JP6824596B2 - 温度管理用の付加的製造を用いるためのシステムおよび方法 - Google Patents
温度管理用の付加的製造を用いるためのシステムおよび方法 Download PDFInfo
- Publication number
- JP6824596B2 JP6824596B2 JP2015076415A JP2015076415A JP6824596B2 JP 6824596 B2 JP6824596 B2 JP 6824596B2 JP 2015076415 A JP2015076415 A JP 2015076415A JP 2015076415 A JP2015076415 A JP 2015076415A JP 6824596 B2 JP6824596 B2 JP 6824596B2
- Authority
- JP
- Japan
- Prior art keywords
- steam chamber
- heat
- steam
- chassis
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461976649P | 2014-04-08 | 2014-04-08 | |
| US61/976,649 | 2014-04-08 | ||
| US14/592,387 | 2015-01-08 | ||
| US14/592,387 US10660236B2 (en) | 2014-04-08 | 2015-01-08 | Systems and methods for using additive manufacturing for thermal management |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019217783A Division JP6880159B2 (ja) | 2014-04-08 | 2019-12-02 | 温度管理用の付加的製造を用いるためのシステムおよび方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016076684A JP2016076684A (ja) | 2016-05-12 |
| JP6824596B2 true JP6824596B2 (ja) | 2021-02-03 |
Family
ID=52824092
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015076415A Active JP6824596B2 (ja) | 2014-04-08 | 2015-04-03 | 温度管理用の付加的製造を用いるためのシステムおよび方法 |
| JP2019217783A Active JP6880159B2 (ja) | 2014-04-08 | 2019-12-02 | 温度管理用の付加的製造を用いるためのシステムおよび方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019217783A Active JP6880159B2 (ja) | 2014-04-08 | 2019-12-02 | 温度管理用の付加的製造を用いるためのシステムおよび方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US10660236B2 (enExample) |
| EP (3) | EP4368395A3 (enExample) |
| JP (2) | JP6824596B2 (enExample) |
| KR (1) | KR20150116775A (enExample) |
| BR (1) | BR102015007112A2 (enExample) |
Families Citing this family (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| EP2527776A1 (en) | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
| US10732241B2 (en) | 2013-04-09 | 2020-08-04 | GE Precision Healthcare LLC | System and method for manufacturing magnetic resonance imaging gradient coil assemblies |
| US9357670B2 (en) * | 2014-02-18 | 2016-05-31 | Lockheed Martin Corporation | Efficient heat transfer from conduction-cooled circuit cards |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| GB2536603B (en) * | 2014-10-07 | 2021-02-17 | Aker Solutions Ltd | Subsea electronic device |
| US10356945B2 (en) | 2015-01-08 | 2019-07-16 | General Electric Company | System and method for thermal management using vapor chamber |
| US10117357B2 (en) * | 2015-07-20 | 2018-10-30 | Futurewei Technologies, Inc. | Stationary cooling structure for board/chassis-level conduction cooling |
| US9575521B1 (en) * | 2015-07-30 | 2017-02-21 | Dell Products L.P. | Chassis external wall liquid cooling system |
| US10386127B2 (en) | 2015-09-09 | 2019-08-20 | General Electric Company | Thermal management system |
| US10634397B2 (en) | 2015-09-17 | 2020-04-28 | Purdue Research Foundation | Devices, systems, and methods for the rapid transient cooling of pulsed heat sources |
| GB2543790A (en) * | 2015-10-28 | 2017-05-03 | Sustainable Engine Systems Ltd | Pin fin heat exchanger |
| US10136557B2 (en) * | 2015-12-04 | 2018-11-20 | General Electric Company | Thermal management systems and methods for heat generating electronics |
| CN105451519B (zh) * | 2015-12-09 | 2018-06-29 | 安徽鑫发铝业有限公司 | 一种散热器用铝合金型材 |
| CN106935461B (zh) * | 2015-12-30 | 2018-11-02 | 核工业北京地质研究院 | 一种基于带电粒子在电场中定向沉积的增材制造方法 |
| US10146275B2 (en) | 2016-02-17 | 2018-12-04 | Microsoft Technology Licensing, Llc | 3D printed thermal management system |
