JP2020021773A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 83
- 239000000463 material Substances 0.000 claims abstract description 39
- 238000000059 patterning Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 23
- 230000003746 surface roughness Effects 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 239000011229 interlayer Substances 0.000 abstract description 42
- 239000010410 layer Substances 0.000 description 98
- 229910010271 silicon carbide Inorganic materials 0.000 description 72
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 71
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 16
- 238000005259 measurement Methods 0.000 description 13
- 239000005380 borophosphosilicate glass Substances 0.000 description 11
- 239000012535 impurity Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910010380 TiNi Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- MXSJNBRAMXILSE-UHFFFAOYSA-N [Si].[P].[B] Chemical compound [Si].[P].[B] MXSJNBRAMXILSE-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
Description
第1実施形態について説明する。ここでは導体パターンが備えられるSiC半導体装置の製造方法について説明するが、まず、この製造方法の適用対象となるSiC半導体装置の一例について説明する。
まず、半導体基板として、n+型基板1を用意する。そして、エピタキシャル成長により、n+型基板1の主表面上にSiCからなるn−型低濃度層2を形成する。本実施形態の場合、JFET部2aをn−型低濃度層2と同じ不純物濃度としているため、JFET部2aを構成するためのn型のSiC層として、JFET部2aの厚み分を加えた厚みでn−型低濃度層2をエピタキシャル成長させている。
図示しないマスクによってJFET部2aの形成予定領域を覆いつつn−型低濃度層2をエッチングすることで、p型ディープ層3の形成予定領域が開口するトレンチ2bを形成する。また、このとき同時に、もしくは、トレンチ2bの形成に先立ってアライメントキー20を形成しておく。
p型SiCをエピタキシャル成長させることにより、トレンチ2b内にp型SiCをエピタキシャル成長させる。これにより、トレンチ2b内にp型ディープ層3が形成され、トレンチ2bの間にJFET部2aが構成される。このときのp型ディープ層3の形成は、トレンチ2b以外の部分をマスクした選択エピタキシャル成長にて行っても良いし、トレンチ2b内を含めてn−型低濃度層2の上にp型SiCをエピタキシャル成長させたのち、平坦化することによって行ってもよい。
続いて、JFET部2aやp型ディープ層3の表面にp型SiCをエピタキシャル成長させることでp型ベース領域4を形成する。このとき、アライメントキー20とされる位置にもp型SiCが形成されるが、表面の凹凸が引き継がれるため、それが新たなアライメントキー20となる。
ゲート電極9およびゲート絶縁膜8の表面を覆うように、例えば酸化膜などによって構成される層間絶縁膜10を形成する。また、層間絶縁膜10の表面上に図示しないマスクを形成したのち、マスクのうちp+型コンタクト領域6と対応する部分およびその近傍を開口させる。この後、マスクを用いて層間絶縁膜10をパターニングすることでp+型コンタクト領域6およびn+型ソース領域5などを露出させるコンタクトホールを形成する。
本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。
10 層間絶縁膜
11 ソース電極
20 アライメントキー
21 導体材料
21a、30a、33a 凹部
30 SiC層
30b、33b 凸部
33 Al含有層
34 異種材料部
Claims (12)
- 半導体層(4、30)を有する半導体基板(1)の表面に絶縁膜(10)を形成することと、
