CN110463362A - 修饰金属导电层的方法 - Google Patents

修饰金属导电层的方法 Download PDF

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Publication number
CN110463362A
CN110463362A CN201880016170.5A CN201880016170A CN110463362A CN 110463362 A CN110463362 A CN 110463362A CN 201880016170 A CN201880016170 A CN 201880016170A CN 110463362 A CN110463362 A CN 110463362A
Authority
CN
China
Prior art keywords
silver
ink
metal layer
conductive metal
polymeric binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880016170.5A
Other languages
English (en)
Chinese (zh)
Inventor
西尔维·拉夫雷尼
巴瓦纳·代奥雷
尚塔尔·帕凯
阿诺德·J·凯尔
帕特里克·罗兰·卢西恩·马朗方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Council of Canada
E2IP Technologies Inc
Original Assignee
National Research Council of Canada
Groupe Graham International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council of Canada, Groupe Graham International Inc filed Critical National Research Council of Canada
Publication of CN110463362A publication Critical patent/CN110463362A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/22—Metallic printing; Printing with powdered inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/104—Polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201880016170.5A 2017-02-08 2018-02-08 修饰金属导电层的方法 Pending CN110463362A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762456310P 2017-02-08 2017-02-08
US62/456,310 2017-02-08
PCT/IB2018/050790 WO2018146618A1 (en) 2017-02-08 2018-02-08 Method of finishing a metallic conductive layer

Publications (1)

Publication Number Publication Date
CN110463362A true CN110463362A (zh) 2019-11-15

Family

ID=63108066

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880016170.5A Pending CN110463362A (zh) 2017-02-08 2018-02-08 修饰金属导电层的方法

Country Status (8)

Country Link
US (1) US20200010707A1 (https=)
EP (1) EP3581004A4 (https=)
JP (1) JP2020509609A (https=)
KR (1) KR20190113941A (https=)
CN (1) CN110463362A (https=)
CA (1) CA3052751A1 (https=)
TW (1) TW201842086A (https=)
WO (1) WO2018146618A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115321465A (zh) * 2022-07-20 2022-11-11 中国航空工业集团公司北京航空精密机械研究所 一种具有引线封装的薄膜传感器及感测系统

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784320B (zh) * 2019-09-24 2022-11-21 美商阿爾發金屬化工公司 燒結組成物、其製造和使用方法及其用途
GB2609034A (en) * 2021-07-19 2023-01-25 Mordechai Ronen Aviv Systems and methods for additive manufacturing of electronics
EP4297540A1 (en) * 2022-06-24 2023-12-27 TE Connectivity Germany GmbH Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074978A (en) * 1990-02-23 1991-12-24 E. I. Du Pont De Nemours And Company Hydroxy terminated polyester additive in cathodic electrocoat compositions
CN1188589A (zh) * 1996-04-18 1998-07-22 国际商业机器公司 铜表面保护用有机－金属复合涂料
US20040144958A1 (en) * 2003-01-29 2004-07-29 Conaghan Brian F. High conductivity inks with improved adhesion
CN101271929A (zh) * 2008-05-04 2008-09-24 常州亿晶光电科技有限公司 无铅太阳能电池银浆及其制备方法
CN101925553A (zh) * 2007-11-21 2010-12-22 恩索恩公司 防失光泽性涂料
WO2011126706A2 (en) * 2010-04-09 2011-10-13 Henkel Corporation Printable materials and methods of manufacture thereof
CN102618033A (zh) * 2012-03-28 2012-08-01 成都多吉昌新材料有限公司 一种组合物、含该组合物的led线路板基材和制作方法
KR20140098922A (ko) * 2013-01-31 2014-08-11 엘에스전선 주식회사 전도성 잉크 조성물 및 이로부터 전극을 형성하는 방법
CN104024351A (zh) * 2011-09-06 2014-09-03 汉高知识产权控股有限责任公司 导电金属和方法
US20140342083A1 (en) * 2013-05-15 2014-11-20 Xerox Corporation Conductive pastes containing silver carboxylates
US20150132476A1 (en) * 2013-11-13 2015-05-14 Xerox Corporation Conductive compositions comprising metal carboxylates
CN104736483A (zh) * 2012-10-29 2015-06-24 阿尔法金属公司 烧结粉末

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US4099376A (en) * 1955-06-29 1978-07-11 The B.F. Goodrich Company Gas generator and solid propellant with a silicon-oxygen compound as a burning rate modifier, and method for making the same
JP4964152B2 (ja) * 2005-03-04 2012-06-27 インクテック カンパニー リミテッド 導電性インク組成物及びこの製造方法
TWI312799B (en) * 2005-12-30 2009-08-01 Ind Tech Res Inst Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern
KR101221716B1 (ko) * 2009-08-26 2013-01-11 주식회사 엘지화학 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법
CN102892847B (zh) * 2010-05-10 2014-12-17 Lg化学株式会社 导电金属油墨组合物和用于形成导电图形的方法
WO2015192248A1 (en) * 2014-06-19 2015-12-23 National Research Council Of Canada Molecular inks

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074978A (en) * 1990-02-23 1991-12-24 E. I. Du Pont De Nemours And Company Hydroxy terminated polyester additive in cathodic electrocoat compositions
CN1188589A (zh) * 1996-04-18 1998-07-22 国际商业机器公司 铜表面保护用有机－金属复合涂料
US20040144958A1 (en) * 2003-01-29 2004-07-29 Conaghan Brian F. High conductivity inks with improved adhesion
CN101925553A (zh) * 2007-11-21 2010-12-22 恩索恩公司 防失光泽性涂料
CN101271929A (zh) * 2008-05-04 2008-09-24 常州亿晶光电科技有限公司 无铅太阳能电池银浆及其制备方法
WO2011126706A2 (en) * 2010-04-09 2011-10-13 Henkel Corporation Printable materials and methods of manufacture thereof
CN104024351A (zh) * 2011-09-06 2014-09-03 汉高知识产权控股有限责任公司 导电金属和方法
CN102618033A (zh) * 2012-03-28 2012-08-01 成都多吉昌新材料有限公司 一种组合物、含该组合物的led线路板基材和制作方法
CN104736483A (zh) * 2012-10-29 2015-06-24 阿尔法金属公司 烧结粉末
KR20140098922A (ko) * 2013-01-31 2014-08-11 엘에스전선 주식회사 전도성 잉크 조성물 및 이로부터 전극을 형성하는 방법
US20140342083A1 (en) * 2013-05-15 2014-11-20 Xerox Corporation Conductive pastes containing silver carboxylates
US20150132476A1 (en) * 2013-11-13 2015-05-14 Xerox Corporation Conductive compositions comprising metal carboxylates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115321465A (zh) * 2022-07-20 2022-11-11 中国航空工业集团公司北京航空精密机械研究所 一种具有引线封装的薄膜传感器及感测系统

Also Published As

Publication number Publication date
EP3581004A4 (en) 2020-12-23
WO2018146618A1 (en) 2018-08-16
TW201842086A (zh) 2018-12-01
EP3581004A1 (en) 2019-12-18
CA3052751A1 (en) 2018-08-16
KR20190113941A (ko) 2019-10-08
JP2020509609A (ja) 2020-03-26
US20200010707A1 (en) 2020-01-09

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Application publication date: 20191115