CN110463362A - 修饰金属导电层的方法 - Google Patents
修饰金属导电层的方法 Download PDFInfo
- Publication number
- CN110463362A CN110463362A CN201880016170.5A CN201880016170A CN110463362A CN 110463362 A CN110463362 A CN 110463362A CN 201880016170 A CN201880016170 A CN 201880016170A CN 110463362 A CN110463362 A CN 110463362A
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- CN
- China
- Prior art keywords
- silver
- ink
- metal layer
- carrier
- polymeric binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/22—Metallic printing; Printing with powdered inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
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Abstract
用于修饰导电金属层(例如,铜金属层)的方法,包括在导电金属层上涂覆分子银油墨并分解银油墨以在导电金属层上形成银金属的可焊涂层。分子银油墨包括羧酸银、载体和聚合物粘结剂。该方法是增材的且使得能够在导电金属层上有成本效益地形成银金属修饰面,其既保护导电金属层免受氧化和进一步的腐蚀,又允许用铅和无铅焊料进行焊接。
Description
技术领域
本申请涉及修饰金属导电层,特别是修饰包括可焊金属的用于印刷电路的金属导电层的方法,以及涉及在金属导电层上焊接的方法,特别是在印刷电路的生产中。
背景技术
位于印刷电路板(PCB)的顶层和底层的铜层氧化很快且表面上产生的CuO/CuO2氧化物抑制铜垫上的焊料的润湿作用。这种现象使得铜焊料层不适合于电子元件组装,因为它不能产生可接受且可靠的焊点。因此,铜需要表面修饰(surface finish)以使得PCB可用。表面修饰具有两个主要功能:第一是保护暴露的铜免受氧化;且第二是当将元件组装(焊接)到印刷电路板时提供可焊表面。存在几种PCB表面修饰且价格、可用性、保质期、可靠性以及组装工艺各异。虽然每种修饰都有其自身的优点和局限,但在大多数情况下,印刷电路板设计、应用领域(医疗、军事、航空航天、工业或其他)、环境暴露和组装工艺将决定最适合于该应用的表面修饰。
例如,可以使用浸镀锡或浸镀银工艺保护PCB的铜顶部和底部焊料层免受氧化。特别地,银浸镀是一种提供良好性能和优异表面修饰面的工艺。在银浸镀工艺中,银金属选择性地沉积在需要被焊接和被保护免受氧化和腐蚀的铜表面上。银浸镀在铜上产生平滑均匀的沉积物,其厚度为约8-15μm。绝对需要具有平坦形貌的表面修饰面来焊接高密度电路,如细间距IC、高I/O BGA和非常小的电子元件。此外,根据PCB的存储条件,浸镀银表面修饰产生6个月至12个月的可接受PCB保质期。
使用银离子或银盐溶液将实际的银浸镀表面修饰电沉积或化学镀到暴露的铜表面上。从制造的角度来看,该工艺对银盐浓度、溶液PH非常敏感,并且需要自动化工艺控制和测量以维持沉积速率和表面修饰质量。浸镀银工艺步骤是在搅拌的酸性溶液的罐中电镀板,然后超声处理并清洁所得的PCB。在这些步骤中可能发生硫污染,其对形成良好的焊点是有害的。实际工艺存在的其它问题是它使用大量的水,产生有毒废物并且必须需要水净化设施来处理工艺流出物。最后,在这些设施中工作的员工必须穿戴保护装备以确保他们的安全。
