JPS6489599A - Apparatus for containing printed board - Google Patents

Apparatus for containing printed board

Info

Publication number
JPS6489599A
JPS6489599A JP24756487A JP24756487A JPS6489599A JP S6489599 A JPS6489599 A JP S6489599A JP 24756487 A JP24756487 A JP 24756487A JP 24756487 A JP24756487 A JP 24756487A JP S6489599 A JPS6489599 A JP S6489599A
Authority
JP
Japan
Prior art keywords
printed boards
main unit
containing rack
contained
exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24756487A
Other languages
Japanese (ja)
Other versions
JPH0770854B2 (en
Inventor
Akimitsu Omori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62247564A priority Critical patent/JPH0770854B2/en
Publication of JPS6489599A publication Critical patent/JPS6489599A/en
Publication of JPH0770854B2 publication Critical patent/JPH0770854B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To miniaturize the main unit of the title apparatus as well as cool printed boards efficiently, by partitioning the vertical containing rack and the horizontal containing rack which are so provided in the main unit as to pile up vertically at specified intervals. CONSTITUTION:Printed boards 14b of high calorific value are contained in the vertical containing rack 16. Cooling wind is flowed in by a cooling fan 18b through the vent 12a of the main unit 11 of containing apparatus to cool the printed boards, and exhaust wind is discharged through a top exhaust port 13a. The exhaust wind does not affect the printed boards 14a contained in the horizontal containing rack 15 because the containing racks 15, 16 are partitioned by a partition plate 19. Printed boards 14a of low calorific value are contained in the horizontal containing rack 15. The printed boards 14a are cooled by cooling wind flowed in by an exhaust fan 20 provided to the top of the main unit 11.
JP62247564A 1987-09-30 1987-09-30 Printed circuit board housing Expired - Lifetime JPH0770854B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62247564A JPH0770854B2 (en) 1987-09-30 1987-09-30 Printed circuit board housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62247564A JPH0770854B2 (en) 1987-09-30 1987-09-30 Printed circuit board housing

Publications (2)

Publication Number Publication Date
JPS6489599A true JPS6489599A (en) 1989-04-04
JPH0770854B2 JPH0770854B2 (en) 1995-07-31

Family

ID=17165370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62247564A Expired - Lifetime JPH0770854B2 (en) 1987-09-30 1987-09-30 Printed circuit board housing

Country Status (1)

Country Link
JP (1) JPH0770854B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717807B2 (en) 2002-03-12 2004-04-06 Fujitsu Limited Cooling structure for electronic circuit unit
US7085133B2 (en) * 2003-07-09 2006-08-01 International Business Machines Corporation Cooling using complimentary tapered plenums
US7236362B2 (en) * 2004-11-18 2007-06-26 Ncr Corporation Minimization of cooling air preheat for maximum packaging density
GB2511278A (en) * 2012-11-02 2014-09-03 Greg James Compton Computing equipment enclosure
US9839155B2 (en) 2012-05-16 2017-12-05 Panduit Corp. Thermal ducting system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5634395U (en) * 1979-08-22 1981-04-03
JPS6221035U (en) * 1985-07-16 1987-02-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5634395U (en) * 1979-08-22 1981-04-03
JPS6221035U (en) * 1985-07-16 1987-02-07

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717807B2 (en) 2002-03-12 2004-04-06 Fujitsu Limited Cooling structure for electronic circuit unit
US7085133B2 (en) * 2003-07-09 2006-08-01 International Business Machines Corporation Cooling using complimentary tapered plenums
US7236362B2 (en) * 2004-11-18 2007-06-26 Ncr Corporation Minimization of cooling air preheat for maximum packaging density
US9839155B2 (en) 2012-05-16 2017-12-05 Panduit Corp. Thermal ducting system
GB2511278A (en) * 2012-11-02 2014-09-03 Greg James Compton Computing equipment enclosure

Also Published As

Publication number Publication date
JPH0770854B2 (en) 1995-07-31

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