GB2511278A

GB2511278A - Computing equipment enclosure

Info

Publication number: GB2511278A
Application number: GB201219734A
Authority: GB
Inventors: Greg James Compton
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-11-02
Filing date: 2012-11-02
Publication date: 2014-09-03
Also published as: GB201219734D0

Abstract

A modular system enclosure is constructed from a number of thermally insulated, rigid, reinforced plastic boards 13 mounted vertically and regularly spaced with air gaps 14 inbetween, and provides a contained environment for computer equipment, with airflow control. The enclosure provides adjustable induction of cooled or ambient air at the base and exhaust of heated air at the top. Bare electrical equipment is mounted on the thermally insulated boards 13. The air gaps between boards define vertical channels which act like flues, allowing minimal airflow disruption and therefore efficient thermal convection, enhancing thermal transfer from the electrical components. Efficiency can be enhanced by mechanical means to increase airflow from the external input (at the base) to exhaust fans 8 (at top of enclosure) to meet module size requirements. Extracting air rapidly after thermal transfer from these flues reduces the need for active cooling of environmental temperature.

Description

I

Computing equipment enclosure

Background

This invention relates to a modular design non conductive computing equipment enclosure system (also described as a server cabinet or rack). Internally arranged to allow thermal convection and extraction from vertically orientated multiple computer systems (nodes) and ancillary printed circuit boards mounted on non conductive boards to be housed within. Units can vary in size dependanton the number of nodes sited within.

Conventional computer equipment cabinets holding multiple computer devices are generally constructed from metal frameworks and can include panelling, this provides for a secure strong non inflammable housing. The disadvantage of using this construction is that because its purpose is to hold electrical equipment, often of high energies and through equipment failure or human operational error, it poses a risk of electrical supply coming into contact with the metallic enclosure components (cabinet). This creates the danger of electrocution on contact. Other negative features of metal fabrication for this application include conduction and storage of thermal energy from the equipment being housed; and vibration transfer from the frame to sensitive electromechanical components. In addition traditional existing cabinet designs are cumbersome to transport and have substantial weight.

Computer devices are positioned within the traditional server cabinet in a horizontal plane stacked one above the other. More recent blade chassis designs do provide for the computer equipment to be positioned in the vertical plane but are still stacked in close enclosed proximity. In both instances the ability to employ the principle of natural convection airflow movement to dissipate heat is hampered by areas of turbulent airflow caused by the devices close proximity in the horizontal or vertical planes which leads to heat build up or hot spots.

Electronics ofa computer system are usually housed within an external case, then placed inside the cabinet or rack. It has been the practice to manufacture cases with similar dimensions to that of electronic components for optimising the density of devices in a given space(as space is often at a premium in facilities where racks are located). This produces two problems. Firstly the case impedes airflow to electronics resulting in greater thermal retention and therefore both more external cooling pressure and potentially suboptimal performance by the equipment; secondly development has produced a number of ancillary circuit boards for various functions which require space and additional cooling capacity to be allocated to them. This can invalidate the design assumption of maximum density used in some existing computer equipment designs.

Statement of invention

To overcome these issues with electronic equipment, high energies, heat, cooling, vibration and weight the present invention proposes a number of essential features.

Material used for the modular computer equipment enclosure (server cabinet or rack) is constructed from a number insulated, rigid and reinforced plastics.

The computer equipment enclosure is isolated, enclosed, producing a contained environment for the purpose of regulating airflow. The front panels are removable to allow access to the inside of the enclosure, on replacement of a front panel a seal provided assists in containment of airflow within system. An entry duct orducts allowing service supplies such as electrical power and telecommunications (but not limited to) to and from the enclosure is provided. The enclosure is elevated providing an access void beneath for the introduction ofairvia adjustable intake vents.

The design provides for horizontal plastic channels acting as rails within the enclosure. These support insulated mounting boards suspended in the vertical plane, to which the electrical components are directly attached and therefore open to the environment within the enclosure. These channel rails by design act as vibration dampeners for the computer equipment in conjunction with other vibration absorbing materials incorporated into the enclosure frame.

Mounting boards are arranged within the enclosure to provide a clear air space between each board. This enables the fitting of additional ancillary PCB devices, and allow air that has passed over the electrical components to rise with minimal obstruction under natural convection and or moved by mechanical assisted means.

The insulated mounting boards assist the prevention of heat transfer between neighbouring electronic equipment. These boards also provide an effective side to each air space forming flu like arrangement in the vertical axis.

Ambient or cooled air is introduced to the enclosure from adjustable air intake vents to the base of the enclosure and the heated air is evacuated from adjustable exhaust air vents to the top of the enclosure.

