JP2020061436A - ロードポート及びロードポートのfoup蓋異常検知方法 - Google Patents
ロードポート及びロードポートのfoup蓋異常検知方法 Download PDFInfo
- Publication number
- JP2020061436A JP2020061436A JP2018191020A JP2018191020A JP2020061436A JP 2020061436 A JP2020061436 A JP 2020061436A JP 2018191020 A JP2018191020 A JP 2018191020A JP 2018191020 A JP2018191020 A JP 2018191020A JP 2020061436 A JP2020061436 A JP 2020061436A
- Authority
- JP
- Japan
- Prior art keywords
- foup
- lid
- load port
- sensor
- port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
11 本体部
12 支持台
13 蓋部
131 嵌合部
14 パネル部
141 表示部
15 蓋用センサ
151 投光部
152 受光部
15L 光軸
2 FOUP
21 本体
22 蓋
221 被嵌合部
Claims (4)
- 半導体ウエハの搬送のため、半導体処理装置における搬出入口に設けられるロードポートにおいて、
開閉可能なFOUP蓋を有しており内部に半導体ウエハを収納できる容器であるFOUPを支持しつつ、前記搬出入口に対する前後方向へ移動可能とするFOUP支持台と、
前記搬出入口を開閉する蓋部と、
前記FOUPが前記搬出入口に対して所定距離分後退したアンロード完了の時点における、正常時の前記FOUP蓋の位置と閉鎖状態である前記蓋部の位置との間で検知するように設けられたFOUP蓋用センサと、
前記アンロード完了以降において前記FOUP蓋用センサが検知したことを検出する検出部と、を備えることを特徴とするロードポート。 - 前記FOUP蓋用センサが光センサであることを特徴とする、請求項1に記載のロードポート。
- 前記FOUP蓋用センサの光軸が、前後方向に傾斜している、請求項2に記載のロードポート。
- 半導体ウエハの搬送のため、半導体処理装置における搬出入口に設けられるロードポートであって、
開閉可能なFOUP蓋を有しており内部に半導体ウエハを収納できる容器であるFOUPを支持しつつ、前記半導体処理装置の前記搬出入口に対する前後方向へ移動可能とするFOUP支持台と、
前記搬出入口を開閉する蓋部と、
前記FOUPが前記半導体処理装置の前記搬出入口に対して所定距離分後退したアンロード完了の時点における、正常時の前記FOUP蓋の位置と閉鎖状態である前記蓋部の位置との間で検知するように設けられたFOUP蓋用センサと、を備えたロードポートに適用され、
前記FOUP蓋を閉じる工程と、
前記FOUP支持台上で前記FOUPを前記搬出入口に対して後退させる工程と、
前記FOUP蓋用センサにより検知を行う工程と、
を上記記載の順に行う、ロードポートのFOUP蓋異常検知方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018191020A JP7228759B2 (ja) | 2018-10-09 | 2018-10-09 | ロードポート及びロードポートのfoup蓋異常検知方法 |
CN201910945294.8A CN111029285B (zh) | 2018-10-09 | 2019-09-30 | 装载埠和检测装载埠的foup盖的异常的方法 |
TW108135649A TW202014360A (zh) | 2018-10-09 | 2019-10-02 | 裝載埠和檢測裝載埠的foup蓋的異常的方法 |
KR1020190122377A KR20200040667A (ko) | 2018-10-09 | 2019-10-02 | 로드 포트 및 로드 포트의 foup 덮개 이상 검지 방법 |
US16/592,677 US10923377B2 (en) | 2018-10-09 | 2019-10-03 | Load port and method of detecting abnormality in FOUP lid of load port |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018191020A JP7228759B2 (ja) | 2018-10-09 | 2018-10-09 | ロードポート及びロードポートのfoup蓋異常検知方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020061436A true JP2020061436A (ja) | 2020-04-16 |
JP7228759B2 JP7228759B2 (ja) | 2023-02-27 |
Family
ID=70052392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018191020A Active JP7228759B2 (ja) | 2018-10-09 | 2018-10-09 | ロードポート及びロードポートのfoup蓋異常検知方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10923377B2 (ja) |
JP (1) | JP7228759B2 (ja) |
KR (1) | KR20200040667A (ja) |
CN (1) | CN111029285B (ja) |
TW (1) | TW202014360A (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269316A (ja) * | 1999-03-16 | 2000-09-29 | Tdk Corp | クリーン搬送方法及び装置 |
JP2001077177A (ja) * | 1999-06-28 | 2001-03-23 | Tokyo Electron Ltd | ウェハキャリア用蓋体の着脱装置、及びロードポート装置 |
JP2005347576A (ja) * | 2004-06-03 | 2005-12-15 | Hirata Corp | 複数種類の容器に対応可能なfoupオープナ |
JP2014138011A (ja) * | 2013-01-15 | 2014-07-28 | Tokyo Electron Ltd | 基板収納処理装置及び基板収納処理方法並びに基板収納処理用記憶媒体 |
JP2017212322A (ja) * | 2016-05-25 | 2017-11-30 | 信越ポリマー株式会社 | 基板収納容器及びその管理システム並びに基板収納容器の管理方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4238834A1 (en) * | 1991-11-18 | 1993-05-19 | Fusion Systems Corp | Robotic semiconductor wafer transporter with vertical photodetector array - scans detectors to determine which slots are occupied by wafers illuminated from emitter on robot arm |
JP2002110756A (ja) * | 2000-09-22 | 2002-04-12 | Applied Materials Inc | オープンカセット用ロードポート |
JP4118592B2 (ja) * | 2002-04-22 | 2008-07-16 | 富士通株式会社 | ロードポート及び半導体製造装置 |
US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
KR20040063469A (ko) * | 2003-01-07 | 2004-07-14 | 삼성전자주식회사 | 밀폐형 웨이퍼 카세트 로딩/언로딩 설비 |
