JP2020050860A - フッ素樹脂組成物及びこれを使用するプリプレグと銅張基板 - Google Patents
フッ素樹脂組成物及びこれを使用するプリプレグと銅張基板 Download PDFInfo
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- fluororesin composition
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- fluororesin
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- copper
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 229910052731 fluorine Inorganic materials 0.000 title claims abstract description 12
- 239000011737 fluorine Substances 0.000 title claims abstract description 12
- 239000011342 resin composition Substances 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 title abstract description 37
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 46
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 46
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 44
- 239000000843 powder Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920001577 copolymer Polymers 0.000 claims abstract description 15
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims abstract description 7
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical compound FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001774 Perfluoroether Polymers 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000000354 decomposition reaction Methods 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 claims description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000003517 fume Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000945 filler Substances 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 16
- 238000012545 processing Methods 0.000 description 14
- 238000010030 laminating Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 108010053481 Antifreeze Proteins Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
を含む。
(2)このフッ素樹脂組成物で製造された銅張基板は、高熱伝導率及び広範囲の誘電率を有し、高周波回路基板の製造に好適に用いられ、従来の高熱伝導高周波マイクロウェーブ基板が同時に熱伝導率、誘電特性及び加工信頼性を有し兼ねないなどの総合的問題を大幅に改良した。
(1)銅張基板ラミネート過程における降温レート
熱プレス機の温度制御システムによって制御し、制御可能な調整範囲は1〜20℃/分間にある。
(2)示差走査熱量分析(DSC)試験
示差走査熱量分析計(TAインスツルメンツ社製のDSCQ20)によって基板の一次融解エンタルピーを計測した。
(3)熱伝導分析試験
ASTM−D5470試験方法に準じ、界面材の熱抵抗及び熱伝導係数計測機器(台湾Long Win Science & Technology株式会社製、型式:LW−9389)で熱伝導分析試験を行った。
(4)誘電率Dk(10GHz)
誘電分析機器(Dielectric Analyzer、型式:HP Agilent E4991A)で周波数10GHzにおける誘電率Dkを測定した。
(5)誘電損失Df(10GHz)
誘電分析機器(DielecTric Analyzer、型式:HP Agilent E4991A)で周波数10GHzにおける誘電損失Dfを測定した。
Claims (7)
- 樹脂組成物の全重量を基にして各成分の全量が100wt%になるように、
(1)10〜90wt%のポリテトラフルオロエチレン(PTFE)樹脂と、
(2)1〜10wt%のテトラフルオロエチレン/パーフルオロアルコキシビニルエーテル共重合体(PFA)又はパーフルオロエチレンプロピレン共重合体(FEP)から選ばれる1種以上のフッ素含有共重合体と、
(3)5〜50%の分子量が2,000〜200,000である低分子量ポリテトラフルオロエチレン微粉末と、
(4)1〜80wt%の無機粉体と、
を含むことを特徴とする、フッ素樹脂組成物。 - 前記低分子量ポリテトラフルオロエチレン微粉末は、熱分解による分解法又は放射線照射による分解法で製造されることを特徴とする、
請求項1に記載のフッ素樹脂組成物。 - 前記無機粉体は、二酸化ケイ素(SiO2)、二酸化チタン(TiO2)、水酸化アルミニウム(Al(OH)3)、アルミナ(Al2O3)、水酸化マグネシウム(Mg(OH)2)、酸化マグネシウム(MgO)、炭酸カルシウム(CaCO3)、酸化ホウ素(B2O3)、酸化カルシウム(CaO)、チタン酸ストロンチウム(SrTiO3)、チタン酸バリウム(BaTiO3)、チタン酸カルシウム(CaTiO3)、チタン酸マグネシウム(2MgO・TiO2)、窒化ホウ素(BN)、窒化アルミニウム(AlN)、炭化ケイ素(SiC)、二酸化セリウム(CeO2)又はフュームドシリカ(Fume silica)の1種以上であることを特徴とする、