| CN105722379B (zh) * | 2016-04-29 | 2019-04-19 | 华为技术有限公司 | 散热系统及具有所述散热系统的通讯设备 |
| US10955199B2 (en) * | 2016-05-30 | 2021-03-23 | Saab Ab | Cooling device with evenly distributed and directed cooling effect for high heat flux and deaeration functionality |
| US10539345B2 (en) * | 2016-06-02 | 2020-01-21 | Hamilton Sundstrand Corporation | Sublimator having a porous plate with integral primary and secondary heat transfer surfaces |
| US10948240B2 (en) * | 2016-06-16 | 2021-03-16 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
| US10209009B2 (en) | 2016-06-21 | 2019-02-19 | General Electric Company | Heat exchanger including passageways |
| EP3279597B1 (en) * | 2016-08-04 | 2022-09-28 | General Electric Company | METHOD FOR MANUFACTURING A SYSTEM FOR THERMAL
MANAGEMENT USING VAPOR CHAMBER |
| US9974157B2 (en) * | 2016-08-15 | 2018-05-15 | General Electric Company | Circuit card cartridge for an electronic system |
| US10018427B2 (en) * | 2016-09-08 | 2018-07-10 | Taiwan Microloops Corp. | Vapor chamber structure |
| DE102016217236A1 (de) | 2016-09-09 | 2018-03-15 | Zf Friedrichshafen Ag | Elektronikanordnung |
| US12104856B2 (en) * | 2016-10-19 | 2024-10-01 | Kelvin Thermal Technologies, Inc. | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems |
| US20180156545A1 (en) * | 2016-12-05 | 2018-06-07 | Microsoft Technology Licensing, Llc | Vapor chamber with three-dimensional printed spanning structure |
| US20180184550A1 (en) | 2016-12-28 | 2018-06-28 | Microsoft Technology Licensing, Llc | Metal additive structures on printed circuit boards |
| EP3446555B1 (en) * | 2017-01-10 | 2019-09-11 | Aselsan Elektronik Sanayi ve Ticaret Anonim Sirketi | A cooling system |
| JP6742504B2 (ja) * | 2017-03-07 | 2020-08-19 | 株式会社Ihi | 航空機用放熱器 |
| CN113720185B (zh) | 2017-05-08 | 2024-11-15 | 开文热工科技公司 | 热管理平面 |
| US10203169B2 (en) | 2017-06-12 | 2019-02-12 | Microsoft Technology Licensing, Llc | Thermal management devices, systems and methods |
| US10405463B2 (en) * | 2017-06-16 | 2019-09-03 | Qualcomm Incorporated | Multi-rotor aerial drone with vapor chamber |
| US20190082560A1 (en) | 2017-09-08 | 2019-03-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods for additive manufacturing of wick structure for vapor chamber |
| JP6924380B2 (ja) * | 2017-09-25 | 2021-08-25 | セイコーエプソン株式会社 | 三次元造形物の製造装置及び三次元造形物の製造方法 |
| US10458718B2 (en) * | 2017-11-29 | 2019-10-29 | Asia Vital Components Co., Ltd. | Airtight penetration structure for heat dissipation device |
| TWM577129U (zh) * | 2017-12-13 | 2019-04-21 | 奇鋐科技股份有限公司 | 散熱裝置單體及其散熱裝置 |
| US10746479B2 (en) * | 2018-02-09 | 2020-08-18 | General Electric Company | Additively manufactured structures for thermal and/or mechanical systems, and methods for manufacturing the structures |
| US10983145B2 (en) * | 2018-04-24 | 2021-04-20 | Teradyne, Inc. | System for testing devices inside of carriers |
| US11122715B2 (en) | 2018-05-11 | 2021-09-14 | General Electric Company | Conformal heat pipe assemblies |
| JP6801698B2 (ja) * | 2018-09-04 | 2020-12-16 | セイコーエプソン株式会社 | 冷却装置及びプロジェクター |
| WO2020068133A1 (en) * | 2018-09-29 | 2020-04-02 | Hewlett-Packard Development Company, L.P. | Break away support for 3d printing |
| CN109292859B (zh) * | 2018-10-29 | 2020-02-21 | 山东大学 | 一种板式冷凝换热器及其海水淡化系统 |
| CN109630097A (zh) * | 2018-12-05 | 2019-04-16 | 西安石油大学 | 一种井下热组件温度管理系统及方法 |
| US12396709B2 (en) | 2018-12-07 | 2025-08-26 | General Electric Company | Ultrasound probe and method of making the same |
| US20210307202A1 (en) * | 2018-12-12 | 2021-09-30 | Magna International Inc. | Additive manufactured heat sink |