Advantages Generally plastics do not readily conduct electricity and therefore reduce the possibility of electrocution from contact with the enclosure. The materials are of relatively low weight in comparison to metal fabrication and therefore more maneuverable and reduce floor weight loading, yet provide the required strength to be fit for purpose. Plastics offer comparatively simple and standardised manufacturing techniques. Some plastics offer fire retardant and useful insulating properties (e.g reducing thermal,and vibration transfer through the frames structure) for this application.

The enclosures interior space provides a contained, isolated environment for directing introduced ambient or cooled air to the base and evacuation and exhausting of air post thermal transfer through exhaust vents sited in enclosures top.

Electrical equipment is mounted onto the insulated boards (without the traditional exterior enclosed housing cover) providing a computer system exposed to the controlled airflow within the enclosure. The insulated boards are mounted vertically between top and bottom channel rails, combined in a regular pattern within the enclosure to create an air gap between insulated boards, with minimal disruptions to airflow allows thermal convection to take place without major impediment. This convection within the input to extraction airstream enhances thermal transfer from electronic and electromechanical components.

Vertical channels are created from the regular layout of insulated boards as a flue, the efficiency of which can be enhanced by mechanical means with the addition of external input (to base) and exhaust fans(to top of enclosure) to meet module size requirements. By extracting air rapidly after thermal transfer from this moving airstream, subject to operational and ambient temperature conditions reduces or negates the need for mechanical cooling of environmental temperature.

Positive air pressure and enclosed isolated environment reduces buildup of debris in electrical components. This feature helps maintain consistent thermal transfer over equipmentlife span, improving reliability and allows fordeployment in a widervariety of environments, not normally suited to the open running of sensitive electromechanical devices. Plastics are aesthetically acceptable in appearance, easily cleaned, and accepts materials for the inclusion of seals and sealants to aid in the system design and manufacture.

An enclosure is built from standardised modules, which can be equipped with a vented top and bottom panel to form the enclosed space. This approach to modular computer equipment enclosures (cabinets) allows various configurations of equipment boards to be assembled and housed from a standardised design as required.

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DESCRIPTION OF THE DRAWINGS

Introduction to drawings

A minimum enclosure configuration for a single module consists of 6 panels, 2 sides, rear, front, bottom and top with all frames respectively connected to produce the enclosure.

An example of the invention will now be described by referring to the accompanying drawings: Fig.1 Shows an isometric projection of a single module enclosure,with front panel removed to provide an internal view.

Fig.2 shows an isometric projection of an enclosure using 3 stacked modules of Fig.1 with the removal of a number of top and bottom panels to the modules to facilitate the larger system, thereby demonstrating the modular system and some component parts.

In this multiple stacked system the top frame to both 15 base rack and 16 centre rack are removed and the base frame to rack 16 centre rack and 17 top rack are removed to provide for convection and airflow throughout the enlarged system.

To the front elevation 2 of 3 rigid plastics front panels to the base rack 15 and top rack 17 are removed to illustrate some internal details.The centre rack 16 has the rigid plastics front panel in situ.

Fig.3 shows an isometric projection of an enclosure using 3 stacked modules of Fig.1 with the removal of a number of top and base panels to the modules to facilitate the larger system, thereby demonstrating the modular system and some component parts.

To the front elevation 2 of 3 rigid plastics front removable panels to the bottom rack and top rack 17 are removed to illustrate some internal detail showing an example in the top rack of the distance spacing pattern between the channel rails providing for 14 airflow spacings (gaps) between the insulated panels.The top rack also shows an example of 13 insulated panels (suspended in the vertical plane by the horizontal channel rails), to which the computer electronic components are attached to be housed vertically within. The 16 centre rack has the rigid plastics front panel in situ.

Detailed Description of Drawings

Reference will now be made to the drawing figures to describe a singular module in Fig 1 and a multiple 3 stacked modular system of Fig 2 and Fig 3 in detail.

Referring to FIG. 1 I Top panel, 2 right hand side panel, 3 left hand side panel, 4 rear panel (unseen), and 5 base panel, are frames manufactured from strengthened plastics with insulated panel inserts,front frame 6, of strengthened plastics with seals, to accept 7 unseen (shown on Fig 2 & 3) removable rigid panel of plastics removed (on Fig. 1) to illustrate internally.

All frames respectively connected to produce a box enclosure.

B External exhaust boxes are connected to an internal adjustable vent (unseen)fltted to I top panel 9 Internal adjustable vents are connected to 10 an external induction box (unseen) fitted to 5 bottom panel As illustrated a number of both induction and exhaust boxes together with adjustable vents would be fitted depending on enclosure size.

11 Bottom channel rail mounted in the horizontal plane with open channel facing upwards fixed to 6 front and 4 back frame panels, providing a supporting track to accept 13 an insulated mounting board held in the vertical plane.

