JP2020175412A - レーザリフトオフ用装置及びレーザリフトオフ方法 - Google Patents

レーザリフトオフ用装置及びレーザリフトオフ方法 Download PDF

Info

Publication number
JP2020175412A
JP2020175412A JP2019079138A JP2019079138A JP2020175412A JP 2020175412 A JP2020175412 A JP 2020175412A JP 2019079138 A JP2019079138 A JP 2019079138A JP 2019079138 A JP2019079138 A JP 2019079138A JP 2020175412 A JP2020175412 A JP 2020175412A
Authority
JP
Japan
Prior art keywords
laser
stage
lens
slit
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019079138A
Other languages
English (en)
Japanese (ja)
Inventor
良勝 柳川
Yoshikatsu Yanagawa
良勝 柳川
貴文 平野
Takafumi Hirano
貴文 平野
下浦　厚志
Atsushi Shimoura
厚志 下浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
V Technology Co Ltd
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Priority to JP2019079138A priority Critical patent/JP2020175412A/ja
Priority to PCT/JP2020/012968 priority patent/WO2020213352A1/ja
Priority to KR1020217037125A priority patent/KR20210154188A/ko
Priority to CN202080029126.5A priority patent/CN113710409A/zh
Priority to TW109112582A priority patent/TW202106432A/zh
Publication of JP2020175412A publication Critical patent/JP2020175412A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)
JP2019079138A 2019-04-18 2019-04-18 レーザリフトオフ用装置及びレーザリフトオフ方法 Pending JP2020175412A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019079138A JP2020175412A (ja) 2019-04-18 2019-04-18 レーザリフトオフ用装置及びレーザリフトオフ方法
PCT/JP2020/012968 WO2020213352A1 (ja) 2019-04-18 2020-03-24 レーザリフトオフ用装置及びレーザリフトオフ方法
KR1020217037125A KR20210154188A (ko) 2019-04-18 2020-03-24 레이저 리프트 오프용 장치 및 레이저 리프트 오프 방법
CN202080029126.5A CN113710409A (zh) 2019-04-18 2020-03-24 激光剥离用装置和激光剥离方法
TW109112582A TW202106432A (zh) 2019-04-18 2020-04-15 雷射剝離用裝置及雷射剝離方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019079138A JP2020175412A (ja) 2019-04-18 2019-04-18 レーザリフトオフ用装置及びレーザリフトオフ方法

Publications (1)

Publication Number Publication Date
JP2020175412A true JP2020175412A (ja) 2020-10-29

Family

ID=72837258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019079138A Pending JP2020175412A (ja) 2019-04-18 2019-04-18 レーザリフトオフ用装置及びレーザリフトオフ方法

Country Status (5)

Country Link
JP (1) JP2020175412A (ko)
KR (1) KR20210154188A (ko)
CN (1) CN113710409A (ko)
TW (1) TW202106432A (ko)
WO (1) WO2020213352A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220088051A (ko) * 2020-12-18 2022-06-27 주식회사 원익아이피에스 기판처리모듈, 이를 포함하는 기판처리장치 및 기판처리방법
JP7492478B2 (ja) 2021-03-23 2024-05-29 株式会社東海理化電機製作所 レーザリフトオフ装置およびレーザリフトオフ方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113284989A (zh) * 2021-06-21 2021-08-20 北京火龙果科学仪器有限公司 一种Micro LED芯片剥离装置、剥离机及剥离机使用方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015166759A1 (ja) * 2014-05-02 2015-11-05 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
JP2015199094A (ja) * 2014-04-08 2015-11-12 ウシオ電機株式会社 レーザリフトオフ装置
JP2017117815A (ja) * 2015-12-21 2017-06-29 スタンレー電気株式会社 半導体発光装置、及び半導体発光装置の製造方法
WO2018211928A1 (ja) * 2017-05-16 2018-11-22 株式会社ブイ・テクノロジー レーザアニール装置及びレーザアニール方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045901A (ja) * 2001-08-01 2003-02-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
CN101911256B (zh) * 2008-01-07 2012-07-18 株式会社Ihi 激光退火方法以及装置
JP5878330B2 (ja) 2011-10-18 2016-03-08 株式会社ディスコ レーザー光線の出力設定方法およびレーザー加工装置
TW201539624A (zh) * 2014-04-08 2015-10-16 Ushio Electric Inc 雷射剝離裝置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015199094A (ja) * 2014-04-08 2015-11-12 ウシオ電機株式会社 レーザリフトオフ装置
WO2015166759A1 (ja) * 2014-05-02 2015-11-05 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
JP2017117815A (ja) * 2015-12-21 2017-06-29 スタンレー電気株式会社 半導体発光装置、及び半導体発光装置の製造方法
WO2018211928A1 (ja) * 2017-05-16 2018-11-22 株式会社ブイ・テクノロジー レーザアニール装置及びレーザアニール方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220088051A (ko) * 2020-12-18 2022-06-27 주식회사 원익아이피에스 기판처리모듈, 이를 포함하는 기판처리장치 및 기판처리방법
KR102691950B1 (ko) * 2020-12-18 2024-08-05 주식회사 원익아이피에스 기판처리모듈, 이를 포함하는 기판처리장치 및 기판처리방법
JP7492478B2 (ja) 2021-03-23 2024-05-29 株式会社東海理化電機製作所 レーザリフトオフ装置およびレーザリフトオフ方法

Also Published As

Publication number Publication date
KR20210154188A (ko) 2021-12-20
WO2020213352A1 (ja) 2020-10-22
CN113710409A (zh) 2021-11-26
TW202106432A (zh) 2021-02-16

Similar Documents

Publication Publication Date Title
WO2020213352A1 (ja) レーザリフトオフ用装置及びレーザリフトオフ方法
JP3929084B2 (ja) 未処理製品の表面を照射する方法
JP7307001B2 (ja) レーザ加工装置および方法、チップ転写装置および方法
JP2013000752A (ja) レーザー加工装置
KR102231739B1 (ko) 레이저 광선의 검사 방법
CN103506758A (zh) 激光加工装置
KR20130029719A (ko) 레이저 가공 장치
JP2019147191A (ja) レーザー加工領域の確認装置及び確認方法
JP6632203B2 (ja) レーザー加工装置及びレーザー加工方法
JP2020533173A (ja) 金属マスク生産装置
JP7175457B2 (ja) レーザ加工装置、レーザ加工方法及び成膜マスクの製造方法
KR101918203B1 (ko) 레이저 처리 장치 및 방법
JP6788182B2 (ja) レーザ加工装置及びレーザ加工方法
JP2017064745A (ja) レーザー加工装置及びレーザー加工方法
JP2006007257A (ja) レーザ加工装置
JP2016111315A (ja) レーザー加工装置及びレーザー加工方法
JP6552948B2 (ja) ウエーハの加工方法、及び加工装置
JP7475211B2 (ja) レーザー加工装置の検査方法
JP2021169102A (ja) レーザリフトオフ装置及びレーザリフトオフ方法
JP6625928B2 (ja) レーザー加工装置
JP2021082769A (ja) チップ分離装置
KR101725168B1 (ko) 레이저 조사 장치
KR102035020B1 (ko) 미세 패턴 정밀 가공 장치
TW202240682A (zh) 晶圓之加工方法及晶圓之加工裝置
JP2004317904A (ja) 光ビーム生成装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220202

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230411

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231010