JP2020512691A5 - - Google Patents

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Publication number
JP2020512691A5
JP2020512691A5 JP2019552095A JP2019552095A JP2020512691A5 JP 2020512691 A5 JP2020512691 A5 JP 2020512691A5 JP 2019552095 A JP2019552095 A JP 2019552095A JP 2019552095 A JP2019552095 A JP 2019552095A JP 2020512691 A5 JP2020512691 A5 JP 2020512691A5
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JP
Japan
Prior art keywords
processing chamber
semiconductor processing
chamber component
component according
support body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019552095A
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English (en)
Japanese (ja)
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JP2020512691A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2018/023644 external-priority patent/WO2018175647A1/en
Publication of JP2020512691A publication Critical patent/JP2020512691A/ja
Publication of JP2020512691A5 publication Critical patent/JP2020512691A5/ja
Pending legal-status Critical Current

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JP2019552095A 2017-03-21 2018-03-21 高い腐食性又は浸食性の半導体処理用途に使用するためのセラミック材料アセンブリ Pending JP2020512691A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762474597P 2017-03-21 2017-03-21
US62/474,597 2017-03-21
PCT/US2018/023644 WO2018175647A1 (en) 2017-03-21 2018-03-21 Ceramic material assembly for use in highly corrosive or erosive semiconductor processing applications

Publications (2)

Publication Number Publication Date
JP2020512691A JP2020512691A (ja) 2020-04-23
JP2020512691A5 true JP2020512691A5 (https=) 2021-08-05

Family

ID=63584678

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019552095A Pending JP2020512691A (ja) 2017-03-21 2018-03-21 高い腐食性又は浸食性の半導体処理用途に使用するためのセラミック材料アセンブリ
JP2019552021A Pending JP2020514237A (ja) 2017-03-21 2018-03-21 高い腐食性又は浸食性産業用途に使用するためのセラミック材料アセンブリ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019552021A Pending JP2020514237A (ja) 2017-03-21 2018-03-21 高い腐食性又は浸食性産業用途に使用するためのセラミック材料アセンブリ

Country Status (7)

Country Link
US (2) US20180354861A1 (https=)
EP (2) EP3601803A4 (https=)
JP (2) JP2020512691A (https=)
KR (2) KR20190132425A (https=)
CN (2) CN110520628A (https=)
TW (1) TW201841869A (https=)
WO (2) WO2018175647A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10933375B1 (en) 2019-08-30 2021-03-02 Fluid Equipment Development Company, Llc Fluid to fluid pressurizer and method of operating the same
KR102261947B1 (ko) * 2020-02-12 2021-06-08 에스케이씨솔믹스 주식회사 반도체 소자를 제조하는 장비에 사용되는 세라믹 부품의 제조방법 및 세라믹 부품
CN116084876B (zh) * 2023-03-28 2024-06-25 西南石油大学 一种高耐磨且可溶的回接外筒喇叭口及密封面保护套

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