考虑到所有上述情况,需要能够形成银表面修饰面的增材方法,其既保护导电金属层又允许使用铅和无铅焊料进行焊接。这样的增材工艺将会是用银修饰可焊金属的有成本效益的方法。
发明内容
在一方面,提供了用于修饰导电金属层的方法,该方法包括:将分子银油墨涂覆在导电金属层上,该分子银油墨包括羧酸银、载体和聚合物粘结剂;以及分解银油墨以便在导电金属层上形成银金属的可焊涂层。
在另一方面,提供了用于焊接导电金属层的方法,该方法包括:将分子银油墨涂覆在导电金属层上,该分子银油墨包括羧酸银、载体和聚合物粘结剂;分解银油墨以便在导电金属层上形成银金属的可焊涂层;以及将焊料施加到涂覆在导电金属层上的可焊银金属上以形成与银金属的焊点。
在另一方面,提供了叠层材料,包括沉积在基体的表面的至少一部分上的导电金属层,该导电金属层至少部分涂覆有包括羧酸银、载体以及聚合物粘结剂的分子油墨,该聚合物粘结剂包括聚酯、聚酰亚胺、聚醚酰亚胺或其任何混合物,具有使得聚合物粘结剂与载体相容的官能团。
在另一方面,提供了羟基和/或羧基封端的聚酯作为分子油墨中的粘结剂的用途。
这些方法是增材的且使得在导电金属层上形成银金属修饰面,其既保护导电金属层又允许用铅和无铅焊料进行焊接。该方法是有成本效益的。
其它特征将在以下具体实施方式中描述或变得显而易见。应该理解,本文所述的每个特征可以与任何一种或多种其它所述特征任意组合使用,并且每个特征不一定依赖于其它特征的存在,除对本领域技术人员显而易见的情况之外。
附图说明
为了更清楚的理解,现在结合附图,通过举例的方式详述优选实施方式,其中:
图1A描绘了其上施加有焊料的镀银铜表面的示意图(左)和光学图像(右)。通过在铜表面上印刷分子银油墨然后烧结来形成银涂层。银涂层允许形成稳定且牢固的焊点。
图1B描绘了其上已施加焊料的裸铜表面的示意图(左)和光学图像(右)。根据IPCA-610,焊料不能适当润湿铜表面,导致焊点不可接受。
图2A示出了显示焊料和具有银修饰焊料的铜箔之间的金属间化合物层的截面SEM图像。
图2B和2C示出了有沿着焊料层、金属间化合物层和铜箔的原子组成的EDS分析的截面SEM图像。
具体实施方式
待修饰、或已修饰和焊接的导电金属层可以为任何物理形式,例如作为自支撑结构,诸如片材(例如箔、板)、线、球(例如滚珠)等,或作为沉积在基体上的结构,诸如薄片、迹线、柱,以及沉积在基体的至少一部分上的类似结构。在制造印刷电路板(PCB)或者其他电子结构时,导电金属层可以沉积在合适的基体上,通常以迹线的形式。导电金属层可以包括可焊金属,例如铜、金、锡、钯、铝或其合金。该方法特别可用于铜或铜合金。
合适的基体可包括例如聚对苯二甲酸乙二醇酯(PET)(例如MelinexTM)、聚烯烃(例如二氧化硅填充的聚烯烃(TeslinTM))、聚二甲基硅氧烷(PDMS)、聚苯乙烯、丙烯腈/丁二烯/苯乙烯、聚碳酸酯、聚酰亚胺(如KaptonTM)、热塑性聚氨酯(TPU)、有机硅膜、羊毛、丝绸、棉、亚麻、黄麻、莫代尔、竹子、尼龙、聚酯、丙烯酸类、芳纶、氨纶、聚丙交酯、纸、玻璃、金属、介电涂层等。
导电金属层在基体上的沉积可以通过任何合适的方法实现,例如电沉积(例如,电镀)、沉积和烧结分子油墨。刚性和柔性电路主要使用层压在表面上的纯金属箔制造,借助于胶粘剂和加热,然后蚀刻以产生所需的迹线和图案。
当导电金属层沉积或层压在刚性或柔性基体上时,可以产生在基体表面的至少一部分上包括可焊金属层的叠层材料。导电金属层优选被分子银油墨完全涂覆,因为IPC A-610标准要求在刚性或柔性电路上没有暴露的铜以防止腐蚀。
可以通过任何合适的方法将油墨涂覆在导电金属层上,例如印刷。印刷方法可以包括,例如丝网印刷、镂花印刷(stencilling)、喷墨印刷、柔版印刷、凹版印刷、胶版印刷、凸版印刷(stamp printing)、喷刷(airbrushing)、气溶胶印刷、排版或任何其他方法。该方法的一个优点是,诸如丝网印刷或镂花印刷的增材方法是特别有用的。增材涂覆方法允许使用增材制造技术,例如在印刷电路板上。