KR20060007578A (ko) * | 2004-07-20 | 2006-01-26 | 삼성전자주식회사 | 웨이퍼 이송 시스템 |
KR20070001636A (ko) * | 2005-06-29 | 2007-01-04 | 삼성전자주식회사 | 센서가 장착된 도어와 이를 구비한 웨이퍼 처리 장치 |
US8821099B2 (en) * | 2005-07-11 | 2014-09-02 | Brooks Automation, Inc. | Load port module |
JP2010232560A (ja) * | 2009-03-27 | 2010-10-14 | Sinfonia Technology Co Ltd | マッピング機構、foup、及びロードポート |
JP5518513B2 (ja) * | 2010-02-04 | 2014-06-11 | 平田機工株式会社 | フープオープナ及びその動作方法 |
JP6455239B2 (ja) * | 2015-03-06 | 2019-01-23 | シンフォニアテクノロジー株式会社 | ドア開閉装置 |
KR20180087260A (ko) * | 2015-11-30 | 2018-08-01 | 신포니아 테크놀로지 가부시끼가이샤 | 로드 포트 |
TWI756361B (zh) * | 2017-02-22 | 2022-03-01 | 日商東京威力科創股份有限公司 | 基板收納處理裝置、基板收納處理方法及記錄媒體 |
-
2018
- 2018-10-09 JP JP2018191020A patent/JP7228759B2/ja active Active
-
2019
- 2019-09-30 CN CN201910945294.8A patent/CN111029285B/zh active Active
- 2019-10-02 TW TW108135649A patent/TW202014360A/zh unknown
- 2019-10-02 KR KR1020190122377A patent/KR20200040667A/ko not_active Application Discontinuation
- 2019-10-03 US US16/592,677 patent/US10923377B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269316A (ja) * | 1999-03-16 | 2000-09-29 | Tdk Corp | クリーン搬送方法及び装置 |
JP2001077177A (ja) * | 1999-06-28 | 2001-03-23 | Tokyo Electron Ltd | ウェハキャリア用蓋体の着脱装置、及びロードポート装置 |
JP2005347576A (ja) * | 2004-06-03 | 2005-12-15 | Hirata Corp | 複数種類の容器に対応可能なfoupオープナ |
JP2014138011A (ja) * | 2013-01-15 | 2014-07-28 | Tokyo Electron Ltd | 基板収納処理装置及び基板収納処理方法並びに基板収納処理用記憶媒体 |
JP2017212322A (ja) * | 2016-05-25 | 2017-11-30 | 信越ポリマー株式会社 | 基板収納容器及びその管理システム並びに基板収納容器の管理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111029285B (zh) | 2024-05-14 |
CN111029285A (zh) | 2020-04-17 |
KR20200040667A (ko) | 2020-04-20 |
US10923377B2 (en) | 2021-02-16 |
TW202014360A (zh) | 2020-04-16 |
JP7228759B2 (ja) | 2023-02-27 |
US20200111695A1 (en) | 2020-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101877425B1 (ko) | 기판 반송 장치, 기판 반송 방법 및 기억 매체 | |
TWI677933B (zh) | 門開關裝置 | |
TW434167B (en) | Ergonomic, variable size, bottom opening system compatible with a vertical interface | |
US8591163B2 (en) | FOUP opener and operating method thereof | |
US9696262B2 (en) | Substrate processing apparatus, method of operating substrate processing apparatus, and storage medium | |
TWI425590B (zh) | 基板處理裝置及其基板搬送方法 | |
KR20140092249A (ko) | 기판 수납 처리 장치, 기판 수납 처리 방법, 및 기판 수납 처리용 기억 매체 | |
TW201633436A (zh) | 門開閉裝置、搬運裝置、分類裝置、收納容器之開放方法 | |
JP2016072458A (ja) | 基板処理装置および基板処理方法 | |
JP7349240B2 (ja) | 基板倉庫及び基板検査方法 | |
JP7073697B2 (ja) | ロードポート | |
JP2011134898A (ja) | 基板処理装置、基板処理方法及び記憶媒体 | |
US10916463B2 (en) | Substrate processing apparatus, substrate processing method and recording medium | |
JP2012015530A (ja) | 基板処理装置および基板検出方法 | |
JP2020061436A (ja) | ロードポート及びロードポートのfoup蓋異常検知方法 | |
KR101517623B1 (ko) | 로드 포트 | |
JP2010232561A (ja) | ウェーハ検出機構、及びfoup | |
US20220367223A1 (en) | Substrate transport apparatus and substrate transport method | |
JP2013084682A (ja) | 加工装置 | |
JP2006261502A (ja) | 基板処理装置 | |
KR200188482Y1 (ko) | 스탠더드 메커니컬 인터페이스 시스템 | |
KR20230021892A (ko) | 기판 검사 장치 및 기판 검사 방법 | |
KR20230101645A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
JP2004253507A (ja) | 局所クリーン化ウエハ処理装置 | |
KR20070076208A (ko) | 웨이퍼 수납용 캐리어. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210817 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220728 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220805 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220926 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230113 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230126 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7228759 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |