CN113632218A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN113632218A
CN113632218A CN202080023587.1A CN202080023587A CN113632218A CN 113632218 A CN113632218 A CN 113632218A CN 202080023587 A CN202080023587 A CN 202080023587A CN 113632218 A CN113632218 A CN 113632218A
Authority
CN
China
Prior art keywords
layer
electronic device
diffusion layer
package
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202080023587.1A
Other languages
English (en)
Chinese (zh)
Inventor
国枝大佳
林宏树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN113632218A publication Critical patent/CN113632218A/zh
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
CN202080023587.1A 2019-03-28 2020-03-11 电子装置 Withdrawn CN113632218A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-063313 2019-03-28
JP2019063313A JP2020167181A (ja) 2019-03-28 2019-03-28 電子装置
PCT/JP2020/010547 WO2020195834A1 (ja) 2019-03-28 2020-03-11 電子装置

Publications (1)

Publication Number Publication Date
CN113632218A true CN113632218A (zh) 2021-11-09

Family

ID=72611428

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080023587.1A Withdrawn CN113632218A (zh) 2019-03-28 2020-03-11 电子装置

Country Status (4)

Country Link
US (1) US20220013428A1 (enExample)
JP (1) JP2020167181A (enExample)
CN (1) CN113632218A (enExample)
WO (1) WO2020195834A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113632227A (zh) * 2019-03-28 2021-11-09 株式会社电装 电子装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024153459A (ja) * 2023-04-17 2024-10-29 株式会社デンソー 半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103560090A (zh) * 2013-10-31 2014-02-05 中国科学院微电子研究所 一种用于PoP封装的散热结构的制作方法
CN103715153A (zh) * 2012-10-04 2014-04-09 台湾积体电路制造股份有限公司 热增强型堆叠封装（PoP）
CN103811356A (zh) * 2012-11-09 2014-05-21 辉达公司 将cpu/gpu/逻辑芯片嵌入堆叠式封装结构的衬底的方法
CN104064551A (zh) * 2014-06-05 2014-09-24 华为技术有限公司 一种芯片堆叠封装结构和电子设备
US20150115467A1 (en) * 2013-10-30 2015-04-30 Kyol PARK Package-on-package device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102134133B1 (ko) * 2013-09-23 2020-07-16 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
KR102327548B1 (ko) * 2017-10-17 2021-11-16 삼성전자주식회사 반도체 패키지

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103715153A (zh) * 2012-10-04 2014-04-09 台湾积体电路制造股份有限公司 热增强型堆叠封装（PoP）
CN103811356A (zh) * 2012-11-09 2014-05-21 辉达公司 将cpu/gpu/逻辑芯片嵌入堆叠式封装结构的衬底的方法
US20150115467A1 (en) * 2013-10-30 2015-04-30 Kyol PARK Package-on-package device
CN103560090A (zh) * 2013-10-31 2014-02-05 中国科学院微电子研究所 一种用于PoP封装的散热结构的制作方法
CN104064551A (zh) * 2014-06-05 2014-09-24 华为技术有限公司 一种芯片堆叠封装结构和电子设备
US20150357307A1 (en) * 2014-06-05 2015-12-10 Huawei Technologies Co., Ltd. Chip stacked package structure and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113632227A (zh) * 2019-03-28 2021-11-09 株式会社电装 电子装置

Also Published As

Publication number Publication date
US20220013428A1 (en) 2022-01-13
JP2020167181A (ja) 2020-10-08
WO2020195834A1 (ja) 2020-10-01

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WW01 Invention patent application withdrawn after publication

Application publication date: 20211109

WW01 Invention patent application withdrawn after publication