| JP7164618B2 (ja) * | 2019-07-12 | 2022-11-01 | 華為技術有限公司 | インテリジェント車両における車載コンピュータ装置及びインテリジェント車両 |
| EP3813098B1 (en) * | 2019-10-25 | 2025-12-03 | ABB Schweiz AG | Vapor chamber |
| US11260976B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System for reducing thermal stresses in a leading edge of a high speed vehicle |
| US11427330B2 (en) | 2019-11-15 | 2022-08-30 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11267551B2 (en) | 2019-11-15 | 2022-03-08 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11260953B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11352120B2 (en) | 2019-11-15 | 2022-06-07 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| FR3103582B1 (fr) * | 2019-11-21 | 2022-12-16 | Safran Electronics & Defense | Calculateur embarqué avec entreproseur sur la puce microprocesseur |
| JP6926183B2 (ja) * | 2019-12-19 | 2021-08-25 | 東芝電波プロダクツ株式会社 | 放熱器 |
| CN115088400A (zh) | 2020-02-12 | 2022-09-20 | 麦格纳国际公司 | 增材制造的散热装置 |
| US11946699B2 (en) * | 2020-03-19 | 2024-04-02 | Asia Vital Components (Shen Zhen) Co., Ltd. | Bendable vapor chamber structure |
| CN111473679A (zh) * | 2020-03-30 | 2020-07-31 | 上海卫星装备研究所 | 基于3d打印技术的微流道集热器 |
| US11810836B2 (en) | 2020-06-09 | 2023-11-07 | Arista Networks, Inc. | Systems for providing thermal management to integrated circuits |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
| US12040690B2 (en) | 2020-08-31 | 2024-07-16 | General Electric Company | Cooling a stator housing of an electric machine |
| CN112285452B (zh) * | 2020-09-10 | 2023-03-03 | 河北工业大学 | 一种测量电学参数低温特性的装置和方法 |
| US11776875B2 (en) | 2020-11-13 | 2023-10-03 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems including a vapor chamber as the heat spreading substrate of a power device embedded in a PCB and methods of forming the same |
| CN112351660B (zh) * | 2020-11-20 | 2023-04-14 | 中国电子科技集团公司第二十九研究所 | 一种低气动阻力蒙皮换热装置及其设计方法 |
| US11745847B2 (en) | 2020-12-08 | 2023-09-05 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11407488B2 (en) | 2020-12-14 | 2022-08-09 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| WO2022146226A1 (en) * | 2020-12-30 | 2022-07-07 | Razer (Asia-Pacific) Pte. Ltd. | Vapor chamber having a reservoir |
| US11577817B2 (en) | 2021-02-11 | 2023-02-14 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| JP7666033B2 (ja) * | 2021-03-12 | 2025-04-22 | 株式会社リコー | ウィック |
| EP4114159A1 (de) * | 2021-06-29 | 2023-01-04 | Siemens Aktiengesellschaft | Vorrichtung zur wärmeableitung von in einem elektronikgehäuse angeordneten mikroelektronischen bauteilen |
| US12156344B2 (en) * | 2021-07-09 | 2024-11-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods of 3D-printing a circuit board on a heat sink assembly having power devices bonded thereto |
| US12219690B2 (en) | 2021-08-31 | 2025-02-04 | Arista Networks, Inc. | Damper system for a lidless integrated circuit |
| US12135152B2 (en) | 2021-11-03 | 2024-11-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Evaporator assemblies, vapor chambers, and methods for fabricating vapor chambers |
| US12439556B2 (en) * | 2021-12-20 | 2025-10-07 | Frore Systems Inc. | MEMS-based system for cooling a vapor chamber |
| US12355043B2 (en) | 2022-04-06 | 2025-07-08 | Ford Global Technologies, Llc | Thermal management structure for battery array |
| US12144156B2 (en) * | 2022-05-14 | 2024-11-12 | Hamilton Sundstrand Corporation | Cooling for power distribution systems |
| TWI817584B (zh) * | 2022-06-27 | 2023-10-01 | 奇鋐科技股份有限公司 | 均溫板結構 |