在用分子银油墨涂覆导电金属层之后,可以干燥和分解导电金属层上的油墨以在导电金属层上形成银金属涂层从而修饰导电金属层。在导电金属层上干燥和分解羧酸银形成导电金属层上的导电可焊银金属涂层。干燥和分解可以通过任何合适的技术完成,其中技术和条件依据基体类型和羧酸银的类型。例如,干燥油墨和分解羧酸银可以通过加热和/或光子烧结来完成。
在一种技术中,加热基体干燥并烧结羧酸银涂层以形成金属银。有利的是,加热可以在较高的温度范围下进行较长的时间。加热可以在约150℃或更高,或165℃或更高,或175℃或更高,或180℃或更高,或185℃或更高,或200℃或更高,或220℃或更高,或230℃或更高,或240℃或更高的温度下进行,同时产生具有良好机械性能的相对高导电性的银涂层。在一种实施方式中,温度在约200℃至约250℃的范围内。加热优选进行的时间在约1-180分钟,例如5-120分钟,或者5-60分钟的范围内。以温度和时间之间充分平衡进行加热,以烧结油墨从而形成可焊导电银涂层。油墨的改善的热稳定性允许加热更长的时间,例如高达1小时或更长。加热装置的类型也会影响烧结所需的温度和时间。可以在氧化气氛(例如空气)或惰性气氛(例如氮气和/或氩气)下对基体进行烧结。
在另一种技术中,光子烧结系统的特点可以为递送宽带光谱的高强度灯(例如脉冲氙灯)。该灯可以向迹线递送约5-30J/cm2的能量。脉冲宽度优选在约0.58-1.5ms的范围内。光子烧结可以在环境条件下(例如在空气中)进行。光子烧结特别适用于当使用聚对苯二甲酸乙二醇酯或聚酰亚胺时。
在其中导电金属迹线是电断开连接的或者其中其他元件有待添加的基体上,迹线和电子元件之间的互连可以通过使用可焊表面修饰面和焊料制成。焊接在银油墨被烧结成银膜之后进行。有利的是,分子银油墨配制有聚合物粘结剂,其对导电金属层具有优异的粘附性,且在施加焊料时能够承受较高温度。因此,分子银油墨可以产生光滑的导电银迹线,这是恰当形成焊点所期望的。当对印刷电路板采取增材制造技术时,能够生成牢固焊点是特别有用的。分子银油墨提供了生成牢固焊料互连的银修饰面。焊接的元件已显示出可接受的剪切强度,且印刷的迹线和特征的粘附力不受焊接工艺的影响。使用无铅焊接工艺和印刷在导电金属表面上的分子油墨产生的互连的导电性已经使用剪切力设备测量,并且后者显示出比使用导电环氧树脂制成的互连好得多的剪切力结果。使用分子油墨和无铅焊料制成的互连的导电性与使用通过电沉积或电镀产生的表面修饰面和相同焊接工艺制成的互连的导电性相当。
用于将元件附接到印刷电路板的焊接技术在本领域中通常是已知的,并且利用诸如焊料、焊铁、焊剂、焊料芯和焊剂清洁剂的工具。虽然可以使用铅基焊料(例如锡/铅焊料(例如60Sn/40Pb或63Sn/37Pb),但通常优选无铅焊料(例如SAC305(96.5Sn/3Ag/0.5Cu))。无铅焊料可含有锡、铜、银、铋、铟、锌、锑和痕量的其它金属。焊料通常在约90℃至450℃的范围内熔化,例如约200℃至约300℃。对于电子焊接,使用松香焊料代替酸性芯焊料。所使用的焊接工艺的温度优选不超过260℃,因为该温度是电子互连工业遵循的IPC标准中推荐用于无铅印刷电路板和元件的最高温度。
修饰的基体或修饰并焊接的基体可以并入到电子器件中,例如电路(例如印刷电路板(PCB))、导电母线(例如用于光伏电池)、传感器(例如触摸式传感器、穿戴式传感器)、天线(例如RFID天线)、薄膜晶体管、二极管、智能包装(例如智能药品包装)、设备和/或车辆中的适形插件,以及多层电路和MIM器件,包括低通滤波器、频率选择表面、晶体管和可承受高温的适形表面上的天线。
分子银油墨包括羧酸银、溶剂和聚合物粘结剂。
