JP2020503674A - 半導体処理のための円錐形ウエハセンタリングおよび保持装置 - Google Patents
半導体処理のための円錐形ウエハセンタリングおよび保持装置 Download PDFInfo
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- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45523—Pulsed gas flow or change of composition over time
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Abstract
Description
Claims (20)
- 半導体システムであって、
チャンバと、
前記チャンバ内に配置されているペデスタルであって、基板の中央部分を支持するための中央領域を有するペデスタルと、
前記ペデスタルの前記中央領域を囲むよう構成されているフォーカスリングであって、前記フォーカスリングの内側部分と前記フォーカスリングの外側部分との間に広がる環状支持領域を有するフォーカスリングと、前記環状支持領域は、水平線に対してある角度で配置され、前記環状支持領域は、前記中央領域および前記環状支持領域の上に存在する際に前記基板にナイフエッジ接触を提供すること、
を備える、システム。 - 請求項1に記載のシステムであって、前記フォーカスリングの前記環状支持領域は、1度〜25度の範囲の角度で配置される、システム。
- 請求項1に記載のシステムであって、前記フォーカスリングの前記環状支持領域は、1度〜15度の範囲の角度で配置される、システム。
- 請求項1に記載のシステムであって、前記フォーカスリングの前記環状支持領域は、5度〜10度の範囲の角度で配置される、システム。
- 請求項1に記載のシステムであって、前記環状支持領域は、1〜32Raの範囲の表面粗さを有する、システム。
- 請求項1に記載のシステムであって、前記環状支持領域は、2〜15Raの範囲の表面粗さを有する、システム。
- 請求項1に記載のシステムであって、前記フォーカスリングは、金属材料、誘電材料、または、コーティングされた材料で構成されている、システム。
- 請求項1に記載のシステムであって、前記フォーカスリングは、アルミニウムまたはステンレス鋼で構成されている、システム。
- 請求項1に記載のシステムであって、前記フォーカスリングは、アルミナ(Al2O3)またはイットリア(Y2O3)で構成されている、システム。
- 半導体システムであって、
チャンバと、
前記チャンバ内に配置されているポケットペデスタルであって、基板の中央部分を支持するための中央領域と、前記中央領域を囲む環状フォーカス領域と、前記中央領域から前記環状フォーカス領域まで広がる環状傾斜領域とを有するポケットペデスタルと、前記環状傾斜領域は、前記中央領域および前記環状傾斜領域の上に存在する際に前記基板にナイフエッジ接触を提供する環状支持を規定すること、
を備える、システム。 - 請求項10に記載のシステムであって、前記環状傾斜領域は、円錐形構成を有する、システム。
- 請求項10に記載のシステムであって、前記ポケットペデスタルの前記環状傾斜領域は、水平線に対して1度〜25度の範囲の角度で配置される、システム。
- 請求項10に記載のシステムであって、前記ポケットペデスタルの前記環状傾斜領域は、水平線に対して1度〜15度の範囲の角度で配置される、システム。
- 請求項10に記載のシステムであって、前記ポケットペデスタルの前記環状傾斜領域は、水平線に対して5度〜10度の範囲の角度で配置される、システム。
- 請求項10に記載のシステムであって、前記環状傾斜領域は、1〜32Raの範囲の表面粗さを有する、システム。
- 請求項10に記載のシステムであって、前記環状傾斜領域は、2〜15Raの範囲の表面粗さを有する、システム。
- 半導体システムであって、
チャンバと、
前記チャンバ内に配置されているペデスタルであって、基板の中央部分を支持するための中央領域と、前記中央領域を囲む外周領域とを有するペデスタルと、前記外周領域は、前記中央領域から一段下がっており、
前記ペデスタルの前記中央領域を囲むよう構成されているフォーカスリングであって、前記ペデスタルの前記外周領域の上に配置され、前記フォーカスリングの内側部分と前記フォーカスリングの外側部分との間に広がる環状支持領域を有するフォーカスリングと、前記環状支持領域は、水平線に対して1度〜15度の範囲の角度で配置され、前記環状支持領域は、2〜15Raの範囲の表面粗さを有し、前記環状支持領域は、前記中央領域および前記環状支持領域の上に存在する際に前記基板にナイフエッジ接触を提供すること、
を備える、システム。 - 請求項17に記載のシステムであって、前記フォーカスリングの前記環状支持領域と、存在する時の前記基板との間の前記ナイフエッジ接触は、裏面蒸着を低減するのに十分な程度まで前記ウエハの裏面へのガス化学物質のアクセスをシーリングして防止する、システム。
- 請求項17に記載のシステムであって、前記フォーカスリングの前記環状支持領域は、水平線に対して5度〜10度の範囲の角度で配置される、システム。
- 請求項17に記載のシステムであって、前記フォーカスリングは、アルミニウム、ステンレス鋼、アルミナ(Al2O3)、および、イットリア(Y2O3)からなる群より選択された材料で構成されている、システム。
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US15/385,813 | 2016-12-20 | ||
US15/385,813 US10655224B2 (en) | 2016-12-20 | 2016-12-20 | Conical wafer centering and holding device for semiconductor processing |
PCT/US2017/066870 WO2018118718A1 (en) | 2016-12-20 | 2017-12-15 | Conical wafer centering and holding device for semiconductor processing |
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JP2020503674A true JP2020503674A (ja) | 2020-01-30 |
JP7171573B2 JP7171573B2 (ja) | 2022-11-15 |
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US (1) | US10655224B2 (ja) |
JP (1) | JP7171573B2 (ja) |
KR (1) | KR102514879B1 (ja) |
CN (1) | CN110114866A (ja) |
TW (1) | TW201836047A (ja) |
WO (1) | WO2018118718A1 (ja) |
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US10655224B2 (en) * | 2016-12-20 | 2020-05-19 | Lam Research Corporation | Conical wafer centering and holding device for semiconductor processing |
US10950483B2 (en) * | 2017-11-28 | 2021-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for fixed focus ring processing |
KR20190092154A (ko) | 2018-01-30 | 2019-08-07 | 삼성전자주식회사 | 반도체 설비의 실링 장치 및 기류 산포 제어 장치 |
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US20180171473A1 (en) | 2018-06-21 |
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TW201836047A (zh) | 2018-10-01 |
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