JP2020057794A5 - - Google Patents

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JP2020057794A5
JP2020057794A5 JP2019217783A JP2019217783A JP2020057794A5 JP 2020057794 A5 JP2020057794 A5 JP 2020057794A5 JP 2019217783 A JP2019217783 A JP 2019217783A JP 2019217783 A JP2019217783 A JP 2019217783A JP 2020057794 A5 JP2020057794 A5 JP 2020057794A5
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Japan
Prior art keywords
vapor chamber
integrally formed
electronic heating
heat
wick structure
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JP2019217783A
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Japanese (ja)
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JP6880159B2 (ja
JP2020057794A (ja
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Priority claimed from US14/592,387 external-priority patent/US10660236B2/en
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JP2019217783A 2014-04-08 2019-12-02 温度管理用の付加的製造を用いるためのシステムおよび方法 Active JP6880159B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201461976649P 2014-04-08 2014-04-08
US61/976,649 2014-04-08
US14/592,387 2015-01-08
US14/592,387 US10660236B2 (en) 2014-04-08 2015-01-08 Systems and methods for using additive manufacturing for thermal management

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JP2015076415A Division JP6824596B2 (ja) 2014-04-08 2015-04-03 温度管理用の付加的製造を用いるためのシステムおよび方法

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JP2020057794A JP2020057794A (ja) 2020-04-09
JP2020057794A5 true JP2020057794A5 (enExample) 2020-05-21
JP6880159B2 JP6880159B2 (ja) 2021-06-02

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JP2015076415A Active JP6824596B2 (ja) 2014-04-08 2015-04-03 温度管理用の付加的製造を用いるためのシステムおよび方法
JP2019217783A Active JP6880159B2 (ja) 2014-04-08 2019-12-02 温度管理用の付加的製造を用いるためのシステムおよび方法

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US (3) US10660236B2 (enExample)
EP (3) EP4368395A3 (enExample)
JP (2) JP6824596B2 (enExample)
KR (1) KR20150116775A (enExample)
BR (1) BR102015007112A2 (enExample)

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