JP2020111781A - 表面処理装置 - Google Patents
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- JP2020111781A JP2020111781A JP2019002872A JP2019002872A JP2020111781A JP 2020111781 A JP2020111781 A JP 2020111781A JP 2019002872 A JP2019002872 A JP 2019002872A JP 2019002872 A JP2019002872 A JP 2019002872A JP 2020111781 A JP2020111781 A JP 2020111781A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1621—Protection of inner surfaces of the apparatus
- C23C18/1626—Protection of inner surfaces of the apparatus through mechanical processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
Description
1.1 表面処理装置300の構成
まず、図1および図2を用いて、本発明の表面処理装置300の構成について説明する。なお、図1は、表面処理装置300を上方から見た配置図である。図2は、図1に示す表面処理装置300をα方向から見た側面図である。なお、図1では、図2に示す搬送用ハンガー16および搬送機構18は省略している。
図5に、液噴出部4の構造を示す。図5は、図3に示す液噴出部4の拡大図である。
図9などを用いて、表面処理装置300において行われる各工程の内容について説明する。なお、この実施形態では、表面処理装置300の各槽内で使用される処理液Qは、各槽の循環ポンプ50によって常時循環されていることとする。
図14を用いて、処理室内にて、空気を上から下に流す機構を備えた表面処理装置410について説明する。
上記実施形態では、各処理室内に膜形成機構110を設けた場合について説明したが、第3実施形態では、図19に示すように、膜形成機構110を表面処理装置400のロード側およびアンロード側にそれぞれ前槽303、後槽315を設け、そこに膜形成機構110を採用している。膜形成機構110については、上記実施形態と同じであるので説明は省略する。なお、この場合は前槽303、後槽315とも、水膜を採用すればよい。
上記各実施形態では、膜形成機構110をほぼ水平に設けたが、この場合、形成された液体膜113a、113bは、自由落下した液体の表面張力の影響によって、下方に進むにすれて中央方向に寄ってしまう(図21A参照)。かかる問題を解決するために、図21Bに示すように、中央に向かって膜形成機構110a、110bを、傾けて配置すればよい。これにより、形成された液体膜113a、113bの隙間が少なくなる。
上記第1、第2実施形態においては、膜形成機構110を、各処理室内の入口と出口付近に2カ所配置したが、図22に示すように各処理室の間に1つ設けるようにしてもよい。これにより、膜形成機構110の数を少なくできるとともに、全ての膜形成機構から水を噴出させればよくなる。また、形成された液体膜により、滴の混入が確実に防止できるので、その分だけ、各処理室の長さを短くすることができる。
10・・・・・・・・板状ワーク
110・・・・・・・膜形成機構
113a、b・・・・・液体膜
Claims (13)
- シート状の被処理物が鉛直方向に保持された状態で搬入される第1の処理室、
前記第1の処理室に設けられ、前記搬入された被処理物の上部から前記鉛直方向に保持された被処理物の表面領域に、第1の処理液を掛け流す第1の処理液掛け流し機構、
前記第1の処理室に隣接し、前記被処理物が鉛直方向に保持された状態で搬入される第2の処理室、
前記第2の処理室に設けられ、前記搬入された被処理物の上部から前記鉛直方向に保持された被処理物の表面領域に、第2の処理液を掛け流す第2の処理液掛け流し機構、
前記第1の処理室と前記第2の処理室との間に設けられた区分け壁であって、前記被処理物が鉛直方向に保持された状態で搬入可能とする搬入可能開口部を有する区分け壁、
を備え、
前記第1の処理室の第1の処理液掛け流し機構と、前記第2の処理室の第2の処理液掛け流し機構との間に、前記被処理物が搬入される方向に直交する面上を重力方向に沿って薄い層状の液体膜を形成させる膜形成機構を設けたこと、
を特徴とする表面処理装置。 - 請求項1の表面処理装置において、
前記膜形成機構は、前記搬入可能開口部近傍の前記第1の処理室または前記第2の処理室内に設けられていること、
を特徴とする表面処理装置。 - 請求項1または請求項2の表面処理装置において、
前記シート状の被処理物の2つの平面に沿って、鉛直方向に空気が流れるように制御する空気流量制御機構、
を有することを特徴とする表面処理装置。 - 請求項1〜3のいずれかの表面処理装置において、
前記液体膜は、当該処理室において前記シート状の被処理物に掛け流すのと同じ液体で構成されていること、
を特徴とする表面処理装置。 - 請求項1〜4のいずれかの表面処理装置において、
前記液体膜は、前記搬入可能開口部よりも狭い膜開口部を有すること、
を特徴とする表面処理装置。 - 請求項5の表面処理装置において、
前記膜開口部は、前記シート状の被処理物を保持する保持部の幅よりも広いこと、
を特徴とする表面処理装置。 - 請求項1〜6のいずれかの表面処理装置において、
前記シート状の被処理物の厚みが40μm以下であること、
を特徴とする表面処理装置。 - 請求項1〜7のいずれかの表面処理装置において、
前記膜開口部は、一対の排出部が離れて配置することで形成されていること、
を特徴とする表面処理装置。 - 請求項8の表面処理装置において、
前記一対の排出部が、前記膜開口部に向くようにななめ方向に前記液を排出すること、
を特徴とする表面処理装置。 - 請求項1〜9のいずれかの表面処理装置において、
搬入可能開口部よりも広く間隔の空いた案内板であって、前記液体膜を案内する案内板を有すること、
を特徴とする表面処理装置。 - 請求項3の表面処理装置において、
前記空気流量制御機構は空気吸入口を有しており、前記の空気吸入口と前記被処理物との距離を調整する高さ調整機構を有すること、
