JP2020184607A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- H01J37/32—Gas-filled discharge tubes
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- H01J37/32—Gas-filled discharge tubes
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- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4402—Reduction of impurities in the source gas
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
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- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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Abstract
Description
一実施形態によれば、前記曲面が上に膨らんでいるように曲がるように提供されることができる。
また、本発明はプラズマで基板を処理しながら、発生される不純物がプラズマ発生部に流れ込まれることを最小化することができる。
図3は本発明の基板処理設備を概略的に示す図面である。図3を参照すれば、基板処理設備1は設備前方端部モジュール(equipment front end module、EFEM)20及び処理モジュール30を有する。設備前方端部モジュール20と処理モジュール30は一方向に配置される。
排気部600は工程処理部200の内部のプラズマ及び不純物を吸入できるように提供される。排気部600は排気ライン602及び減圧部材604を含むことができる。排気ライン602はハウジング210の底面に形成された排気ホール214と連結される。また、排気ライン602は減圧を提供する減圧部材604と連結される。したがって、減圧部材604は処理空間212に減圧を提供することができる。減圧部材604はポンプである。減圧部材604は処理空間212に残留するプラズマ及び不純物をハウジング210の外部へ排出する。また、減圧部材604は処理空間212の圧力を既設定された圧力に維持するように減圧を提供することができる。
210 ハウジング
230 支持ユニット
240 バッフル
300 スキャター
310 プレート
330 衝突ブロック
400 プラズマ発生部
600 排気部
Claims (12)
- 基板を処理する装置において、
内部に処理空間が形成されるハウジングと、
前記処理空間で基板を支持する支持ユニットと、
前記支持ユニットの上部に位置され、前記処理空間にプラズマを供給するプラズマ発生ユニットと、
前記支持ユニットと前記プラズマ発生ユニットとの間に配置され、前記プラズマが通過されるバッフルと、
前記バッフルの上部に配置され、前記プラズマと不純物を分離するスキャター(Scatter)と、を含み、
前記スキャターは、
上部から見る時、中央領域に第1開口が形成されたプレートと、
前記開口の上部に前記第1開口と対向されるように配置され、前記プラズマ発生ユニットから供給される前記プラズマ及び前記不純物と衝突する衝突ブロックと、を含む基板処理装置。 - 前記プレートには上部から見る時、縁領域に第2開口が形成される請求項1に記載の基板処理装置。
- 前記第2開口は、
上部から見る時、前記弧形状を有する請求項2に記載の基板処理装置。 - 前記第2開口は、
複数に提供され、
上部から見る時、前記プレートの円周方向に沿って互いに離隔されて提供される請求項2に記載の基板処理装置。 - 前記第1開口と前記第2開口との間は、ブロッキング(Blocking)領域に提供される請求項3又は請求項4に記載の基板処理装置。
- 前記ハウジングの底面には前記処理空間を排気する排気ホールが形成され、
前記排気ホールは、
上部から見る時、前記第2開口と重畳されるように形成されるか、或いは前記第2開口より外側に形成される請求項2に記載の基板処理装置。 - 前記衝突ブロックは、衝突部を含み、
前記衝突部は、
その終端面から見た時、上端が中心から外側に行くほど下向傾いた形状を有する請求項1乃至請求項4の中でいずれか一つの項に記載の基板処理装置。 - 前記衝突ブロックは、案内部を含み、
前記案内部は、前記第1開口に挿入される請求項1乃至請求項4の中でいずれか一つの項に記載の基板処理装置。 - 前記案内部は、
その終端面から見た時、下端が外側から中心に行くほど、下向傾いた形状を有する請求項8に記載の基板処理装置。 - 前記衝突ブロックは、
その終端面から見た時、上部が平らな形状を有する請求項1乃至請求項4の中でいずれか一つの項に記載の基板処理装置。 - 前記バッフルは、
複数のホールが形成され、
その終端面から見た時、上部面と下部面を具備し、
前記上部面は、曲面に形成される請求項1乃至請求項4の中でいずれか一つの項に記載の基板処理装置。 - 前記曲面が上に膨らんでいるように曲がるように提供される請求項11に記載の基板処理装置。
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KR1020190050677A KR102187121B1 (ko) | 2019-04-30 | 2019-04-30 | 기판 처리 장치 |
KR10-2019-0050677 | 2019-04-30 |
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JP6923889B2 JP6923889B2 (ja) | 2021-08-25 |
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KR (1) | KR102187121B1 (ja) |
CN (1) | CN111863580B (ja) |
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KR102586680B1 (ko) * | 2021-08-25 | 2023-10-12 | 피에스케이 주식회사 | 기판 처리 장치 |
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- 2019-04-30 KR KR1020190050677A patent/KR102187121B1/ko active IP Right Grant
- 2019-10-08 JP JP2019185060A patent/JP6923889B2/ja active Active
- 2019-10-09 TW TW108136627A patent/TWI712340B/zh active
- 2019-10-09 US US16/597,305 patent/US11139152B2/en active Active
- 2019-10-11 SG SG10201909553YA patent/SG10201909553YA/en unknown
- 2019-12-16 CN CN201911292410.7A patent/CN111863580B/zh active Active
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KR102187121B1 (ko) | 2020-12-07 |
US20200350147A1 (en) | 2020-11-05 |
SG10201909553YA (en) | 2020-11-27 |
US11139152B2 (en) | 2021-10-05 |
CN111863580B (zh) | 2023-08-08 |
KR20200126704A (ko) | 2020-11-09 |
JP6923889B2 (ja) | 2021-08-25 |
CN111863580A (zh) | 2020-10-30 |
TW202042597A (zh) | 2020-11-16 |
TWI712340B (zh) | 2020-12-01 |
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