JP2020053417A - 基板搬送方法及び基板搬送モジュール - Google Patents
基板搬送方法及び基板搬送モジュール Download PDFInfo
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
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- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
Description
前記基板の下面を支持して昇降及び水平方向に移動する基板支持部を備える搬送機構により、前記載置部に載置された前記搬送容器と前記筐体内との間で前記基板を搬送する搬送工程と、
前記載置工程及び搬送工程を行う前に、前記載置部に載置される前記搬送容器内における基板の基準高さを取得する基準高さ取得工程と、
前記基準高さ取得工程及び前記載置工程の後で前記搬送工程の前に行われ、前記載置部に載置された前記搬送容器内の基板の高さをセンサ部により検出する高さ検出工程と、
続いて前記搬送容器内の一の基板についての前記高さ検出工程において検出された基板の高さと前記基準高さとの差分に対応する第1の差分値を取得する工程と、
然る後、予め設定された高さ間隔と前記第1の差分値とに基づき、前記一の基板の基準高さに対応する第1の進入高さと、当該第1の進入高さを第1の差分値に応じて補正した第2の進入高さと、のうちのいずれの高さで当該基板支持部を前記搬送容器内に進入させるかを決定する進入高さ決定工程と、
決定した進入高さで前記基板支持部を前記搬送容器内に進入させて前記一の基板を受け取る受け取り工程と、
を備える。
B 搬送容器
B3 基板取り出し口
P0 基準高さ
P1 検出高さ
W ウエハ
3 ローダーモジュール
31 筐体
4 搬送機構
45 基板支持部
46 センサ部
51 搬送口
Claims (5)
- 複数の基板を上下に段をなすように格納する搬送容器を、当該搬送容器の側方に開口した基板取り出し口が筐体の側壁に開口する基板搬送口に重なるように、当該筐体の外側に設けられる載置部に載置する載置工程と、
前記基板の下面を支持して昇降及び水平方向に移動する基板支持部を備える搬送機構により、前記載置部に載置された前記搬送容器と前記筐体内との間で前記基板を搬送する搬送工程と、
前記載置工程及び搬送工程を行う前に、前記載置部に載置される前記搬送容器内における各基板の基準高さを取得する基準高さ取得工程と、
前記基準高さ取得工程及び前記載置工程の後で前記搬送工程の前に行われ、前記載置部に載置された前記搬送容器内の各基板の高さをセンサ部により検出する高さ検出工程と、
続いて前記搬送容器内の一の基板についての前記高さ検出工程において検出された基板の高さと前記基準高さとの差分に対応する第1の差分値を取得する工程と、
然る後、予め設定された高さ間隔と前記第1の差分値とに基づき、前記一の基板の基準高さに対応する第1の進入高さと、当該第1の進入高さを第1の差分値に応じて補正した第2の進入高さと、のうちのいずれの高さで当該基板支持部を前記搬送容器内に進入させるかを決定する進入高さ決定工程と、
決定した進入高さで前記基板支持部を前記搬送容器内に進入させて前記一の基板を受け取る受け取り工程と、
を備える基板搬送方法。 - 前記進入高さ決定工程は、
前記予め設定された高さ間隔と前記第1の差分値との差分に対応する第2の差分値を取得し、当該第2の差分値に基づいて、前記第1の進入高さと、前記第2の進入高さと、のうちのいずれの高さで前記基板支持部を前記搬送容器内に進入させるかを決定する工程を含む請求項1記載の基板搬送方法。 - 前記第1の差分値は前記高さ検出工程において検出された前記基板の高さと前記基準高さとの差分であり、
前記進入高さ決定工程は、
第1の差分値−予め設定された高さ間隔≦0であるときは前記第1の進入高さに、
第1の差分値−予め設定された高さ間隔>0であるときは前記第2の進入高さに、夫々
前記基板支持部の進入高さを決定する工程を含む請求項2記載の基板搬送方法。 - 前記搬送容器内の各基板について、前記第1の差分値を取得する工程、前記進入高さ決定工程、及び前記受け取り工程が行われる請求項1ないし3のいずれか一つに記載の基板搬送方法。
- 側壁に基板搬送口が設けられた筐体と、
複数の基板を上下に段をなすように格納する搬送容器を、当該搬送容器の側方に開口した基板取り出し口が前記基板搬送口に重なるように前記筐体の外側に載置する載置部と、
前記基板の下面を支持して昇降及び水平方向に移動する基板支持部を備え、前記搬送容器と前記筐体内との間で前記基板を搬送する搬送機構と、
前記載置部に載置された前記搬送容器に格納される各基板を前記基板支持部が受け取るために当該各基板の高さを検出するセンサ部と、
前記載置部に載置された前記搬送容器に格納される前記各基板の基準高さが記憶される記憶部と、
前記載置部に載置された前記搬送容器内の一の基板についての前記センサ部により検出された基板の高さと前記基準高さとの差分に対応する第1の差分値を取得するステップと、然る後、予め設定された高さ間隔と前記第1の差分値とに基づき、前記一の基板の基準高さに対応する第1の進入高さと、当該第1の進入高さを第1の差分値に応じて補正した第2の進入高さと、のうちのいずれの高さで当該基板支持部を前記搬送容器内に進入させるかを決定する進入高さ決定ステップと、を実施し、決定した進入高さで前記基板支持部を前記搬送容器内に進入させて当該一の基板を受け取り、前記筐体内へと搬送するように制御信号を出力する制御部と、
を備える基板搬送モジュール。
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JP2018177798A JP7151318B2 (ja) | 2018-09-21 | 2018-09-21 | 基板搬送方法及び基板搬送モジュール |
KR1020190113927A KR102307930B1 (ko) | 2018-09-21 | 2019-09-17 | 기판 반송 방법 및 기판 반송 모듈 |
US16/577,676 US11088001B2 (en) | 2018-09-21 | 2019-09-20 | Substrate transfer method and substrate transfer module |
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US11004713B2 (en) * | 2019-05-16 | 2021-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot arm device and method for transferring wafer |
JP7362308B2 (ja) * | 2019-06-17 | 2023-10-17 | 株式会社ディスコ | 加工装置 |
JP7324667B2 (ja) * | 2019-09-20 | 2023-08-10 | 株式会社Screenホールディングス | 基板処理装置 |
TWM600933U (zh) * | 2020-05-07 | 2020-09-01 | 鈦昇科技股份有限公司 | 晶圓裝卸機 |
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KR20220002375U (ko) | 2021-03-26 | 2022-10-05 | 신에츠 폴리머 가부시키가이샤 | 패널 수납 용기 |
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