JP2020092142A - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
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- JP2020092142A JP2020092142A JP2018227440A JP2018227440A JP2020092142A JP 2020092142 A JP2020092142 A JP 2020092142A JP 2018227440 A JP2018227440 A JP 2018227440A JP 2018227440 A JP2018227440 A JP 2018227440A JP 2020092142 A JP2020092142 A JP 2020092142A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- 238000005229 chemical vapour deposition Methods 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
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- 239000012670 alkaline solution Substances 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
11a 表面
11b 裏面
11c 外周縁
11d 外周縁
11e 外周縁
13 分割予定ライン(ストリート)
15 デバイス
17 接続電極
19 電極(ビア電極、貫通電極)
21 デバイス領域
23 外周余剰領域
23a 第1領域
23b 段差部
23c 第2領域
25 キャリア基板
25a 表面
25b 裏面
27 接着剤
29 絶縁膜
31 絶縁膜
2 切削装置
4 チャックテーブル
4a 保持面
6 切削ユニット
8 スピンドル
10 第1切削ブレード
12 第2切削ブレード
20 研削装置
22 チャックテーブル
22a 保持面
24 研削ユニット
26 スピンドル
28 マウント
30 研削ホイール
32 基台
34 研削砥石
40 エッチング装置
42 チャックテーブル
42a 保持面
44 ノズル
46 薬液(エッチング液)
50 研磨装置
52 チャックテーブル
52a 保持面
54 研磨ユニット
56 スピンドル
58 マウント
60 研磨パッド
62 基台
64 研磨層
66 研磨液供給路
Claims (1)
- 交差する複数の分割予定ラインによって区画された複数の領域の表面側にそれぞれ形成された複数のデバイスと、該領域の内部に該領域の厚さ方向に沿って埋め込まれ該デバイスに接続された電極と、を有するデバイス領域と、
該デバイス領域を囲繞する外周余剰領域と、を備えるウェーハを加工するウェーハの加工方法であって、
該外周余剰領域のうち該ウェーハの外周縁側に位置する第1領域に、第1切削ブレードを所定の深さで該ウェーハの周方向に沿って切り込ませることにより、該外周余剰領域に段差部を形成する、又は該第1領域を除去する第1切削ステップと、
該ウェーハの表面側を、接着剤を介してキャリア基板に固定するキャリア基板固定ステップと、
該第1切削ステップと該キャリア基板固定ステップとを実施した後、該ウェーハの厚さが該所定の深さ以下となるまで該ウェーハの裏面側を研削し、該電極が該ウェーハの裏面側で露出しない範囲で該ウェーハを薄くする研削ステップと、
該研削ステップを実施した後、該ウェーハの裏面側に薬液を供給して該ウェーハをエッチングし、該電極を該ウェーハの裏面側から突出させるエッチングステップと、
該エッチングステップを実施した後、該ウェーハの裏面側を絶縁膜で覆う絶縁膜被覆ステップと、
該絶縁膜被覆ステップを実施した後、該外周余剰領域のうち該接着剤と接触しない第2領域に、第2切削ブレードを該ウェーハの周方向に沿って切り込ませることにより、該第2領域を除去する第2切削ステップと、
該第2切削ステップを実施した後、該ウェーハの裏面側に研磨液を供給しながら研磨パッドを押し付けて該絶縁膜を研磨し、該電極を該絶縁膜から露出させる研磨ステップと、を備えることを特徴とするウェーハの加工方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018227440A JP7187115B2 (ja) | 2018-12-04 | 2018-12-04 | ウェーハの加工方法 |
KR1020190158050A KR20200067760A (ko) | 2018-12-04 | 2019-12-02 | 웨이퍼의 가공 방법 |
TW108143961A TWI805872B (zh) | 2018-12-04 | 2019-12-02 | 晶圓的加工方法 |
CN201911212704.4A CN111276397B (zh) | 2018-12-04 | 2019-12-02 | 晶片的加工方法 |
US16/701,377 US10950504B2 (en) | 2018-12-04 | 2019-12-03 | Wafer processing method |
DE102019218879.6A DE102019218879B4 (de) | 2018-12-04 | 2019-12-04 | Waferbearbeitungsverfahren |
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Application Number | Priority Date | Filing Date | Title |
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JP2018227440A JP7187115B2 (ja) | 2018-12-04 | 2018-12-04 | ウェーハの加工方法 |
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JP2020092142A true JP2020092142A (ja) | 2020-06-11 |
JP7187115B2 JP7187115B2 (ja) | 2022-12-12 |
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JP2018227440A Active JP7187115B2 (ja) | 2018-12-04 | 2018-12-04 | ウェーハの加工方法 |
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US (1) | US10950504B2 (ja) |
JP (1) | JP7187115B2 (ja) |