| US20250321061A1 (en) * | 2022-07-15 | 2025-10-16 | Barry Richard Brooks | Modular thermal energy storage and transfer in a pcm hosting system |
| US20240240874A1 (en) * | 2023-01-18 | 2024-07-18 | Cisco Technology, Inc. | Multiple wick section heatpipe for effective heat transfer |
| US12246647B2 (en) | 2023-06-16 | 2025-03-11 | Magna Mirrors Of America, Inc. | Vehicular interior rearview mirror assembly with heatsink |
| US20250107046A1 (en) * | 2023-09-25 | 2025-03-27 | Microsoft Technology Licensing, Llc | Systems and methods for thermal management of electronic devices |
Family Cites Families (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1605405A (en) | 1977-07-22 | 1995-07-19 | Rolls Royce | Heat pipes |
| US4366526A (en) * | 1980-10-03 | 1982-12-28 | Grumman Aerospace Corporation | Heat-pipe cooled electronic circuit card |
| GB2090333B (en) | 1980-12-18 | 1984-04-26 | Rolls Royce | Gas turbine engine shroud/blade tip control |
| US4771365A (en) | 1987-10-30 | 1988-09-13 | Honeywell Inc. | Passive cooled electronic chassis |
| US5181167A (en) | 1991-12-02 | 1993-01-19 | Sun Microsystems, Inc. | Stacking heatpipe for three dimensional electronic packaging |
| US5227957A (en) | 1992-05-14 | 1993-07-13 | Deters John B | Modular computer system with passive backplane |
| US5579830A (en) | 1995-11-28 | 1996-12-03 | Hudson Products Corporation | Passive cooling of enclosures using heat pipes |
| JPH10267571A (ja) | 1997-03-20 | 1998-10-09 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとそれを用いた冷却構造 |
| US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
| US5975841A (en) | 1997-10-03 | 1999-11-02 | Thermal Corp. | Heat pipe cooling for turbine stators |
| US6430931B1 (en) | 1997-10-22 | 2002-08-13 | General Electric Company | Gas turbine in-line intercooler |
| JP3332858B2 (ja) * | 1998-07-17 | 2002-10-07 | 古河電気工業株式会社 | 板型ヒートパイプとそれを用いた冷却構造 |
| TW379824U (en) | 1998-12-28 | 2000-01-11 | Foxconn Prec Components Co Ltd | Heat radiating apparatus |
| US6237223B1 (en) * | 1999-05-06 | 2001-05-29 | Chip Coolers, Inc. | Method of forming a phase change heat sink |
| US6490160B2 (en) | 1999-07-15 | 2002-12-03 | Incep Technologies, Inc. | Vapor chamber with integrated pin array |
| US6359218B1 (en) | 2000-04-04 | 2002-03-19 | Sun Microsystems, Inc. | Modular and expandable enclosure for electronic equipment |
| US6392883B1 (en) | 2000-06-30 | 2002-05-21 | Intel Corporation | Heat exchanger having phase change material for a portable computing device |
| US6624349B1 (en) | 2000-11-08 | 2003-09-23 | Hi-Z Technology, Inc. | Heat of fusion phase change generator |
| US6618250B2 (en) | 2001-08-30 | 2003-09-09 | Ericsson Inc. | Modular electronics enclosure |
| US7473995B2 (en) | 2002-03-25 | 2009-01-06 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
| US6631755B1 (en) | 2002-07-17 | 2003-10-14 | Compal Electronics, Inc. | Thermal module with temporary heat storage |
| JP2004146627A (ja) * | 2002-10-25 | 2004-05-20 | Noritz Corp | 発熱部品の放熱構造 |
| US6990797B2 (en) | 2003-09-05 | 2006-01-31 | General Electric Company | Methods and apparatus for operating gas turbine engines |
| TWM309091U (en) * | 2004-03-15 | 2007-04-01 | Delta Electronics Inc | Heat sink |
| US7189064B2 (en) | 2004-05-14 | 2007-03-13 | General Electric Company | Friction stir welded hollow airfoils and method therefor |
| US7002247B2 (en) * | 2004-06-18 | 2006-02-21 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
| US7377098B2 (en) | 2004-08-26 | 2008-05-27 | United Technologies Corporation | Gas turbine engine frame with an integral fluid reservoir and air/fluid heat exchanger |