羧酸银包含银离子和含有羧酸部分的有机基团。羧酸盐优选包括1至20个碳原子,更优选6至15个碳原子,甚至更优选8至12个碳原子,例如10个碳原子。羧酸盐优选为链烷酸盐。羧酸银优选是链烷酸的银盐。优选的羧酸银的一些非限制性实例为乙基己酸银、新癸酸银、苯甲酸银、苯基乙酸银、异丁酰乙酸银、苯甲酰乙酸银、草酸银、新戊酸银以及其衍生物,及其任何混合物。尤其优选新癸酸银。油墨中可以有一种或多于一种的羧酸银。羧酸银优选分散在油墨中。优选地,油墨不含有金属银材料的薄片或其它颗粒。
羧酸银优选以一定量存在于油墨中以在油墨中提供基于油墨总重量的约19wt%或更高的银负载量。更优选地,羧酸银提供的银负载量为约23wt%或更高,约24wt%或更高,或者约25wt%或更高,或者约27wt%或更高,或者约31wt%或更高,或者约32wt%或更高。当羧酸银是新癸酸银时,新癸酸银可以优选以基于油墨总重量的约50wt%或更高,或者约60wt%或更高,或者约65wt%或更高,或者约70wt%或更高,或者约80wt%或更高的量存在于油墨中。
载体优选与银盐或聚合物粘结剂之一或二者相容。载体优选与银盐和聚合物粘结剂二者都相容。银盐和/或聚合物粘结剂优选可分散,例如可溶解于载体中。载体优选为溶剂。溶剂优选为有机溶剂,更优选为非芳香族有机溶剂。非芳香族有机溶剂包括,例如萜烯(例如萜烯醇)、二醇醚(例如二丙二醇甲醚)、醇(例如甲基环己醇、辛醇、庚醇)、卡必醇(例如2-(2-乙氧基乙氧基)乙醇)或其任何混合物。溶剂优选包括萜烯,更优选萜烯醇。萜烯醇可包括单萜醇、倍半萜烯醇等。优选单萜醇,例如萜品醇、香叶醇等。特别优选萜品醇,例如α-萜品醇、β-萜品醇、γ-萜品醇和萜品烯-4-醇。尤其优选的是α-萜品醇。
载体可以以任何合适的量存在于油墨中,优选范围为基于油墨总重量的约1wt%至约50wt%。更优选地,量的范围为约5wt%至约50wt%,或者约10wt%至约40wt%。
聚合物粘结剂优选包括聚醚、聚酰亚胺、聚醚酰亚胺、聚酯(诸如例如乙基纤维素)或其任何混合物。在一种实施方式中,聚合物粘结剂包括聚酯、聚酰亚胺、聚醚酰亚胺或其任何混合物。聚合物粘结剂可具有使聚合物粘结剂与载体相容的官能团。优选地,聚合物粘结剂可分散,例如可溶解于载体中。因此,载体中的聚合物粘结剂混合物不会产生明显的相分离。使得聚合物粘结剂与载体相容的官能团优选为能够形成氢键的极性基团,例如羟基、羧基、氨基以及磺酰基的一种或多种。优选地,聚合物粘结剂包括末端羟基和/或羧基基团。在一种实施方式中,聚合物粘结剂优选包括聚酯,其具有使得聚酯与载体相容的官能团。更优选地,聚合物粘结剂包括羟基和/或羧基封端的聚酯。
聚合物粘结剂可以以任何合适的量存在于油墨中,优选范围为基于油墨总重量的约0.1wt%至约5wt%。更优选地,量的范围为约0.5wt%至约3wt%,或者约1wt%至约2wt%。
在一种实施方式中,分子油墨由羧酸银、载体以及包括羟基和/或羧基封端的聚酯的聚合物粘结剂组成。
实施例:
实施例1:具有聚酯粘结剂的新癸酸银油墨
如表1所述配制新癸酸银(AgND)基油墨(I1)。通过将所有组分合并并在全体混合器中混合直至溶液均匀来制备油墨。
表1
<u>油墨组分</u> | <u>油墨I1</u> |
新癸酸银(wt%) | 60 |
Rokrapol<sup>TM</sup>7075(wt%) | 1.6 |
萜品醇(wt%) | 38.4 |
参照图1A和图1B,将银油墨层镂花印刷在沉积在KaptonTMHPP-ST的片材1上的35μm厚铜箔3的第一部分上。在氮气下使用表2中所述的加热程序于从230℃变化的回流温度(T)下15分钟(样品温度),对镂花印刷的迹线进行热烧结,以在铜箔3上产生银层4。所列温度为通过附接于KaptonTM基体的热电偶测得的温度。
表2
将焊膏5施加到层4上(图1A),并直接施加到铜箔3上(图1B)。使用5mil厚的型版,将无铅、免清洗且无卤素的焊膏(LoctiteTMGC10SAC305T4 885V 52U)施加到铜镀膜上。使用表3中所述的温度程序使焊料回流。所列温度为通过附接于KaptonTM基体的热电偶测得的温度。
表3
<u>区</u> | <u>温度</u> | <u>时间,秒</u> |
预热 | 50℃ | 40 |
浸泡 | 150℃ | 140 |
回流 | 230℃ | 90 |
冷却 | 30℃ | 60 |
如图1A中的光学图像(右)所示,银涂层使得形成了稳定且牢固的焊点。相反,如图1B中的右侧光学图像所示,焊料没有恰当润湿铜表面,导致了按照IPC A-610标准不可接受的焊点。使用银分子油墨作为表面修饰面的这一优点也反映在铜箔与含有银修饰面的铜箔相比,其中的焊料接触角的差异。如表4中所强调的,当铜箔上存在银修饰面时,焊料接触角明显更低(13°与24°)。此外,当铜箔上存在银修饰面时,焊料形状保持性也更好(表4)。
表4.在铜箔和具有银修饰面的铜箔上焊料的接触角和形状保持性
油墨 | 接触角 | 形状保持性 |
Cu箔对照(无Ag) | 28 | 一般 |
具有银修饰面的Cu箔 | 13 | 优异 |
实施例2:银修饰的铜箔上的焊点的表征
将银分子油墨的4μm表面修饰面印刷到Kapton上的35μm铜箔层上。随后将焊料(SAC305)沉积在所得银修饰面的表面上,并如上所述在回流炉中加工。有有力的视觉证据表明回流后在铜箔和焊料之间形成了金属间化合物(图2A)。SAC 305的元素组成为96.5%Sn(锡)、3.0%Ag(银)和0.5%Cu(铜),并且所得焊点的部分具有与SAC305类似的元素组成(i、ii、iii和iv)。还有证据表明形成了如图2B)和2C)中突出显示的金属间化合物层,其中,如通过按照EDS分析的铜箔中锡的存在所证明,来自SAC 305焊料的锡已经扩散到铜箔中(v、vi和vii)。此外,焊料层中铜(viii、ix、x)和银(xi和xii)的相对比例高于SAC305本身的,这再次表明形成了金属间化合物。Sn扩散到铜层中并且Cu/Ag扩散到焊料中有助于在焊料和铜箔之间形成牢固的粘结,并因此在电路和待附接的电子元件之间形成牢固的粘结。
实施例3:具有乙基纤维素粘结剂的新癸酸银油墨
将涂覆有层压在带上的压敏胶粘剂的铜箔置于聚酰亚胺膜(DuPont,Kapton TM)上。然后用异丙醇清洁铜箔。在铜的顶部印刷包含52.1wt%(g/g)新癸酸银,4.2wt%(g/g)乙基纤维素,12wt%(g/g)辛醇和35.9wt%(g/g)二乙基苯的油墨。将样品在250℃下烧结15分钟。将无铅Multicore LoctiteTM粘性助焊膏涂在镀银铜上。将发光二极管(LED)放置在镀银铜上,并使用SAC305芯焊丝通过将无铅焊接头加热到400至425℃并使焊丝回流至最低焊接温度230℃来焊接3秒。在该步骤中,基体和元件的最高温度分别为260℃和250℃。用异丙醇清洁该区域。通过施加3V来测试LED。用剪切测试(IEC 62137-2)测试互连,并使用IPC-A-610 2级进行检查。剪切粘结测试显示粘结强度为10磅。
在阅读说明书后,新颖性特征对于本领域技术人员而言将变得显而易见。然而,应该理解,权利要求的范围不应受实施方式的限制,而应给予与权利要求的措辞和整个说明书一致的最广泛的解释。
Claims (22)
1.一种用于修饰导电金属层的方法,所述方法包括:将分子银油墨涂覆在所述导电金属层上,所述分子银油墨包括羧酸银、载体和聚合物粘结剂;以及分解所述银油墨以便在所述导电金属层上形成银金属的可焊涂层。
2.一种用于在导电金属层上焊接的方法,所述方法包括:将分子银油墨涂覆在所述导电金属层上,所述分子银油墨包括羧酸银、载体和聚合物粘结剂;分解所述银油墨以便在所述导电金属层上形成银金属的可焊涂层;以及将焊料施加到涂覆在所述导电金属层上的可焊银金属上以形成与所述银金属的焊点。
3.根据权利要求1或2所述的方法,其中,所述导电金属层包括铜、金、锡、钯、铝或其合金。
4.根据权利要求1至3中任一项所述的方法,其中,所述聚合物粘结剂包括聚酯、聚酰亚胺、聚醚酰亚胺、聚醚或其任何混合物。
5.根据权利要求1至4中任一项所述的方法,其中,所述聚合物粘结剂包括使所述聚合物粘结剂与所述载体相容的官能团。
6.根据权利要求1至3中任一项所述的方法,其中,所述聚合物粘结剂包括羟基和/或羧基封端的聚酯。
7.根据权利要求1至6中任一项所述的方法,其中,所述油墨中的所述羧酸银的量提供了所述油墨中银负载量为基于所述油墨总重量的约19wt%或更高。
8.根据权利要求1至6中任一项所述的方法,其中,所述油墨中的所述羧酸银的量提供了所述油墨中银负载量为基于所述油墨总重量的约24wt%或更高。
9.根据权利要求1至8中任一项所述的方法,其中,所述羧酸银包括新癸酸银。
10.根据权利要求9所述的方法,其中,新癸酸银以基于所述油墨总重量的约60wt%或更多的量存在于所述油墨中。
11.根据权利要求9所述的方法,其中,新癸酸银以基于所述油墨总重量的约80wt%或更多的量存在于所述油墨中。
12.根据权利要求1至11中任一项所述的方法,其中,所述聚合物粘结剂以基于所述油墨总重量的约0.1wt%至约5wt%的量存在于所述油墨中。
13.根据权利要求1至12中任一项所述的方法,其中,所述载体包括有机溶剂。
14.根据权利要求13所述的方法,其中,所述溶剂包括α-萜品醇。
15.根据权利要求1至14中任一项所述的方法,其中,所述载体以范围为基于所述油墨总重量的约1wt%至约50wt%的量存在于所述油墨中。
16.根据权利要求1至14中任一项所述的方法,其中,所述载体以范围为基于所述油墨总重量的约10wt%至约40wt%的量存在于所述油墨中。
17.根据权利要求1至16中任一项所述的方法,其中,所述导电金属层沉积在基体上。
18.根据权利要求17所述的方法,其中,所述基体包括聚对苯二甲酸乙二醇酯、聚烯烃、聚二甲基硅氧烷、聚苯乙烯、丙烯腈/丁二烯/苯乙烯、聚碳酸酯、聚酰亚胺、热塑性聚氨酯、有机硅膜、羊毛、丝绸、棉、亚麻、黄麻、莫代尔、竹子、尼龙、聚酯、丙烯酸类、芳纶、氨纶、聚丙交酯、纸、玻璃、金属或介电涂层。
19.根据权利要求1至18中任一项所述的方法,其中,将所述分子银油墨涂覆在所述导电金属层上包括印刷。
20.根据权利要求19所述的方法,其中,所述印刷包括丝网印刷或镂花印刷。
21.根据权利要求1至20中任一项所述的方法,其中,分解所述分子银油墨包括烧结所述分子银油墨。
22.一种叠层材料,包括沉积在基体的表面的至少一部分上的导电金属层,所述导电金属层至少部分地涂覆有分子油墨,所述分子油墨包括羧酸银、载体以及聚合物粘结剂,所述聚合物粘结剂包括聚酯、聚酰亚胺、聚醚酰亚胺或其任何混合物,具有使得所述聚合物粘结剂与所述载体相容的官能团。
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Publication number | Publication date |
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EP3581004A4 (en) | 2020-12-23 |
TW201842086A (zh) | 2018-12-01 |
KR20190113941A (ko) | 2019-10-08 |
JP2020509609A (ja) | 2020-03-26 |
EP3581004A1 (en) | 2019-12-18 |
WO2018146618A1 (en) | 2018-08-16 |
CA3052751A1 (en) | 2018-08-16 |
US20200010707A1 (en) | 2020-01-09 |
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