JP2020509609A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020509609A5 JP2020509609A5 JP2019563710A JP2019563710A JP2020509609A5 JP 2020509609 A5 JP2020509609 A5 JP 2020509609A5 JP 2019563710 A JP2019563710 A JP 2019563710A JP 2019563710 A JP2019563710 A JP 2019563710A JP 2020509609 A5 JP2020509609 A5 JP 2020509609A5
- Authority
- JP
- Japan
- Prior art keywords
- ink
- silver
- metal layer
- conductive metal
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052709 silver Inorganic materials 0.000 claims 17
- 239000004332 silver Substances 0.000 claims 17
- 238000000034 method Methods 0.000 claims 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 15
- 229910052751 metal Inorganic materials 0.000 claims 13
- 239000002184 metal Substances 0.000 claims 13
- -1 silver carboxylate Chemical class 0.000 claims 8
- 238000000576 coating method Methods 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 5
- 229920005596 polymer binder Polymers 0.000 claims 5
- 239000002491 polymer binding agent Substances 0.000 claims 5
- 229920000728 polyester Polymers 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 3
- 239000011230 binding agent Substances 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000004697 Polyetherimide Substances 0.000 claims 2
- 239000004793 Polystyrene Substances 0.000 claims 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229920001601 polyetherimide Polymers 0.000 claims 2
- 229920002223 polystyrene Polymers 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 claims 1
- YPIFGDQKSSMYHQ-UHFFFAOYSA-M 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC([O-])=O YPIFGDQKSSMYHQ-UHFFFAOYSA-M 0.000 claims 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 1
- 235000017491 Bambusa tulda Nutrition 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 240000000491 Corchorus aestuans Species 0.000 claims 1
- 235000011777 Corchorus aestuans Nutrition 0.000 claims 1
- 235000010862 Corchorus capsularis Nutrition 0.000 claims 1
- 229920000742 Cotton Polymers 0.000 claims 1
- 241000219146 Gossypium Species 0.000 claims 1
- 240000006240 Linum usitatissimum Species 0.000 claims 1
- 235000004431 Linum usitatissimum Nutrition 0.000 claims 1
- 239000004677 Nylon Substances 0.000 claims 1
- 244000082204 Phyllostachys viridis Species 0.000 claims 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 229920002334 Spandex Polymers 0.000 claims 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 claims 1
- 229940088601 alpha-terpineol Drugs 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000004760 aramid Substances 0.000 claims 1
- 229920003235 aromatic polyamide Polymers 0.000 claims 1
- 239000011425 bamboo Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000000123 paper Substances 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229920006268 silicone film Polymers 0.000 claims 1
- RQZVTOHLJOBKCW-UHFFFAOYSA-M silver;7,7-dimethyloctanoate Chemical compound [Ag+].CC(C)(C)CCCCCC([O-])=O RQZVTOHLJOBKCW-UHFFFAOYSA-M 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000004759 spandex Substances 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 210000002268 wool Anatomy 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762456310P | 2017-02-08 | 2017-02-08 | |
| US62/456,310 | 2017-02-08 | ||
| PCT/IB2018/050790 WO2018146618A1 (en) | 2017-02-08 | 2018-02-08 | Method of finishing a metallic conductive layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020509609A JP2020509609A (ja) | 2020-03-26 |
| JP2020509609A5 true JP2020509609A5 (https=) | 2021-03-18 |
Family
ID=63108066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019563710A Pending JP2020509609A (ja) | 2017-02-08 | 2018-02-08 | 金属導電層の仕上げ方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20200010707A1 (https=) |
| EP (1) | EP3581004A4 (https=) |
| JP (1) | JP2020509609A (https=) |
| KR (1) | KR20190113941A (https=) |
| CN (1) | CN110463362A (https=) |
| CA (1) | CA3052751A1 (https=) |
| TW (1) | TW201842086A (https=) |
| WO (1) | WO2018146618A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784320B (zh) * | 2019-09-24 | 2022-11-21 | 美商阿爾發金屬化工公司 | 燒結組成物、其製造和使用方法及其用途 |
| GB2609034A (en) * | 2021-07-19 | 2023-01-25 | Mordechai Ronen Aviv | Systems and methods for additive manufacturing of electronics |