| US20060042224A1 (en) | 2004-08-30 | 2006-03-02 | Daw Shien Scientific Research & Development, Inc. | Dual-plasma jet thruster with fuel cell |
| US7256992B1 (en) | 2004-08-31 | 2007-08-14 | Sun Microsystems, Inc. | System for mounting and cooling circuit boards |
| US7848624B1 (en) * | 2004-10-25 | 2010-12-07 | Alliant Techsystems Inc. | Evaporator for use in a heat transfer system |
| CN101147038A (zh) | 2005-06-24 | 2008-03-19 | 嘉合科技有限公司 | 传热装置 |
| CN100552365C (zh) * | 2005-11-18 | 2009-10-21 | 富准精密工业(深圳)有限公司 | 热管 |
| CN100561105C (zh) * | 2006-02-17 | 2009-11-18 | 富准精密工业(深圳)有限公司 | 热管 |
| US20100200199A1 (en) | 2006-03-03 | 2010-08-12 | Illuminex Corporation | Heat Pipe with Nanostructured Wick |
| US7369410B2 (en) | 2006-05-03 | 2008-05-06 | International Business Machines Corporation | Apparatuses for dissipating heat from semiconductor devices |
| TWI289655B (en) | 2006-06-23 | 2007-11-11 | Foxconn Tech Co Ltd | Heat pipe |
| US7900438B2 (en) | 2006-07-28 | 2011-03-08 | General Electric Company | Heat transfer system and method for turbine engine using heat pipes |
| US8176972B2 (en) * | 2006-08-31 | 2012-05-15 | International Business Machines Corporation | Compliant vapor chamber chip packaging |
| US8056345B2 (en) | 2007-06-13 | 2011-11-15 | United Technologies Corporation | Hybrid cooling of a gas turbine engine |
| US20090040726A1 (en) * | 2007-08-09 | 2009-02-12 | Paul Hoffman | Vapor chamber structure and method for manufacturing the same |
| TW200912237A (en) | 2007-09-13 | 2009-03-16 | Univ Tamkang | Thermal spreader with enhancement of support strength and capillarity |
| US8475112B1 (en) | 2007-11-29 | 2013-07-02 | Florida Turbine Technologies, Inc. | Multiple staged compressor with last stage airfoil cooling |
| US7907409B2 (en) | 2008-03-25 | 2011-03-15 | Raytheon Company | Systems and methods for cooling a computing component in a computing rack |
| US8616266B2 (en) * | 2008-09-12 | 2013-12-31 | Rockwell Collins, Inc. | Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid |
| US20100006132A1 (en) * | 2008-07-14 | 2010-01-14 | Lucent Technologies, Inc. | Stacked Thermoelectric Modules |
| US7928562B2 (en) | 2008-07-22 | 2011-04-19 | International Business Machines Corporation | Segmentation of a die stack for 3D packaging thermal management |
| FR2938323B1 (fr) | 2008-11-12 | 2010-12-24 | Astrium Sas | Dispositif de regulation thermique a reseau de caloducs capillaires interconnectes |
| JP4706754B2 (ja) * | 2008-12-24 | 2011-06-22 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
| CN101782342B (zh) * | 2009-01-16 | 2013-03-20 | 富瑞精密组件(昆山)有限公司 | 热管及其毛细结构的制作方法 |
| US20100320187A1 (en) | 2009-06-17 | 2010-12-23 | Drs Test & Energy Management, Llc | Heat Sink and Thermal Plate Apparatus for Electronic Components |
| IN2012DN01366A (enExample) | 2009-07-17 | 2015-06-05 | Sheetak Inc | |
| GB0919934D0 (en) | 2009-11-16 | 2009-12-30 | Sunamp Ltd | Energy storage systems |
| GB2476253A (en) | 2009-12-17 | 2011-06-22 | Rolls Royce Plc | Fuel Injector Cooled by a Heat Pipe |
| GB2476501B (en) | 2009-12-24 | 2012-07-18 | Richard John Edward Aras | Geodesic massively-parallel supercomputer |
| US9546826B1 (en) * | 2010-01-21 | 2017-01-17 | Hrl Laboratories, Llc | Microtruss based thermal heat spreading structures |
| US8921702B1 (en) * | 2010-01-21 | 2014-12-30 | Hrl Laboratories, Llc | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments |
| US20110232877A1 (en) * | 2010-03-23 | 2011-09-29 | Celsia Technologies Taiwan, Inc. | Compact vapor chamber and heat-dissipating module having the same |