KR (1) | KR20200067760A (ja) |
CN (1) | CN111276397B (ja) |
DE (1) | DE102019218879B4 (ja) |
TW (1) | TWI805872B (ja) |
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JP7430515B2 (ja) * | 2019-11-06 | 2024-02-13 | 株式会社ディスコ | ウエーハの処理方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183130A (ja) * | 1989-12-12 | 1991-08-09 | Sony Corp | 半導体基板の製造方法 |
JPH05109677A (ja) * | 1991-10-16 | 1993-04-30 | Sony Corp | Soi基板の製造方法 |
JPH08274286A (ja) * | 1995-03-29 | 1996-10-18 | Komatsu Electron Metals Co Ltd | Soi基板の製造方法 |
JP2006339302A (ja) * | 2005-05-31 | 2006-12-14 | Shin Etsu Handotai Co Ltd | 貼り合わせウエーハの製造方法及び貼り合わせウエーハの外周研削装置 |
JP2014033160A (ja) * | 2012-08-06 | 2014-02-20 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2014044999A (ja) * | 2012-08-24 | 2014-03-13 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026413A (ja) * | 2003-07-01 | 2005-01-27 | Renesas Technology Corp | 半導体ウエハ、半導体素子およびその製造方法 |
CN100399540C (zh) * | 2005-08-30 | 2008-07-02 | 中美矽晶制品股份有限公司 | 复合晶片结构的制造方法 |
US20080044984A1 (en) * | 2006-08-16 | 2008-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods of avoiding wafer breakage during manufacture of backside illuminated image sensors |
JP5307593B2 (ja) | 2009-03-25 | 2013-10-02 | 株式会社ディスコ | 積層ウェーハの分割方法 |
US8669166B1 (en) * | 2012-08-15 | 2014-03-11 | Globalfoundries Inc. | Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon |
JP6302644B2 (ja) * | 2013-11-11 | 2018-03-28 | 株式会社ディスコ | ウェーハの加工方法 |
JP6230381B2 (ja) * | 2013-11-15 | 2017-11-15 | 株式会社ディスコ | 加工方法 |
CN104733300B (zh) * | 2013-12-23 | 2018-09-25 | 中芯国际集成电路制造(上海)有限公司 | 一种键合晶片的减薄方法 |
JP6344971B2 (ja) * | 2014-05-16 | 2018-06-20 | 株式会社ディスコ | サポートプレート、サポートプレートの形成方法及びウェーハの加工方法 |
US9786643B2 (en) * | 2014-07-08 | 2017-10-10 | Micron Technology, Inc. | Semiconductor devices comprising protected side surfaces and related methods |
JP2016127232A (ja) * | 2015-01-08 | 2016-07-11 | 株式会社ディスコ | ウェーハの加工方法 |
US9455187B1 (en) * | 2015-06-18 | 2016-09-27 | International Business Machines Corporation | Backside device contact |
JP6636377B2 (ja) * | 2016-04-08 | 2020-01-29 | 株式会社ディスコ | パッケージウェーハの製造方法及びデバイスチップの製造方法 |
KR102524962B1 (ko) * | 2016-11-14 | 2023-04-21 | 삼성전자주식회사 | 기판 구조체 제조 방법 및 이를 이용하여 제조된 기판 구조체 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183130A (ja) * | 1989-12-12 | 1991-08-09 | Sony Corp | 半導体基板の製造方法 |
JPH05109677A (ja) * | 1991-10-16 | 1993-04-30 | Sony Corp | Soi基板の製造方法 |
JPH08274286A (ja) * | 1995-03-29 | 1996-10-18 | Komatsu Electron Metals Co Ltd | Soi基板の製造方法 |
JP2006339302A (ja) * | 2005-05-31 | 2006-12-14 | Shin Etsu Handotai Co Ltd | 貼り合わせウエーハの製造方法及び貼り合わせウエーハの外周研削装置 |
JP2014033160A (ja) * | 2012-08-06 | 2014-02-20 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2014044999A (ja) * | 2012-08-24 | 2014-03-13 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
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TWI805872B (zh) | 2023-06-21 |
TW202022932A (zh) | 2020-06-16 |
CN111276397A (zh) | 2020-06-12 |
JP7187115B2 (ja) | 2022-12-12 |
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