を有することを特徴とする表面処理装置。 - シート状の被処理物が鉛直方向に保持された状態で搬入される処理室が搬入可能開口部を介して複数、連続して配置されており、前記各処理室では、搬入された被処理物に対して、前記鉛直方向に保持された被処理物の表面領域の上部から所定の処理液が掛け流され、これにより、前記被処理物の表面に所定の表面処理がなされる表面処理装置において、
前記処理室のうち、入口側の処理室の搬入可能開口部の内側、および/または出口側の処理室の搬入可能開口部の内側に、前記被処理物が搬入される方向に直交する面上を重力方向に沿って薄い層状の液体膜を形成させる膜形成機構を設けたこと、
を特徴とする表面処理装置 - 請求項12の表面処理装置において、
前記各処理室は、前記シート状の被処理物の2つの平面に沿って、鉛直方向に空気が流れるように制御する空気流量制御機構、
を有することを特徴とする表面処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2019002872A JP6793762B2 (ja) | 2019-01-10 | 2019-01-10 | 表面処理装置 |
TW108140677A TWI826578B (zh) | 2019-01-10 | 2019-11-08 | 表面處理裝置 |
KR1020190164398A KR20200087069A (ko) | 2019-01-10 | 2019-12-11 | 표면 처리 장치 |
CN201911355641.8A CN111424268B (zh) | 2019-01-10 | 2019-12-25 | 表面处理装置 |
US16/727,390 US11001928B2 (en) | 2019-01-10 | 2019-12-26 | Surface treating apparatus |
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JP2019002872A JP6793762B2 (ja) | 2019-01-10 | 2019-01-10 | 表面処理装置 |
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US (1) | US11001928B2 (ja) |
JP (1) | JP6793762B2 (ja) |
KR (1) | KR20200087069A (ja) |
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KR102278629B1 (ko) * | 2019-07-22 | 2021-07-19 | 세메스 주식회사 | 기판 처리 장치 |
JP2023086328A (ja) * | 2021-12-10 | 2023-06-22 | 上村工業株式会社 | 表面処理装置 |
US11673158B1 (en) * | 2022-02-16 | 2023-06-13 | Jon Kyle Lavender | Method and apparatus for coating a drinking straw |
CN116988051B (zh) * | 2023-09-27 | 2023-12-22 | 圆周率半导体(南通)有限公司 | 一种优异的化学沉铜设备及其沉铜方法 |
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JP2007036268A (ja) * | 2002-07-22 | 2007-02-08 | Yoshitake Ito | 基板処理方法及び基板処理装置 |
JP4677216B2 (ja) * | 2004-10-25 | 2011-04-27 | アルメックスPe株式会社 | 平板形状物の表面処理装置 |
JP2009272401A (ja) * | 2008-05-02 | 2009-11-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US8677807B2 (en) * | 2011-07-18 | 2014-03-25 | Korea Institute Of Industrial Technology | Micro viscometer |
JP5986848B2 (ja) * | 2012-08-27 | 2016-09-06 | 上村工業株式会社 | 表面処理装置 |
JP2014088600A (ja) * | 2012-10-31 | 2014-05-15 | C Uyemura & Co Ltd | 表面処理装置 |
JP2016108598A (ja) * | 2014-12-04 | 2016-06-20 | イビデン株式会社 | 表面処理装置および表面処理方法 |
JP6403739B2 (ja) * | 2016-09-27 | 2018-10-10 | 上村工業株式会社 | 表面処理装置 |
JP6470724B2 (ja) * | 2016-10-11 | 2019-02-13 | 上村工業株式会社 | 表面処理装置 |
JP6568838B2 (ja) * | 2016-10-18 | 2019-08-28 | 上村工業株式会社 | 乾燥装置 |
JP6391652B2 (ja) * | 2016-11-02 | 2018-09-19 | 上村工業株式会社 | 表面処理装置 |
JP6306128B2 (ja) * | 2016-11-09 | 2018-04-04 | 上村工業株式会社 | 表面処理装置 |
JP2018115367A (ja) * | 2017-01-18 | 2018-07-26 | アルメックスPe株式会社 | 表面処理装置及び表面処理方法 |
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- 2019-11-08 TW TW108140677A patent/TWI826578B/zh active
- 2019-12-11 KR KR1020190164398A patent/KR20200087069A/ko unknown
- 2019-12-25 CN CN201911355641.8A patent/CN111424268B/zh active Active
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TWI826578B (zh) | 2023-12-21 |
US11001928B2 (en) | 2021-05-11 |
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