JP2020061449A5 - - Google Patents

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Publication number
JP2020061449A5
JP2020061449A5 JP2018191375A JP2018191375A JP2020061449A5 JP 2020061449 A5 JP2020061449 A5 JP 2020061449A5 JP 2018191375 A JP2018191375 A JP 2018191375A JP 2018191375 A JP2018191375 A JP 2018191375A JP 2020061449 A5 JP2020061449 A5 JP 2020061449A5
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JP
Japan
Prior art keywords
shows
sectional drawing
concerns
wiring board
manufacturing
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Application number
JP2018191375A
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English (en)
Japanese (ja)
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JP7089453B2 (ja
JP2020061449A (ja
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Priority to JP2018191375A priority Critical patent/JP7089453B2/ja
Priority claimed from JP2018191375A external-priority patent/JP7089453B2/ja
Priority to US16/594,180 priority patent/US20200120798A1/en
Publication of JP2020061449A publication Critical patent/JP2020061449A/ja
Publication of JP2020061449A5 publication Critical patent/JP2020061449A5/ja
Application granted granted Critical
Publication of JP7089453B2 publication Critical patent/JP7089453B2/ja
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JP2018191375A 2018-10-10 2018-10-10 配線基板及びその製造方法 Active JP7089453B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018191375A JP7089453B2 (ja) 2018-10-10 2018-10-10 配線基板及びその製造方法
US16/594,180 US20200120798A1 (en) 2018-10-10 2019-10-07 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018191375A JP7089453B2 (ja) 2018-10-10 2018-10-10 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2020061449A JP2020061449A (ja) 2020-04-16
JP2020061449A5 true JP2020061449A5 (enExample) 2021-11-25
JP7089453B2 JP7089453B2 (ja) 2022-06-22

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ID=70160717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018191375A Active JP7089453B2 (ja) 2018-10-10 2018-10-10 配線基板及びその製造方法

Country Status (2)

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US (1) US20200120798A1 (enExample)
JP (1) JP7089453B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024014927A1 (ko) * 2022-07-14 2024-01-18 주식회사 엘지에너지솔루션 회로 기판, 회로 기판 어셈블리 및 이를 포함하는 디바이스

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193910B1 (en) * 1997-11-11 2001-02-27 Ngk Spark Plug Co., Ltd. Paste for through-hole filling and printed wiring board using the same
CN1199536C (zh) * 1999-10-26 2005-04-27 伊比登株式会社 多层印刷配线板及多层印刷配线板的制造方法
JP2001127439A (ja) 1999-10-27 2001-05-11 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US7629541B2 (en) * 2006-06-19 2009-12-08 Endicott Interconnect Technologies, Inc. High speed interposer
JP5056080B2 (ja) * 2007-03-07 2012-10-24 日本電気株式会社 多層プリント配線板及びその製造方法
JP2009283739A (ja) * 2008-05-23 2009-12-03 Shinko Electric Ind Co Ltd 配線基板および配線基板の製造方法
EP2461659A4 (en) 2009-09-02 2014-08-20 Panasonic Corp FITTED PCB, MULTILAYER BUILT-UP PCB AND MANUFACTURING PROCESS THEREFOR
JP4713682B1 (ja) * 2010-02-25 2011-06-29 パナソニック株式会社 多層配線基板、及び多層配線基板の製造方法
US20110232953A1 (en) 2010-03-29 2011-09-29 Kyocera Corporation Circuit board and structure using the same
JP5585426B2 (ja) * 2010-12-07 2014-09-10 Ｔｄｋ株式会社 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法
JP5895635B2 (ja) * 2012-03-16 2016-03-30 富士通株式会社 配線板の製造方法、配線板およびビアの構造
JP2014175485A (ja) 2013-03-08 2014-09-22 Ibiden Co Ltd 配線板及びその製造方法
JP6164113B2 (ja) 2014-02-19 2017-07-19 味の素株式会社 支持体付き樹脂シート

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