| US8616834B2 (en) | 2010-04-30 | 2013-12-31 | General Electric Company | Gas turbine engine airfoil integrated heat exchanger |
| US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
| US8466486B2 (en) | 2010-08-27 | 2013-06-18 | Tsmc Solid State Lighting Ltd. | Thermal management system for multiple heat source devices |
| TWM412341U (en) | 2011-04-01 | 2011-09-21 | Academia Sinica | Cooling system for electronic instrument cabinet |
| US20140090808A1 (en) | 2011-05-17 | 2014-04-03 | Sharp Kabushiki Kaisha | Heat-transfer device |
| EP2527776A1 (en) * | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
| DE102011086786B3 (de) * | 2011-11-22 | 2013-03-28 | Mtu Aero Engines Gmbh | Kühlgehäuse und Herstellungsverfahren |
| WO2013097031A2 (en) | 2011-12-29 | 2013-07-04 | 7837003 Canada Inc. | Extraction from large thermal storage systems using phase change materials and latent heat exchangers |
| US9548504B2 (en) | 2012-01-24 | 2017-01-17 | University Of Connecticut | Utilizing phase change material, heat pipes, and fuel cells for aircraft applications |
| US20140284020A1 (en) | 2012-01-24 | 2014-09-25 | The Boeing Company | Energy storage and thermal management using phase change materials in conjunction with heat pipes and foils, foams or other porous media |
| US8937384B2 (en) | 2012-04-25 | 2015-01-20 | Qualcomm Incorporated | Thermal management of integrated circuits using phase change material and heat spreaders |
| JP6191137B2 (ja) * | 2012-05-14 | 2017-09-06 | 富士通株式会社 | 冷却装置 |
| FR2995877B1 (fr) | 2012-09-21 | 2014-10-24 | Thales Sa | Structure meca-thermique adaptee pour un environnement spatial |
| EP2713132A1 (en) * | 2012-09-26 | 2014-04-02 | Alcatel Lucent | A vapor-based heat transfer apparatus |
| US9404392B2 (en) | 2012-12-21 | 2016-08-02 | Elwha Llc | Heat engine system |
| US20140268831A1 (en) * | 2013-03-12 | 2014-09-18 | Jun Zhan Technology Co., Ltd. | Heat dissipating device and illumination device having the same |
| US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
| US9863716B2 (en) | 2013-07-26 | 2018-01-09 | Hamilton Sundstrand Corporation | Heat exchanger with embedded heat pipes |
| US20150040888A1 (en) | 2013-08-08 | 2015-02-12 | Solarno, Inc. | Integration of phase change materials inside evacuated tube solar collector for storage and transfer of thermal energy |
| CN104776740A (zh) | 2014-01-14 | 2015-07-15 | 江苏格业新材料科技有限公司 | 一种铜粉和氧化铜粉复合制备高效微型热管的方法 |
| US20150237762A1 (en) * | 2014-02-20 | 2015-08-20 | Raytheon Company | Integrated thermal management system |
| US9476651B2 (en) | 2014-12-15 | 2016-10-25 | General Electric Company | Thermal management system |
| US9909448B2 (en) | 2015-04-15 | 2018-03-06 | General Electric Company | Gas turbine engine component with integrated heat pipe |
| US10386127B2 (en) | 2015-09-09 | 2019-08-20 | General Electric Company | Thermal management system |
| US10746479B2 (en) * | 2018-02-09 | 2020-08-18 | General Electric Company | Additively manufactured structures for thermal and/or mechanical systems, and methods for manufacturing the structures |
-
2015
- 2015-01-08 US US14/592,387 patent/US10660236B2/en active Active
- 2015-03-26 KR KR1020150042527A patent/KR20150116775A/ko not_active Ceased
- 2015-03-30 BR BR102015007112-4A patent/BR102015007112A2/pt not_active Application Discontinuation
- 2015-04-03 JP JP2015076415A patent/JP6824596B2/ja active Active
- 2015-04-07 EP EP24166693.2A patent/EP4368395A3/en active Pending
- 2015-04-07 EP EP20163552.1A patent/EP3702884B1/en active Active
- 2015-04-07 EP EP15162670.2A patent/EP2930587B1/en active Active
-
2019
- 2019-12-02 JP JP2019217783A patent/JP6880159B2/ja active Active
-
2020
- 2020-04-10 US US16/845,381 patent/US12150279B2/en active Active
-
2024
- 2024-10-18 US US18/919,998 patent/US20250048594A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP6880159B2 (ja) | 2021-06-02 |
| EP3702884A1 (en) | 2020-09-02 |
| US12150279B2 (en) | 2024-11-19 |
| US20150289413A1 (en) | 2015-10-08 |
| JP2016076684A (ja) | 2016-05-12 |
| EP3702884B1 (en) | 2024-05-29 |
| EP2930587A1 (en) | 2015-10-14 |
| KR20150116775A (ko) | 2015-10-16 |
| JP2020057794A (ja) | 2020-04-09 |
| BR102015007112A2 (pt) | 2017-11-28 |
| US10660236B2 (en) | 2020-05-19 |
| EP2930587B1 (en) | 2020-03-18 |
| EP4368395A3 (en) | 2024-08-07 |
| US20250048594A1 (en) | 2025-02-06 |
| EP4368395A2 (en) | 2024-05-15 |
| US20200281095A1 (en) | 2020-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6880159B2 (ja) | 温度管理用の付加的製造を用いるためのシステムおよび方法 | |
| US10356945B2 (en) | System and method for thermal management using vapor chamber | |
| EP3279597B1 (en) | METHOD FOR MANUFACTURING A SYSTEM FOR THERMAL
MANAGEMENT USING VAPOR CHAMBER | |
| US10136557B2 (en) | Thermal management systems and methods for heat generating electronics | |
| CN111630470B (zh) | 模块化计算机冷却系统 | |
| CN114303037B (zh) | 再入式流体冷板 | |
| US7764494B2 (en) | Liquid cooled module | |
| US9578781B2 (en) | Heat management for electronic enclosures | |
| US11085703B2 (en) | Heatsink | |
| CN106358420B (zh) | 散热模块 | |
| US20130056178A1 (en) | Ebullient cooling device | |
| US7561425B2 (en) | Encapsulated multi-phase electronics heat-sink | |
| EP3764395A1 (en) | Heat sink | |
| EP3758057A1 (en) | Heatsink | |
| EP3633305A1 (en) | Additively manufactured cooling assemblies for thermal and/or mechanical systems, and methods for manufacturing the assemblies | |
| CN110869689A (zh) | 吸液芯结构体及收纳有吸液芯结构体的热管 | |
| WO2020213464A1 (ja) | ヒートシンク | |
| US20180177072A1 (en) | Electronics chassis assembly | |
| CN218585974U (zh) | 散热器 | |
| JP5874935B2 (ja) | 平板型冷却装置及びその使用方法 | |
| US20240260234A1 (en) | Heat sink | |
| Zimbeck et al. | Ceramic Flat Plate Evaporator for Loop Heat Pipe Cooling of Electronics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180316 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181115 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181127 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190226 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20190326 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190730 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191202 |
|
| C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20191202 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20191211 |
|
| C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20191217 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20200214 |
|
| C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20200218 |
|
| C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20200616 |
|
| C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20200721 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201021 |
|
| C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20201117 |
|
| C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20201215 |
|
| C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20201215 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210113 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6824596 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |