JP2020514529A - Cvdによる共形密封膜堆積 - Google Patents
Cvdによる共形密封膜堆積 Download PDFInfo
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- 238000007789 sealing Methods 0.000 title claims 2
- 230000008021 deposition Effects 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 134
- 238000000034 method Methods 0.000 claims abstract description 69
- 239000007789 gas Substances 0.000 claims abstract description 62
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 34
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 33
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims description 26
- 239000002243 precursor Substances 0.000 claims description 26
- 238000000151 deposition Methods 0.000 claims description 18
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- 238000005121 nitriding Methods 0.000 claims description 6
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims description 3
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000548 poly(silane) polymer Polymers 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 abstract description 3
- 229910021529 ammonia Inorganic materials 0.000 abstract description 2
- 238000009832 plasma treatment Methods 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 9
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- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
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- 238000007254 oxidation reaction Methods 0.000 description 3
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- 238000004140 cleaning Methods 0.000 description 2
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- 239000012530 fluid Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- 238000005339 levitation Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (15)
- 膜層を形成する方法であって、
基板処理チャンバの内部で基板を基板温度まで加熱することと、
ケイ素前駆体ガスを前記基板処理チャンバの中に流すことと、
アモルファスシリコンの層を前記基板上に堆積することと、
窒素前駆体ガスを前記基板処理チャンバの中に流すことと、
前記窒素前駆体ガスを用いて、前記基板処理チャンバの内部でプラズマを形成することと、
堆積された前記アモルファスシリコン層を前記プラズマに曝露して、堆積された前記アモルファスシリコン層の少なくとも一部を窒化ケイ素層に変換することと
を含む方法。 - 前記ケイ素前駆体ガスが、ジシラン、トリシラン、テトラシラン、又はこれらの組み合わせを含む、請求項1に記載の方法。
- 前記窒素前駆体ガスが、N2、NH3、H2N2、又はこれらの組み合わせを含み、前記窒化ケイ素層が、密封化学量論的窒化膜を含む、請求項1に記載の方法。
- 前記窒化ケイ素層の厚さが、約5Åと約30Åとの間である、請求項1に記載の方法。
- 前記基板温度が、約300℃と700℃との間である、請求項1に記載の方法。
- 前記基板を加熱することが、前記基板の第1の部分を第1の温度まで加熱し、前記基板の第2の部分を第2の温度まで加熱することを含み、前記第1の温度と前記第2の温度との間のオフセットが、約+/−10℃と約+/−50℃との間である、請求項1に記載の方法。
- 前記基板に面するプレートを約100℃と約300℃との間の温度まで加熱することをさらに含む、請求項1に記載の方法。
- 前記ケイ素前駆体ガスが、前記プレートを通して流れる、請求項7に記載の方法。
- 前記チャンバの側壁に連結された電極をバイアスさせることをさらに含み、前記電極が、共振同調回路に連結され、前記電極を通る前記電流の流れが、望ましくは、約1ampと30ampとの間に維持される、請求項1に記載の方法。
- 基板支持体に連結された第1の電極をバイアスさせることをさらに含み、前記電極が、共振同調回路に連結され、前記電極を通る前記電流の流れが、望ましくは、約1ampと30ampとの間に維持される、請求項1に記載の方法。
- 前記共振同調回路のインピーダンスを動的に調節し、前記電流の流れを制御することをさらに含む、請求項9に記載の方法。
- 前記共振同調回路のインピーダンスを動的に調節し、前記電流の流れを制御することをさらに含む、請求項10に記載の方法。
- 前記基板支持体に連結された第2の電極をバイアスさせることをさらに含み、前記第2の電極が、インピーダンス整合回路に連結されている、請求項12に記載の方法。
- 膜層を形成する方法であって、
基板処理チャンバの内部で、基板支持体上に配置された基板を約500℃未満の温度まで加熱することと、
ケイ素前駆体ガスを前記基板処理チャンバの中に流すことと、
アモルファスシリコンの層を前記基板上に堆積することと、
N2、NH3、H2N2、又はこれらの組み合わせを含む窒素前駆体ガスを前記基板処理チャンバの中に流すことと、
前記基板処理チャンバの内部で前記窒素前駆体ガスのプラズマを形成することと、
前記基板支持体に連結された第1の電極をバイアスさせることであって、前記第1の電極が、第1の共振同調回路に連結されている、第1の電極をバイアスさせることと、
前記第1の共振同調回路のインピーダンスを動的に調節し、前記第1の電極を通る前記電流の流れを制御することであって、前記電流の流れが、望ましくは、約1ampと30ampとの間の設定点に維持される、前記第1の電極を通る前記電流の流れを制御することと、
堆積された前記アモルファスシリコン層を窒化して、堆積された前記アモルファスシリコン層を窒化ケイ素層に変換することと、
前記基板処理チャンバの側壁に連結された第2の電極をバイアスさせることであって、前記第2の電極が、第2の共振同調回路に連結されている、第2の電極をバイアスさせることと、
前記第2の共振同調回路のインピーダンスを動的に調節し、前記第2の電極を通る前記電流の流れを制御することであって、前記電流の流れが、望ましくは、約1ampと30ampとの間の設定点に維持される、前記第2の電極を通る前記電流の流れを制御することと
を含む方法。 - 膜層を形成する方法であって、
基板の第1の部分を第1の温度まで加熱し、前記基板の第2の部分を第2の温度まで加熱することを含む、前記基板を約500℃未満の温度まで加熱することであって、前記第1の温度と前記第2の温度との間のオフセットが、約+/−10℃と約+/−50℃との間である、前記基板を約500℃未満の温度まで加熱すること、
ケイ素前駆体ガスを基板処理チャンバの中に流すことと、
約5Åと約30Åとの間のアモルファスシリコンの膜を前記基板上に堆積することと、
N2、NH3、H2N2、又はこれらの組み合わせを含む窒素前駆体ガスを前記基板処理チャンバの中に流すことと、
前記窒素前駆体ガスを用いてプラズマを形成することであって、前記プラズマが、前記処理チャンバの内部で形成される、プラズマを形成することと、
前記基板支持体に連結された第1の電極をバイアスさせることであって、前記第1の電極が、第1の共振同調回路に連結されている、第1の電極をバイアスさせることと、
前記第1の共振同調回路のインピーダンスを動的に調節し、前記第1の電極を通る前記電流の流れを制御することであって、前記電流の流れが、望ましくは、約1ampと30ampとの間の設定点に維持される、前記第1の電極を通る前記電流の流れを制御することと、
前記チャンバの側壁に連結された第2の電極をバイアスさせることであって、前記第2の電極が、第2の共振同調回路に連結されている、第2の電極をバイアスさせることと、
前記第2の共振同調回路のインピーダンスを動的に調節し、前記第2の電極を通る前記電流の流れを制御することであって、前記電流の流れが、望ましくは、約1ampと30ampとの間の設定点に維持される、前記第2の電極を通る前記電流の流れを制御することと、
堆積された前記アモルファスシリコン膜を密封化学量論的窒化ケイ素膜に変換することと
を含む方法。
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KR20190090047A (ko) | 2019-07-31 |
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