JP2020077804A - 電子機器、基板保持部材、回路基板の出し入れ方法 - Google Patents

電子機器、基板保持部材、回路基板の出し入れ方法 Download PDF

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Publication number
JP2020077804A
JP2020077804A JP2018211206A JP2018211206A JP2020077804A JP 2020077804 A JP2020077804 A JP 2020077804A JP 2018211206 A JP2018211206 A JP 2018211206A JP 2018211206 A JP2018211206 A JP 2018211206A JP 2020077804 A JP2020077804 A JP 2020077804A
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Japan
Prior art keywords
circuit board
housing
holding member
electronic device
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018211206A
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English (en)
Japanese (ja)
Inventor
知毅 三輪
Tomotake Miwa
知毅 三輪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Platforms Ltd
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NEC Platforms Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Platforms Ltd filed Critical NEC Platforms Ltd
Priority to JP2018211206A priority Critical patent/JP2020077804A/ja
Priority to PCT/JP2019/041708 priority patent/WO2020095701A1/ja
Priority to TW108139005A priority patent/TWI779243B/zh
Publication of JP2020077804A publication Critical patent/JP2020077804A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Tunnel Furnaces (AREA)
JP2018211206A 2018-11-09 2018-11-09 電子機器、基板保持部材、回路基板の出し入れ方法 Pending JP2020077804A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018211206A JP2020077804A (ja) 2018-11-09 2018-11-09 電子機器、基板保持部材、回路基板の出し入れ方法
PCT/JP2019/041708 WO2020095701A1 (ja) 2018-11-09 2019-10-24 電子機器、基板保持部材、回路基板の出し入れ方法
TW108139005A TWI779243B (zh) 2018-11-09 2019-10-29 電子設備、基板維持構件以及電路基板存取方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018211206A JP2020077804A (ja) 2018-11-09 2018-11-09 電子機器、基板保持部材、回路基板の出し入れ方法

Publications (1)

Publication Number Publication Date
JP2020077804A true JP2020077804A (ja) 2020-05-21

Family

ID=70611808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018211206A Pending JP2020077804A (ja) 2018-11-09 2018-11-09 電子機器、基板保持部材、回路基板の出し入れ方法

Country Status (3)

Country Link
JP (1) JP2020077804A (zh)
TW (1) TWI779243B (zh)
WO (1) WO2020095701A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065362A (ja) * 1996-08-14 1998-03-06 Hochiki Corp 基板取付構造
US5761030A (en) * 1996-06-19 1998-06-02 Compaq Computer Corporation Electronic device with circuit board latching and retaining structure
JP2002246773A (ja) * 2001-02-19 2002-08-30 Ricoh Co Ltd 電装基板の取り付け構造および画像形成装置
US20090195995A1 (en) * 2008-02-04 2009-08-06 Tellabs Oy Et Al. Communications device
WO2017072935A1 (ja) * 2015-10-30 2017-05-04 三菱電機株式会社 コントローラ
WO2017103972A1 (ja) * 2015-12-14 2017-06-22 三菱電機株式会社 電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1398433B1 (it) * 2009-09-03 2013-02-22 Applied Materials Inc Apparato e procedimento per la lavorazione di un substrato

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761030A (en) * 1996-06-19 1998-06-02 Compaq Computer Corporation Electronic device with circuit board latching and retaining structure
JPH1065362A (ja) * 1996-08-14 1998-03-06 Hochiki Corp 基板取付構造
JP2002246773A (ja) * 2001-02-19 2002-08-30 Ricoh Co Ltd 電装基板の取り付け構造および画像形成装置
US20090195995A1 (en) * 2008-02-04 2009-08-06 Tellabs Oy Et Al. Communications device
WO2017072935A1 (ja) * 2015-10-30 2017-05-04 三菱電機株式会社 コントローラ
WO2017103972A1 (ja) * 2015-12-14 2017-06-22 三菱電機株式会社 電子機器

Also Published As

Publication number Publication date
TW202029861A (zh) 2020-08-01
WO2020095701A1 (ja) 2020-05-14
TWI779243B (zh) 2022-10-01

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