JP2020019082A - 研削装置の原点位置設定機構、及び原点位置設定方法 - Google Patents

研削装置の原点位置設定機構、及び原点位置設定方法 Download PDF

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Publication number
JP2020019082A
JP2020019082A JP2018143441A JP2018143441A JP2020019082A JP 2020019082 A JP2020019082 A JP 2020019082A JP 2018143441 A JP2018143441 A JP 2018143441A JP 2018143441 A JP2018143441 A JP 2018143441A JP 2020019082 A JP2020019082 A JP 2020019082A
Authority
JP
Japan
Prior art keywords
grinding
chuck table
grinding unit
unit
origin position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018143441A
Other languages
English (en)
Japanese (ja)
Inventor
泰一朗 木村
Taiichiro Kimura
泰一朗 木村
成規 原田
Shigenori Harada
成規 原田
山下　真司
Shinji Yamashita
真司 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2018143441A priority Critical patent/JP2020019082A/ja
Priority to KR1020190078604A priority patent/KR20200014193A/ko
Priority to CN201910628125.1A priority patent/CN110842779A/zh
Priority to TW108126586A priority patent/TW202007479A/zh
Publication of JP2020019082A publication Critical patent/JP2020019082A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2018143441A 2018-07-31 2018-07-31 研削装置の原点位置設定機構、及び原点位置設定方法 Pending JP2020019082A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018143441A JP2020019082A (ja) 2018-07-31 2018-07-31 研削装置の原点位置設定機構、及び原点位置設定方法
KR1020190078604A KR20200014193A (ko) 2018-07-31 2019-07-01 연삭 장치의 원점 위치 설정 기구, 및 원점 위치 설정 방법
CN201910628125.1A CN110842779A (zh) 2018-07-31 2019-07-12 磨削装置的原点位置设定机构和原点位置设定方法
TW108126586A TW202007479A (zh) 2018-07-31 2019-07-26 研削裝置的原點位置設定機構以及原點位置設定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018143441A JP2020019082A (ja) 2018-07-31 2018-07-31 研削装置の原点位置設定機構、及び原点位置設定方法

Publications (1)

Publication Number Publication Date
JP2020019082A true JP2020019082A (ja) 2020-02-06

Family

ID=69587842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018143441A Pending JP2020019082A (ja) 2018-07-31 2018-07-31 研削装置の原点位置設定機構、及び原点位置設定方法

Country Status (4)

Country Link
JP (1) JP2020019082A (ko)
KR (1) KR20200014193A (ko)
CN (1) CN110842779A (ko)
TW (1) TW202007479A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112123054A (zh) * 2020-09-23 2020-12-25 河北力准机械制造有限公司 一种自动补偿磨床
CN112643476A (zh) * 2021-01-29 2021-04-13 雷小芹 一种机械精密磨床及其操作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117862965B (zh) * 2024-03-11 2024-05-28 江苏京创先进电子科技有限公司 磨轮对刀z轴坐标确定方法及减薄机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174873A (ja) * 1987-01-09 1988-07-19 Disco Abrasive Syst Ltd 工具の刃面位置検出方法および検出装置
JP2004322247A (ja) * 2003-04-23 2004-11-18 Disco Abrasive Syst Ltd 研削装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815422B2 (ja) 1977-10-31 1983-03-25 株式会社神戸製鋼所 ワイヤ巻取装置
JP3632500B2 (ja) * 1999-05-21 2005-03-23 株式会社日立製作所 回転加工装置
JP4338458B2 (ja) * 2003-06-30 2009-10-07 コマツ工機株式会社 研削加工装置及び研削加工方法
EP2690652A3 (en) * 2004-11-01 2014-04-16 Ebara Corporation Polishing apparatus
JP5260139B2 (ja) * 2008-05-22 2013-08-14 株式会社日進製作所 砥石接触感知方法およびその装置、ならびにホーニング加工方法およびホーニング盤
TWI474388B (zh) * 2009-11-04 2015-02-21 Disco Corp A laser processing method, a laser processing apparatus, and a manufacturing method of a wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174873A (ja) * 1987-01-09 1988-07-19 Disco Abrasive Syst Ltd 工具の刃面位置検出方法および検出装置
JP2004322247A (ja) * 2003-04-23 2004-11-18 Disco Abrasive Syst Ltd 研削装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112123054A (zh) * 2020-09-23 2020-12-25 河北力准机械制造有限公司 一种自动补偿磨床
CN112643476A (zh) * 2021-01-29 2021-04-13 雷小芹 一种机械精密磨床及其操作方法
CN112643476B (zh) * 2021-01-29 2022-06-28 深圳市纬泰技研有限公司 一种机械精密磨床及其操作方法

Also Published As

Publication number Publication date
TW202007479A (zh) 2020-02-16
CN110842779A (zh) 2020-02-28
KR20200014193A (ko) 2020-02-10

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