3 (de) 2017-05-11 2017-05-11 Flexibles Bauteil mit Schichtaufbau mit metallischer Lage
PCT/AT2018/000026 WO2018204944A1 (de) 2017-05-11 2018-04-19 Flexibles bauteil mit schichtaufbau mit metallischer lage

Publications (4)

Publication Number Publication Date
JP2020522728A JP2020522728A (ja) 2020-07-30
JP2020522728A5 true JP2020522728A5 (enrdf_load_stackoverflow) 2021-04-01
JPWO2018204944A5 JPWO2018204944A5 (enrdf_load_stackoverflow) 2023-02-09
JP7282688B2 JP7282688B2 (ja) 2023-05-29

Family

ID=61597295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019561901A Active JP7282688B2 (ja) 2017-05-11 2018-04-19 金属層を有する層状構造を備えたフレキシブル部品

Country Status (6)

Country Link
JP (1) JP7282688B2 (enrdf_load_stackoverflow)
KR (1) KR102557501B1 (enrdf_load_stackoverflow)
CN (1) CN110651373B (enrdf_load_stackoverflow)
AT (1) AT15574U3 (enrdf_load_stackoverflow)
TW (1) TWI793121B (enrdf_load_stackoverflow)
WO (1) WO2018204944A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018123944A1 (de) * 2018-09-27 2020-04-02 Liebherr-Hausgeräte Ochsenhausen GmbH Vakuumdämmkörper für Kühl- und/oder Gefriergeräte
CN112582479A (zh) * 2020-12-30 2021-03-30 福建华佳彩有限公司 一种顶栅结构的薄膜晶体管及制作方法
TW202318568A (zh) * 2021-07-30 2023-05-01 日商尼康股份有限公司 金屬配線的製造方法、電晶體的製造方法及金屬配線

Family Cites Families (24)

* Cited by examiner, † Cited by third party
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JP2002232142A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 多層配線基板およびその製造方法
JP2002324874A (ja) * 2001-04-25 2002-11-08 Kyocera Corp 配線基板
JP4530579B2 (ja) * 2001-05-22 2010-08-25 京セラ株式会社 半導体素子収納用パッケージ
JP4496518B2 (ja) * 2002-08-19 2010-07-07 日立金属株式会社 薄膜配線
US7547412B2 (en) * 2002-10-28 2009-06-16 A.L.M.T. Corporation Composite material, method for producing same and member using same
KR20060090523A (ko) * 2005-02-07 2006-08-11 삼성전자주식회사 표시 장치용 배선 및 상기 배선을 포함하는 박막트랜지스터 표시판
JP2007069561A (ja) * 2005-09-09 2007-03-22 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板とその製造方法
HUE052503T2 (hu) * 2007-09-12 2021-05-28 Flisom Ag Berendezés kompozit film gyártására
KR101542840B1 (ko) * 2008-09-09 2015-08-07 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 이의 제조 방법
JP5874308B2 (ja) * 2011-10-21 2016-03-02 三菱瓦斯化学株式会社 銅及びモリブデンを含む多層膜用エッチング液
CN102560383B (zh) * 2012-01-12 2013-10-23 宝鸡市科迪普有色金属加工有限公司 钼铌合金板靶材加工工艺
DE102012023260A1 (de) * 2012-11-29 2014-06-05 Oerlikon Trading Ag, Trübbach Verfahren zur Strukturierung von Schichtoberflächen und Vorrichtung dazu
KR101600169B1 (ko) * 2013-03-12 2016-03-04 히타치 긴조쿠 가부시키가이샤 전자 부품용 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재
KR102194818B1 (ko) * 2013-08-06 2020-12-24 삼성디스플레이 주식회사 플렉서블 터치 표시 패널
US20160204126A1 (en) * 2013-08-27 2016-07-14 Joled Inc. Thin-film transistor substrate and method for fabricating the same
CN103606389B (zh) * 2013-10-28 2016-11-16 中国科学院长春光学精密机械与物理研究所 高导电性无机、金属掺杂多层结构透明导电薄膜的制备方法
JP2015119175A (ja) * 2013-11-15 2015-06-25 株式会社半導体エネルギー研究所 半導体装置及び表示装置
EP2874187B1 (en) * 2013-11-15 2020-01-01 Evonik Operations GmbH Low contact resistance thin film transistor
US9544994B2 (en) * 2014-08-30 2017-01-10 Lg Display Co., Ltd. Flexible display device with side crack protection structure and manufacturing method for the same
JP6706418B2 (ja) * 2015-03-20 2020-06-10 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
JP6832634B2 (ja) * 2015-05-29 2021-02-24 株式会社半導体エネルギー研究所 半導体装置
KR102439505B1 (ko) * 2015-06-11 2022-09-02 삼성디스플레이 주식회사 박막 트랜지스터 기판
US10501003B2 (en) * 2015-07-17 2019-12-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, lighting device, and vehicle
AT15048U1 (de) * 2015-11-27 2016-11-15 Plansee Se Beschichtetes flexibles Bauteil

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