JP2020155467A - 基板処理装置、および、基板処理方法 - Google Patents
基板処理装置、および、基板処理方法 Download PDFInfo
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- JP2020155467A JP2020155467A JP2019049944A JP2019049944A JP2020155467A JP 2020155467 A JP2020155467 A JP 2020155467A JP 2019049944 A JP2019049944 A JP 2019049944A JP 2019049944 A JP2019049944 A JP 2019049944A JP 2020155467 A JP2020155467 A JP 2020155467A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019049944A JP2020155467A (ja) | 2019-03-18 | 2019-03-18 | 基板処理装置、および、基板処理方法 |
| TW108147037A TWI745806B (zh) | 2019-03-18 | 2019-12-20 | 基板處理裝置以及基板處理方法 |
| PCT/JP2020/001265 WO2020188980A1 (ja) | 2019-03-18 | 2020-01-16 | 基板処理装置、および、基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019049944A JP2020155467A (ja) | 2019-03-18 | 2019-03-18 | 基板処理装置、および、基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2020155467A true JP2020155467A (ja) | 2020-09-24 |
Family
ID=72519216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019049944A Pending JP2020155467A (ja) | 2019-03-18 | 2019-03-18 | 基板処理装置、および、基板処理方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2020155467A (zh) |
| TW (1) | TWI745806B (zh) |
| WO (1) | WO2020188980A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022201953A1 (ja) * | 2021-03-23 | 2022-09-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、基板処理システムおよび基板処理方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102565731B1 (ko) * | 2020-11-16 | 2023-08-17 | (주)에스티아이 | 포드 세정챔버 |
| JP2022125560A (ja) * | 2021-02-17 | 2022-08-29 | 東京エレクトロン株式会社 | 膜厚測定装置、成膜システム及び膜厚測定方法 |
| CN115890456A (zh) * | 2022-12-29 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | 抛光液提供装置、抛光设备和抛光方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873804A (ja) * | 1981-10-28 | 1983-05-04 | Hitachi Ltd | シリコンウエハエツチング部厚さ測定方法及び装置 |
| JP2002323303A (ja) * | 2001-04-26 | 2002-11-08 | Denso Corp | 膜厚測定方法、測定装置及び半導体装置の製造方法 |
| JP2012004294A (ja) * | 2010-06-16 | 2012-01-05 | Shibaura Mechatronics Corp | 基板処理装置および基板処理方法 |
| JP2015088619A (ja) * | 2013-10-30 | 2015-05-07 | 株式会社Ｓｃｒｅｅｎホールディングス | 犠牲膜除去方法および基板処理装置 |
-
2019
- 2019-03-18 JP JP2019049944A patent/JP2020155467A/ja active Pending
- 2019-12-20 TW TW108147037A patent/TWI745806B/zh active
-
2020
- 2020-01-16 WO PCT/JP2020/001265 patent/WO2020188980A1/ja active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873804A (ja) * | 1981-10-28 | 1983-05-04 | Hitachi Ltd | シリコンウエハエツチング部厚さ測定方法及び装置 |
| JP2002323303A (ja) * | 2001-04-26 | 2002-11-08 | Denso Corp | 膜厚測定方法、測定装置及び半導体装置の製造方法 |
| JP2012004294A (ja) * | 2010-06-16 | 2012-01-05 | Shibaura Mechatronics Corp | 基板処理装置および基板処理方法 |
| JP2015088619A (ja) * | 2013-10-30 | 2015-05-07 | 株式会社Ｓｃｒｅｅｎホールディングス | 犠牲膜除去方法および基板処理装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022201953A1 (ja) * | 2021-03-23 | 2022-09-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、基板処理システムおよび基板処理方法 |
| TWI796175B (zh) * | 2021-03-23 | 2023-03-11 | 日商斯庫林集團股份有限公司 | 基板處理裝置、基板處理系統以及基板處理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202036699A (zh) | 2020-10-01 |
| TWI745806B (zh) | 2021-11-11 |
| WO2020188980A1 (ja) | 2020-09-24 |
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