| EP4297540A1 (en) * | 2022-06-24 | 2023-12-27 | TE Connectivity Germany GmbH | Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon |
| CN115321465A (zh) * | 2022-07-20 | 2022-11-11 | 中国航空工业集团公司北京航空精密机械研究所 | 一种具有引线封装的薄膜传感器及感测系统 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4099376A (en) * | 1955-06-29 | 1978-07-11 | The B.F. Goodrich Company | Gas generator and solid propellant with a silicon-oxygen compound as a burning rate modifier, and method for making the same |
| US5074978A (en) * | 1990-02-23 | 1991-12-24 | E. I. Du Pont De Nemours And Company | Hydroxy terminated polyester additive in cathodic electrocoat compositions |
| AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
| US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
| JP4964152B2 (ja) * | 2005-03-04 | 2012-06-27 | インクテック カンパニー リミテッド | 導電性インク組成物及びこの製造方法 |
| TWI312799B (en) * | 2005-12-30 | 2009-08-01 | Ind Tech Res Inst | Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern |
| US7972655B2 (en) * | 2007-11-21 | 2011-07-05 | Enthone Inc. | Anti-tarnish coatings |
| CN101271929B (zh) * | 2008-05-04 | 2012-02-01 | 常州亿晶光电科技有限公司 | 无铅太阳能电池银浆及其制备方法 |
| KR101221716B1 (ko) * | 2009-08-26 | 2013-01-11 | 주식회사 엘지화학 | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법 |
| WO2011126706A2 (en) * | 2010-04-09 | 2011-10-13 | Henkel Corporation | Printable materials and methods of manufacture thereof |
| CN102892847B (zh) * | 2010-05-10 | 2014-12-17 | Lg化学株式会社 | 导电金属油墨组合物和用于形成导电图形的方法 |
| CN104024351B (zh) * | 2011-09-06 | 2016-11-16 | 汉高知识产权控股有限责任公司 | 导电金属和方法 |
| CN102618033B (zh) * | 2012-03-28 | 2013-09-11 | 成都多吉昌新材料有限公司 | 一种组合物、含该组合物的led线路板基材和制作方法 |
| KR102675888B1 (ko) * | 2012-10-29 | 2024-06-14 | 알파 어셈블리 솔루션스 인크. | 소결 분말 |
| KR20140098922A (ko) * | 2013-01-31 | 2014-08-11 | 엘에스전선 주식회사 | 전도성 잉크 조성물 및 이로부터 전극을 형성하는 방법 |
| US9283618B2 (en) * | 2013-05-15 | 2016-03-15 | Xerox Corporation | Conductive pastes containing silver carboxylates |
| US9540734B2 (en) * | 2013-11-13 | 2017-01-10 | Xerox Corporation | Conductive compositions comprising metal carboxylates |
| WO2015192248A1 (en) * | 2014-06-19 | 2015-12-23 | National Research Council Of Canada | Molecular inks |
-
2018
- 2018-02-07 TW TW107104322A patent/TW201842086A/zh unknown
- 2018-02-08 JP JP2019563710A patent/JP2020509609A/ja active Pending
- 2018-02-08 KR KR1020197026329A patent/KR20190113941A/ko not_active Ceased
- 2018-02-08 US US16/483,282 patent/US20200010707A1/en not_active Abandoned
- 2018-02-08 CN CN201880016170.5A patent/CN110463362A/zh active Pending
- 2018-02-08 CA CA3052751A patent/CA3052751A1/en active Pending
- 2018-02-08 WO PCT/IB2018/050790 patent/WO2018146618A1/en not_active Ceased
- 2018-02-08 EP EP18750804.9A patent/EP3581004A4/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2020509609A5 (https=) | ||
| TWI468084B (zh) | Electromagnetic wave shielding material for FPC | |
| CN108754385B (zh) | 一种低熔点金属的印刷方法 | |
| CN105265029A (zh) | 柔性印刷电路板及其制造方法 | |
| KR20080108435A (ko) | 전자파 차폐막 부착 투명기재와 그 제조 방법 및 제조 장치 | |
| JP2019512561A5 (https=) | ||
| TWI609934B (zh) | 導電性墨水組合物、導電性圖案之製造方法及導電性電路 | |
| JP2014191894A (ja) | 透明導電フィルム及びタッチパネル | |
| CN104754861A (zh) | 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜 | |
| CN108770222A (zh) | 一种低熔点金属的印刷方法 | |
| CN103571275A (zh) | 导电性油墨组合物、导电性图案的制造方法及导电性电路 | |
| JP2018048324A (ja) | 透明な導電性コーティングを調製するためのエマルション | |
| Layani et al. | Printing holes by a dewetting solution enables formation of a transparent conductive film | |
| JP5282991B1 (ja) | 透明導電層付き基体及びその製造方法 | |
| US20150047883A1 (en) | Transparent conductive coatings on an elastomeric substrate | |
| US20160085326A1 (en) | Conductive laminate, touch panel and electronic device using the conductive laminate, and method for making the conductive laminate | |
| JP2020507669A5 (https=) | ||
| CN111849250A (zh) | 一种导电墨水及电子器件 | |
| CN111065684A (zh) | 导电性组合物和使用该导电性组合物的布线板 | |
| JP2008294308A (ja) | インクジェット印刷方法 | |
| CN103571366B (zh) | 一种用于提高数码打印3d效果的预涂膜及其制备方法 | |
| FI3580285T3 (fi) | Hopeamolekyylimuste alhaisella viskositeetilla ja alhaisella käsittelylämpötilalla | |
| JPWO2017018427A1 (ja) | 導電フィルムの製造方法及び導電フィルム | |
| JP2020510740A5 (https=) | ||
| CN202323401U (zh) | 预浸玻纤布的延续浸润装置 |