JPS6489599A - Apparatus for containing printed board - Google Patents
Apparatus for containing printed boardInfo
- Publication number
- JPS6489599A JPS6489599A JP24756487A JP24756487A JPS6489599A JP S6489599 A JPS6489599 A JP S6489599A JP 24756487 A JP24756487 A JP 24756487A JP 24756487 A JP24756487 A JP 24756487A JP S6489599 A JPS6489599 A JP S6489599A
- Authority
- JP
- Japan
- Prior art keywords
- printed boards
- main unit
- containing rack
- contained
- exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To miniaturize the main unit of the title apparatus as well as cool printed boards efficiently, by partitioning the vertical containing rack and the horizontal containing rack which are so provided in the main unit as to pile up vertically at specified intervals. CONSTITUTION:Printed boards 14b of high calorific value are contained in the vertical containing rack 16. Cooling wind is flowed in by a cooling fan 18b through the vent 12a of the main unit 11 of containing apparatus to cool the printed boards, and exhaust wind is discharged through a top exhaust port 13a. The exhaust wind does not affect the printed boards 14a contained in the horizontal containing rack 15 because the containing racks 15, 16 are partitioned by a partition plate 19. Printed boards 14a of low calorific value are contained in the horizontal containing rack 15. The printed boards 14a are cooled by cooling wind flowed in by an exhaust fan 20 provided to the top of the main unit 11.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62247564A JPH0770854B2 (en) | 1987-09-30 | 1987-09-30 | Printed circuit board housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62247564A JPH0770854B2 (en) | 1987-09-30 | 1987-09-30 | Printed circuit board housing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6489599A true JPS6489599A (en) | 1989-04-04 |
JPH0770854B2 JPH0770854B2 (en) | 1995-07-31 |
Family
ID=17165370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62247564A Expired - Lifetime JPH0770854B2 (en) | 1987-09-30 | 1987-09-30 | Printed circuit board housing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0770854B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6717807B2 (en) | 2002-03-12 | 2004-04-06 | Fujitsu Limited | Cooling structure for electronic circuit unit |
US7085133B2 (en) * | 2003-07-09 | 2006-08-01 | International Business Machines Corporation | Cooling using complimentary tapered plenums |
US7236362B2 (en) * | 2004-11-18 | 2007-06-26 | Ncr Corporation | Minimization of cooling air preheat for maximum packaging density |
GB2511278A (en) * | 2012-11-02 | 2014-09-03 | Greg James Compton | Computing equipment enclosure |
US9839155B2 (en) | 2012-05-16 | 2017-12-05 | Panduit Corp. | Thermal ducting system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5634395U (en) * | 1979-08-22 | 1981-04-03 | ||
JPS6221035U (en) * | 1985-07-16 | 1987-02-07 |
-
1987
- 1987-09-30 JP JP62247564A patent/JPH0770854B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5634395U (en) * | 1979-08-22 | 1981-04-03 | ||
JPS6221035U (en) * | 1985-07-16 | 1987-02-07 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6717807B2 (en) | 2002-03-12 | 2004-04-06 | Fujitsu Limited | Cooling structure for electronic circuit unit |
US7085133B2 (en) * | 2003-07-09 | 2006-08-01 | International Business Machines Corporation | Cooling using complimentary tapered plenums |
US7236362B2 (en) * | 2004-11-18 | 2007-06-26 | Ncr Corporation | Minimization of cooling air preheat for maximum packaging density |
US9839155B2 (en) | 2012-05-16 | 2017-12-05 | Panduit Corp. | Thermal ducting system |
GB2511278A (en) * | 2012-11-02 | 2014-09-03 | Greg James Compton | Computing equipment enclosure |
Also Published As
Publication number | Publication date |
---|---|
JPH0770854B2 (en) | 1995-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 13 Free format text: PAYMENT UNTIL: 20080731 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080731 Year of fee payment: 13 |