前記絶縁膜に対してコンタクトホールを形成することと、
前記絶縁膜の上に、前記コンタクトホールを通じて前記半導体層に接触させられる導体材料(11、21、31〜33)を形成することと、
前記導体材料をパターニングすることと、を含み、
前記絶縁膜を形成することでは、前記半導体層の表面に形成されたアライメントキー(20)を含めて前記半導体層の上に前記絶縁膜を形成し、
さらに、前記絶縁膜を形成することの後に、前記アライメントキーとなる領域および該領域の周囲において、前記絶縁膜を除去して前記半導体層を露出させることを行い、
前記導体材料を形成することでは、前記絶縁膜から露出した前記半導体層の上に直接前記導体材料を形成し、
前記導体材料をパターニングすることでは、前記導体材料の表面に引き継がれた前記アライメントキーを基準として前記パターニングを行う半導体装置の製造方法。 - 前記半導体層の表面に凹部(30a)が形成されることで前記アライメントキーとされており、
前記導体材料をパターニングすることでは、前記半導体層の表面の前記凹部が前記導体材料の表面に引き継がれることで形成された凹部(33a)を新たなアライメントキーとして用いて前記パターニングを行う請求項1に記載の半導体装置の製造方法。 - 前記導体材料をパターニングすることでは、前記新たなアライメントキーとなる前記凹部の深さが1μm以上となるようにする請求項2に記載の半導体装置の製造方法。
- 前記半導体層の表面に凸部(30b)が形成されることで前記アライメントキーとされており、
前記導体材料をパターニングすることでは、前記半導体層の表面の前記凸部が前記導体材料の表面に引き継がれることで形成された凸部(33b)を新たなアライメントキーとして用いて前記パターニングを行う請求項1に記載の半導体装置の製造方法。 - 前記導体材料をパターニングすることでは、前記新たなアライメントキーとなる前記凸部の高さが1μm以上となるようにする請求項4に記載の半導体装置の製造方法。
- 前記絶縁膜を除去して前記半導体層を露出させることを、前記コンタクトホールを形成する際に同時に行う請求項1ないし5のいずれか1つに記載の半導体装置の製造方法。
- 半導体層(4、30)を有する半導体基板(1)の表面に絶縁膜(10)を形成することと、
前記絶縁膜に対してコンタクトホールを形成することと、
前記絶縁膜の上に、前記コンタクトホールを通じて前記半導体層に接触させられる導体材料(11、21、31〜33)を形成することと、
前記導体材料をパターニングすることと、を含み、
前記絶縁膜を形成することの後に、前記半導体層のうちアライメントキーとなる領域の周囲において前記絶縁膜を除去し、前記アライメントキーとなる領域に前記絶縁膜を残すことで異種材料部(34)を構成すると共に、前記アライメントキーとなる領域の周囲において前記半導体層を露出させることを行い、
前記導体材料を形成することでは、前記絶縁膜から露出した前記半導体層および前記異種材料部の上に直接前記導体材料を形成し、
前記導体材料をパターニングすることでは、前記導体材料のうち前記異種材料部の上に形成された部分(33c)と前記半導体層の上に形成された部分(33d)との結晶性の相違に基づき、前記異種材料部の上に形成された部分を新たなアライメントキーとして前記パターニングを行う半導体装置の製造方法。 - 前記導体材料を形成することでは、前記導体材料として、Alを含むAl含有層を形成する請求項1ないし7のいずれか1つに記載の半導体装置の製造方法。
- 前記半導体層を有する半導体基板として、主表面が(111)配向かつ格子定数が2.5〜3.5nmとされているものを用意することを含む請求項8に記載の半導体装置の製造方法。
- 前記導体材料を形成することでは、前記導体材料として、前記半導体層に接触させられるTi層(31)と、該Ti層の上に形成されるTiN層(32)を形成したのち、前記Al含有層を形成する請求項8または9に記載の半導体装置の製造方法。
- 前記導体材料を形成することでは、前記半導体層の上に直接形成された前記導体材料の表面粗度Raが5mm以下となる請求項1ないし10のいずれか1つに記載の半導体装置の製造方法。
- 前記導体材料を形成することでは、前記導体材料の厚みを1μm以上とする請求項1ないし11のいずれか1つに記載の半導体装置の製造方法。
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JPH02117124A (ja) * | 1988-10-27 | 1990-05-01 | Matsushita Electron Corp | 位置検出用マーク |
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JPH104139A (ja) * | 1996-06-14 | 1998-01-06 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
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