JP2020129687A - 三次元成形回路部品 - Google Patents

三次元成形回路部品 Download PDF

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Publication number
JP2020129687A
JP2020129687A JP2020080976A JP2020080976A JP2020129687A JP 2020129687 A JP2020129687 A JP 2020129687A JP 2020080976 A JP2020080976 A JP 2020080976A JP 2020080976 A JP2020080976 A JP 2020080976A JP 2020129687 A JP2020129687 A JP 2020129687A
Authority
JP
Japan
Prior art keywords
resin
thin film
resin thin
dimensional molded
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020080976A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020129687A5 (https=
Inventor
遊佐　敦
Atsushi Yusa
敦 遊佐
智史 山本
Tomohito Yamamoto
智史 山本
朗子 鬼頭
Akiko Kito
朗子 鬼頭
寛紀 太田
Hiroki Ota
寛紀 太田
英斗 後藤
Hideto Goto
英斗 後藤
直樹 臼杵
Naoki Usuki
直樹 臼杵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Maxell Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxell Holdings Ltd filed Critical Maxell Holdings Ltd
Priority to JP2020080976A priority Critical patent/JP2020129687A/ja
Publication of JP2020129687A publication Critical patent/JP2020129687A/ja
Publication of JP2020129687A5 publication Critical patent/JP2020129687A5/ja
Priority to JP2022090639A priority patent/JP7370421B2/ja
Pending legal-status Critical Current

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  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Molding Of Porous Articles (AREA)
JP2020080976A 2020-05-01 2020-05-01 三次元成形回路部品 Pending JP2020129687A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020080976A JP2020129687A (ja) 2020-05-01 2020-05-01 三次元成形回路部品
JP2022090639A JP7370421B2 (ja) 2020-05-01 2022-06-03 三次元成形回路部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020080976A JP2020129687A (ja) 2020-05-01 2020-05-01 三次元成形回路部品

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016089522A Division JP2017199803A (ja) 2016-04-27 2016-04-27 三次元成形回路部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022090639A Division JP7370421B2 (ja) 2020-05-01 2022-06-03 三次元成形回路部品

Publications (2)

Publication Number Publication Date
JP2020129687A true JP2020129687A (ja) 2020-08-27
JP2020129687A5 JP2020129687A5 (https=) 2021-01-21

Family

ID=72175016

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020080976A Pending JP2020129687A (ja) 2020-05-01 2020-05-01 三次元成形回路部品
JP2022090639A Active JP7370421B2 (ja) 2020-05-01 2022-06-03 三次元成形回路部品

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022090639A Active JP7370421B2 (ja) 2020-05-01 2022-06-03 三次元成形回路部品

Country Status (1)

Country Link
JP (2) JP2020129687A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7524013B2 (ja) 2020-09-24 2024-07-29 株式会社小糸製作所 発光モジュール

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358986A (ja) * 1986-08-29 1988-03-14 日立化成工業株式会社 平面アンテナ用基板
JPH0335584A (ja) * 1989-06-30 1991-02-15 Aichi Electric Co Ltd 立体配線回路基板の製造方法
JPH06334338A (ja) * 1993-05-25 1994-12-02 Hitachi Cable Ltd 放熱体一体型回路成形体の製造方法
WO2000059274A1 (en) * 1999-03-26 2000-10-05 Mitsubishi Plastics, Inc. Method for manufacturing three-dimensional printed wiring board
JP2002185099A (ja) * 2000-12-18 2002-06-28 Multi:Kk プリント回路板及びその製造方法
JP2003234557A (ja) * 2002-02-12 2003-08-22 Toray Eng Co Ltd 電子部品埋込み実装用基板の製造方法
JP2006517738A (ja) * 2003-02-07 2006-07-27 松下電器産業株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2007281189A (ja) * 2006-04-06 2007-10-25 Matsushita Electric Works Ltd 金属ベース回路板及びその製造方法、実装部品、モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102646U (https=) * 1977-12-28 1979-07-19
JP3498937B2 (ja) * 1997-05-08 2004-02-23 三井化学株式会社 樹脂基板およびその製造方法
JP2000244077A (ja) 1999-02-24 2000-09-08 Matsushita Electric Ind Co Ltd 樹脂成形基板と電子部品組み込み樹脂成形基板
JP2007067042A (ja) 2005-08-30 2007-03-15 Matsushita Electric Ind Co Ltd 基板の製造方法
EP2506301A2 (en) 2011-03-31 2012-10-03 Yamaichi Electronics Co., Ltd. Luminous-body flexible board and luminous device
JP2013084822A (ja) 2011-10-11 2013-05-09 Hitachi Metals Ltd セラミックス回路基板用素材およびセラミックス回路基板の製造方法
WO2015059967A1 (ja) 2013-10-24 2015-04-30 住友電気工業株式会社 放熱性回路基板及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358986A (ja) * 1986-08-29 1988-03-14 日立化成工業株式会社 平面アンテナ用基板
JPH0335584A (ja) * 1989-06-30 1991-02-15 Aichi Electric Co Ltd 立体配線回路基板の製造方法
JPH06334338A (ja) * 1993-05-25 1994-12-02 Hitachi Cable Ltd 放熱体一体型回路成形体の製造方法
WO2000059274A1 (en) * 1999-03-26 2000-10-05 Mitsubishi Plastics, Inc. Method for manufacturing three-dimensional printed wiring board
JP2002185099A (ja) * 2000-12-18 2002-06-28 Multi:Kk プリント回路板及びその製造方法
JP2003234557A (ja) * 2002-02-12 2003-08-22 Toray Eng Co Ltd 電子部品埋込み実装用基板の製造方法
JP2006517738A (ja) * 2003-02-07 2006-07-27 松下電器産業株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2007281189A (ja) * 2006-04-06 2007-10-25 Matsushita Electric Works Ltd 金属ベース回路板及びその製造方法、実装部品、モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7524013B2 (ja) 2020-09-24 2024-07-29 株式会社小糸製作所 発光モジュール

Also Published As

Publication number Publication date
JP2022126684A (ja) 2022-08-30
JP7370421B2 (ja) 2023-10-27

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