JP2020167181A5 - - Google Patents

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Publication number
JP2020167181A5
JP2020167181A5 JP2019063313A JP2019063313A JP2020167181A5 JP 2020167181 A5 JP2020167181 A5 JP 2020167181A5 JP 2019063313 A JP2019063313 A JP 2019063313A JP 2019063313 A JP2019063313 A JP 2019063313A JP 2020167181 A5 JP2020167181 A5 JP 2020167181A5
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JP
Japan
Prior art keywords
layer
electronic device
heat diffusion
diffusion layer
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019063313A
Other languages
English (en)
Japanese (ja)
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JP2020167181A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019063313A priority Critical patent/JP2020167181A/ja
Priority claimed from JP2019063313A external-priority patent/JP2020167181A/ja
Priority to CN202080023587.1A priority patent/CN113632218A/zh
Priority to PCT/JP2020/010547 priority patent/WO2020195834A1/ja
Publication of JP2020167181A publication Critical patent/JP2020167181A/ja
Publication of JP2020167181A5 publication Critical patent/JP2020167181A5/ja
Priority to US17/484,337 priority patent/US20220013428A1/en
Pending legal-status Critical Current

Links

JP2019063313A 2019-03-28 2019-03-28 電子装置 Pending JP2020167181A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019063313A JP2020167181A (ja) 2019-03-28 2019-03-28 電子装置
CN202080023587.1A CN113632218A (zh) 2019-03-28 2020-03-11 电子装置
PCT/JP2020/010547 WO2020195834A1 (ja) 2019-03-28 2020-03-11 電子装置
US17/484,337 US20220013428A1 (en) 2019-03-28 2021-09-24 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019063313A JP2020167181A (ja) 2019-03-28 2019-03-28 電子装置

Publications (2)

Publication Number Publication Date
JP2020167181A JP2020167181A (ja) 2020-10-08
JP2020167181A5 true JP2020167181A5 (enExample) 2021-03-25

Family

ID=72611428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019063313A Pending JP2020167181A (ja) 2019-03-28 2019-03-28 電子装置

Country Status (4)

Country Link
US (1) US20220013428A1 (enExample)
JP (1) JP2020167181A (enExample)
CN (1) CN113632218A (enExample)
WO (1) WO2020195834A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7056620B2 (ja) * 2019-03-28 2022-04-19 株式会社デンソー 電子装置
JP2024153459A (ja) * 2023-04-17 2024-10-29 株式会社デンソー 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269676B2 (en) * 2012-10-04 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced package-on-package (PoP)
US20140133105A1 (en) * 2012-11-09 2014-05-15 Nvidia Corporation Method of embedding cpu/gpu/logic chip into a substrate of a package-on-package structure
KR102134133B1 (ko) * 2013-09-23 2020-07-16 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
KR20150049622A (ko) * 2013-10-30 2015-05-08 삼성전자주식회사 패키지 온 패키지 장치
CN103560090B (zh) * 2013-10-31 2016-06-15 中国科学院微电子研究所 一种用于PoP封装的散热结构的制作方法
CN104064551B (zh) * 2014-06-05 2018-01-16 华为技术有限公司 一种芯片堆叠封装结构和电子设备
KR102327548B1 (ko) * 2017-10-17 2021-11-16 삼성전자주식회사 반도체 패키지

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