請求項1に記載のフッ素樹脂組成物。 - ガラスファイバークロスをマトリックスとして請求項1に記載のフッ素樹脂組成物が含浸塗布されてなったものであることを特徴とする、
フッ素樹脂プリプレグ。
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TW107134164A TWI680871B (zh) | 2018-09-27 | 2018-09-27 | 一種氟素樹脂組合物及使用該組合物的預浸體及銅箔基板 |
TW107134164 | 2018-09-27 |
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Cited By (9)
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CN112250343A (zh) * | 2020-09-18 | 2021-01-22 | 浙江巨化技术中心有限公司 | 一种覆铜板基板成型方法 |
CN112812476A (zh) * | 2021-02-04 | 2021-05-18 | 上海材料研究所 | 一种聚四氟乙烯复合材料及其制备方法与应用 |
CN113912968A (zh) * | 2021-11-02 | 2022-01-11 | 中国科学院长春应用化学研究所 | 一种耐热改性ptfe热缩材料及其制备方法和应用 |
JP2022070196A (ja) * | 2020-10-26 | 2022-05-12 | 南亞塑膠工業股▲分▼有限公司 | フッ素系樹脂プリプレグ材及びそれを使用した回路基板 |
CN114561072A (zh) * | 2022-03-02 | 2022-05-31 | 浙江工业大学 | 一种无机填料掺杂改性fep复合介电薄膜的制备方法 |
CN115073865A (zh) * | 2022-07-05 | 2022-09-20 | 广东生益科技股份有限公司 | 一种无纺布预浸料、覆金属箔板和印制电路板 |
CN115594512A (zh) * | 2021-07-08 | 2023-01-13 | 清华大学(Cn) | 一种高频微波用ptfe-陶瓷浆料及其烧结膜及它们的制备方法与应用 |
CN115612232A (zh) * | 2022-12-20 | 2023-01-17 | 中国电子科技集团公司第四十六研究所 | 一种浸渍工艺用高导热低介电常数复合浆料及制备方法 |
KR20230129373A (ko) | 2021-01-06 | 2023-09-08 | 에이지씨 가부시키가이샤 | 테트라플루오로에틸렌계 폴리머 조성물의 제조 방법, 조성물, 금속 피복 적층체 및 연신 시트 |
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JP2001328205A (ja) * | 2000-05-19 | 2001-11-27 | Nippon Pillar Packing Co Ltd | 積層板およびその製造方法 |
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TW201016800A (en) * | 2008-09-26 | 2010-05-01 | Whitford Corp | Blended fluoropolymer coatings for rigid substrates |
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Patent Citations (1)
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JP2001328205A (ja) * | 2000-05-19 | 2001-11-27 | Nippon Pillar Packing Co Ltd | 積層板およびその製造方法 |
Cited By (15)
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CN112250343A (zh) * | 2020-09-18 | 2021-01-22 | 浙江巨化技术中心有限公司 | 一种覆铜板基板成型方法 |
JP7185728B2 (ja) | 2020-10-26 | 2022-12-07 | 南亞塑膠工業股▲分▼有限公司 | フッ素系樹脂プリプレグ材及びそれを使用した回路基板 |
US11903127B2 (en) | 2020-10-26 | 2024-02-13 | Nan Ya Plastics Corporation | Fluoride-based resin prepreg and circuit substrate using the same |
JP2022070196A (ja) * | 2020-10-26 | 2022-05-12 | 南亞塑膠工業股▲分▼有限公司 | フッ素系樹脂プリプレグ材及びそれを使用した回路基板 |
CN114479322A (zh) * | 2020-10-26 | 2022-05-13 | 南亚塑胶工业股份有限公司 | 氟素树脂预浸材及应用其的电路基板 |
KR20230129373A (ko) | 2021-01-06 | 2023-09-08 | 에이지씨 가부시키가이샤 | 테트라플루오로에틸렌계 폴리머 조성물의 제조 방법, 조성물, 금속 피복 적층체 및 연신 시트 |
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CN113912968B (zh) * | 2021-11-02 | 2022-12-20 | 中国科学院长春应用化学研究所 | 一种耐热改性ptfe热缩材料及其制备方法和应用 |
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CN114561072A (zh) * | 2022-03-02 | 2022-05-31 | 浙江工业大学 | 一种无机填料掺杂改性fep复合介电薄膜的制备方法 |
CN115073865A (zh) * | 2022-07-05 | 2022-09-20 | 广东生益科技股份有限公司 | 一种无纺布预浸料、覆金属箔板和印制电路板 |
CN115073865B (zh) * | 2022-07-05 | 2023-11-07 | 广东生益科技股份有限公司 | 一种无纺布预浸料、覆金属箔板和印制电路板 |
WO2024007536A1 (zh) * | 2022-07-05 | 2024-01-11 | 广东生益科技股份有限公司 | 一种无纺布预浸料、覆金属箔板和印制电路板 |
CN115612232A (zh) * | 2022-12-20 | 2023-01-17 | 中国电子科技集团公司第四十六研究所 | 一种浸渍工艺用高导热低介电常数复合浆料及制备方法 |
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