12 Top channel rail mounted in the horizontal plane with open channel facing downwards fixed to 6 front and 4 back frame panels,providing a supporting track to accept 13 an insulated mounting board held in the vertical plane.

A number of both bottom and top channel rail mounts sited inline with each other would be fitted depending on enclosure size.

13 Insulated mounting board, positioned vertically within the enclosure to which electronic equipment is attached.

As illustrated a number of insulated boards would befitted depending on enclosure size.

14 Air space gaps provided between horizontal channel rails.The air space or gap is provided for between each channel rail and therefore between each insulated mounting board.This configuration results in 13 the vertically suspended boards acting as vertical sides of a flue.

Referring to FIG. 2 The top module 17 of this 3 stacked system comprises of I Top panel, 2 right hand side panel, 3 left hand side panel, 4 rear panel, frames manufactured from strengthened plastics with insulated panel inserts.

Front frame 6, of strengthened plastics with seals, to accept 7 removable rigid panel of plastics removed to this module to illustrate internally.

All frames respectively connected to produce a box section for the top of this 3 stacked module, having an open base.

8 External exhaust box is connected to internal adjustable vent (unseen) filled to I top panel 9 Internal adjustable vent is connected to 10 an external induction box (unseen) filled to 5 bottom panel A number of both induction and exhaust boxes together with adjustable vents would be filled depending on enclosure size (as illustrated in Fig 1).

11 Bottom channel rail mounted in the horizontal plane with open channel facing upwards fixed to 6 front and 4 back frame panels, providing a supporting track to accept an insulated mounting board held in the vertical plane (not shown to this drawing).

12 Top channel rail mounted in the horizontal plane with open channel facing downwards fixed to 6 front and 4 back frame panels,providing a supporting track to accept an insulated mounting board held in the vertical plane (not shown to this drawing).

A number of both bottom and top channel rail mounts sited inline with each other would be fitted depending on enclosure size. (as illustrated in Fig 1 and 3) 16 Middle module of this 3 stacked system comprises of 2 a right hand side panel, 3 a left hand side panel, 4 a rear panel, frames manufactured from strengthened plastics with insulated panel inserts.

Front frame 6, of strengthened plastics with seals, to accept 7 removable rigid panel of plastics All frames respectively connected to produce a centre section for this 3 stacked module having an open base and open top.

Base module of this 3 stacked system comprises of Base panel 2 a right hand side panel, 3 a left hand side panel, 4 a rear panel, frames manufactured from strengthened plastics with insulated panel inserts.

All frames respectively connected to produce a box section for the base of this 3 stacked module, having an open top section.

9 Internal adjustable vent is connected to lOan external induction box (unseen)fltted to 5 bottom panel Referring to FIG. 3 17 Top module of this 3 stacked system comprises of I Top panel, 2 right hand side panel, 3 left hand side panel, 4 rear panel (unseen), are frames manufactured from strengthened plastics with insulated panel inserts,front frame 6, of strengthened plastics with seals, to accept 7 removable rigid panel of plastics removed to illustrate internally.

All frames respectively connected to produce a box enclosure,having an open base.

8 External exhaust box is connected to an internal adjustable vent (unseen) fitted to I top panel A number of adjustable vents and induction boxes would be filled depending on enclosure size 11 Bottom channel rail mounted in the horizontal plane with open channel facing upwards fixed to 6 front and 4 back frame panels, providing a supporting track to accept 13 an insulated mounting board held in the vertical plane.

13 Insulated board, positioned vertically within the enclosure to which electronic equipment is attached.

As illustrated a number of insulated boards would be filled depending on enclosure size.

l4Air space gap provided between horizontal channel rails.The airspace orgap is provided for between each channel rail and therefore between each insulated mounting board.This configuration results in 13 the vertically suspended boards acting as vertical sides of a flue.

16 Middle module of this 3 stacked system comprises of 2 a right hand side panel, 3 a left hand side panel, 4 a rear panel, frames manufactured from strengthened plastics with insulated panel inserts.

The base module 15 of this 3 stacked system comprises of base panel, 2 a right hand side panel, 3 a left hand side panel, 4a rear panel, frames manufactured from strengthened plastics with insulated panel inserts.

Front frame 6, of strengthened plastics with seals, to accept 7 removable rigid panel of plastic removed to this module to illustrate internally.

All frames respectively connected to produce a box section for the base of this 3 stacked module, having an open top.

9 Internal adjustable vent is connected to 10 an external induction box (unseen) filled to 5 bottom panel A number of adjustable vents and induction boxes would be filled depending on enclosure size 11 Bottom channel rail mounted in the horizontal plane with open channel facing upwards fixed to 6 front and 4 back frame panels, providing a supporting track to accept an insulated mounting board held in the vertical plane (not shown to this section of the drawing).