JP2020088139A5 - - Google Patents

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Publication number
JP2020088139A5
JP2020088139A5 JP2018219901A JP2018219901A JP2020088139A5 JP 2020088139 A5 JP2020088139 A5 JP 2020088139A5 JP 2018219901 A JP2018219901 A JP 2018219901A JP 2018219901 A JP2018219901 A JP 2018219901A JP 2020088139 A5 JP2020088139 A5 JP 2020088139A5
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JP
Japan
Prior art keywords
region
terminals
wiring board
power supply
semiconductor chip
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Application number
JP2018219901A
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English (en)
Japanese (ja)
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JP7134077B2 (ja
JP2020088139A (ja
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Priority to JP2018219901A priority Critical patent/JP7134077B2/ja
Priority claimed from JP2018219901A external-priority patent/JP7134077B2/ja
Priority to US16/653,098 priority patent/US11101206B2/en
Priority to CN201911158381.5A priority patent/CN111223836B/zh
Publication of JP2020088139A publication Critical patent/JP2020088139A/ja
Publication of JP2020088139A5 publication Critical patent/JP2020088139A5/ja
Application granted granted Critical
Publication of JP7134077B2 publication Critical patent/JP7134077B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018219901A 2018-11-26 2018-11-26 半導体装置および電子装置 Active JP7134077B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018219901A JP7134077B2 (ja) 2018-11-26 2018-11-26 半導体装置および電子装置
US16/653,098 US11101206B2 (en) 2018-11-26 2019-10-15 Semiconductor device and electronic device
CN201911158381.5A CN111223836B (zh) 2018-11-26 2019-11-22 半导体器件和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018219901A JP7134077B2 (ja) 2018-11-26 2018-11-26 半導体装置および電子装置

Publications (3)

Publication Number Publication Date
JP2020088139A JP2020088139A (ja) 2020-06-04
JP2020088139A5 true JP2020088139A5 (https=) 2021-04-22
JP7134077B2 JP7134077B2 (ja) 2022-09-09

Family

ID=70770047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018219901A Active JP7134077B2 (ja) 2018-11-26 2018-11-26 半導体装置および電子装置

Country Status (3)

Country Link
US (1) US11101206B2 (https=)
JP (1) JP7134077B2 (https=)
CN (1) CN111223836B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102774755B1 (ko) * 2020-08-20 2025-03-04 에스케이하이닉스 주식회사 복수의 단위 캐패시터들을 가진 디커플링 소자를 포함하는 저장 장치
US11699645B2 (en) * 2021-11-18 2023-07-11 Renesas Electronics Corporation Semiconductor device having wiring substrate with lead-out wirings
JP7834178B2 (ja) * 2022-07-29 2026-03-23 京セラ株式会社 回路基板、半導体装置及び電子モジュール
CN119786470B (zh) * 2024-12-30 2025-11-04 西安交通大学 一种ai算力芯片垂直供电结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145319A (ja) 1997-11-11 1999-05-28 Sumitomo Metal Smi Electron Devices Inc プラスチックｂｇａパッケージ
JP3701949B2 (ja) * 2003-04-16 2005-10-05 沖電気工業株式会社 半導体チップ搭載用配線基板及びその製造方法
KR101671258B1 (ko) * 2009-05-20 2016-11-01 파나소닉 아이피 매니지먼트 가부시키가이샤 적층형 반도체 모듈
JP2011066344A (ja) * 2009-09-18 2011-03-31 Renesas Electronics Corp 半導体装置および電子装置
JP5514560B2 (ja) * 2010-01-14 2014-06-04 ルネサスエレクトロニクス株式会社 半導体装置
JP6076874B2 (ja) * 2013-09-26 2017-02-08 ルネサスエレクトロニクス株式会社 電子装置、テストボードおよび半導体装置の製造方法
CN106233461B (zh) * 2014-04-24 2019-03-15 瑞萨电子株式会社 半导体装置及其制造方法
JP6300420B2 (ja) * 2014-09-26 2018-03-28 ルネサスエレクトロニクス株式会社 電子装置
JP6352447B2 (ja) * 2014-12-24 2018-07-04 ルネサスエレクトロニクス株式会社 半導体装置
JP6317855B2 (ja) * 2015-06-26 2018-04-25 ルネサスエレクトロニクス株式会社 電子装置
JP2017045915A (ja) * 2015-08-28 2017-03-02 ルネサスエレクトロニクス株式会社 半導体装置
JP6867268B2 (ja) * 2017-10-13 2021-04-28 ルネサスエレクトロニクス株式会社 半導体装置
JP6853774B2 (ja) * 2017-12-21 2021-03-31 ルネサスエレクトロニクス株式会社 半導体装置

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