JP2020509609A5 - - Google Patents

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Publication number
JP2020509609A5
JP2020509609A5 JP2019563710A JP2019563710A JP2020509609A5 JP 2020509609 A5 JP2020509609 A5 JP 2020509609A5 JP 2019563710 A JP2019563710 A JP 2019563710A JP 2019563710 A JP2019563710 A JP 2019563710A JP 2020509609 A5 JP2020509609 A5 JP 2020509609A5
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JP
Japan
Prior art keywords
ink
silver
metal layer
conductive metal
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019563710A
Other languages
English (en)
Japanese (ja)
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JP2020509609A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2018/050790 external-priority patent/WO2018146618A1/en
Publication of JP2020509609A publication Critical patent/JP2020509609A/ja
Publication of JP2020509609A5 publication Critical patent/JP2020509609A5/ja
Pending legal-status Critical Current

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JP2019563710A 2017-02-08 2018-02-08 金属導電層の仕上げ方法 Pending JP2020509609A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762456310P 2017-02-08 2017-02-08
US62/456,310 2017-02-08
PCT/IB2018/050790 WO2018146618A1 (en) 2017-02-08 2018-02-08 Method of finishing a metallic conductive layer

Publications (2)

Publication Number Publication Date
JP2020509609A JP2020509609A (ja) 2020-03-26
JP2020509609A5 true JP2020509609A5 (https=) 2021-03-18

Family

ID=63108066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019563710A Pending JP2020509609A (ja) 2017-02-08 2018-02-08 金属導電層の仕上げ方法

Country Status (8)

Country Link
US (1) US20200010707A1 (https=)
EP (1) EP3581004A4 (https=)
JP (1) JP2020509609A (https=)
KR (1) KR20190113941A (https=)
CN (1) CN110463362A (https=)
CA (1) CA3052751A1 (https=)
TW (1) TW201842086A (https=)
WO (1) WO2018146618A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784320B (zh) * 2019-09-24 2022-11-21 美商阿爾發金屬化工公司 燒結組成物、其製造和使用方法及其用途
GB2609034A (en) * 2021-07-19 2023-01-25 Mordechai Ronen Aviv Systems and methods for additive manufacturing of electronics
EP4297540A1 (en) * 2022-06-24 2023-12-27 TE Connectivity Germany GmbH Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon
CN115321465A (zh) * 2022-07-20 2022-11-11 中国航空工业集团公司北京航空精密机械研究所 一种具有引线封装的薄膜传感器及感测系统

Family Cites Families (18)

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US4099376A (en) * 1955-06-29 1978-07-11 The B.F. Goodrich Company Gas generator and solid propellant with a silicon-oxygen compound as a burning rate modifier, and method for making the same
US5074978A (en) * 1990-02-23 1991-12-24 E. I. Du Pont De Nemours And Company Hydroxy terminated polyester additive in cathodic electrocoat compositions
AU5561696A (en) * 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
US7211205B2 (en) * 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
PL1853671T3 (pl) * 2005-03-04 2014-01-31 Inktec Co Ltd Tusze przewodzące i sposób ich wytwarzania
TWI312799B (en) * 2005-12-30 2009-08-01 Ind Tech Res Inst Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern
US7972655B2 (en) * 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
CN101271929B (zh) * 2008-05-04 2012-02-01 常州亿晶光电科技有限公司 无铅太阳能电池银浆及其制备方法
JP5388150B2 (ja) * 2009-08-26 2014-01-15 エルジー・ケム・リミテッド 導電性金属インク組成物および導電性パターンの形成方法
WO2011126706A2 (en) * 2010-04-09 2011-10-13 Henkel Corporation Printable materials and methods of manufacture thereof
KR101356810B1 (ko) * 2010-05-10 2014-01-28 주식회사 엘지화학 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법
JP6138133B2 (ja) * 2011-09-06 2017-05-31 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 導電性材料およびプロセス
CN102618033B (zh) * 2012-03-28 2013-09-11 成都多吉昌新材料有限公司 一种组合物、含该组合物的led线路板基材和制作方法
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