TW202007479A - 研削裝置的原點位置設定機構以及原點位置設定方法 - Google Patents

研削裝置的原點位置設定機構以及原點位置設定方法 Download PDF

Info

Publication number
TW202007479A
TW202007479A TW108126586A TW108126586A TW202007479A TW 202007479 A TW202007479 A TW 202007479A TW 108126586 A TW108126586 A TW 108126586A TW 108126586 A TW108126586 A TW 108126586A TW 202007479 A TW202007479 A TW 202007479A
Authority
TW
Taiwan
Prior art keywords
grinding
chuck table
grinding unit
origin position
unit
Prior art date
Application number
TW108126586A
Other languages
English (en)
Chinese (zh)
Inventor
木村泰一朗
原田成規
山下真司
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202007479A publication Critical patent/TW202007479A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW108126586A 2018-07-31 2019-07-26 研削裝置的原點位置設定機構以及原點位置設定方法 TW202007479A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018143441A JP2020019082A (ja) 2018-07-31 2018-07-31 研削装置の原点位置設定機構、及び原点位置設定方法
JP2018-143441 2018-07-31

Publications (1)

Publication Number Publication Date
TW202007479A true TW202007479A (zh) 2020-02-16

Family

ID=69587842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108126586A TW202007479A (zh) 2018-07-31 2019-07-26 研削裝置的原點位置設定機構以及原點位置設定方法

Country Status (4)

Country Link
JP (1) JP2020019082A (ko)
KR (1) KR20200014193A (ko)
CN (1) CN110842779A (ko)
TW (1) TW202007479A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7517875B2 (ja) 2020-06-25 2024-07-17 株式会社ディスコ チャックテーブル及び加工装置
CN112123054A (zh) * 2020-09-23 2020-12-25 河北力准机械制造有限公司 一种自动补偿磨床
CN112643476B (zh) * 2021-01-29 2022-06-28 深圳市纬泰技研有限公司 一种机械精密磨床及其操作方法
CN117862965B (zh) * 2024-03-11 2024-05-28 江苏京创先进电子科技有限公司 磨轮对刀z轴坐标确定方法及减薄机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815422B2 (ja) 1977-10-31 1983-03-25 株式会社神戸製鋼所 ワイヤ巻取装置
JPS63174873A (ja) * 1987-01-09 1988-07-19 Disco Abrasive Syst Ltd 工具の刃面位置検出方法および検出装置
JP3632500B2 (ja) * 1999-05-21 2005-03-23 株式会社日立製作所 回転加工装置
JP4245141B2 (ja) * 2003-04-23 2009-03-25 株式会社ディスコ 研削装置
JP4338458B2 (ja) * 2003-06-30 2009-10-07 コマツ工機株式会社 研削加工装置及び研削加工方法
CN101934491B (zh) * 2004-11-01 2012-07-25 株式会社荏原制作所 抛光设备
JP5260139B2 (ja) * 2008-05-22 2013-08-14 株式会社日進製作所 砥石接触感知方法およびその装置、ならびにホーニング加工方法およびホーニング盤
TWI474388B (zh) * 2009-11-04 2015-02-21 Disco Corp A laser processing method, a laser processing apparatus, and a manufacturing method of a wafer

Also Published As

Publication number Publication date
KR20200014193A (ko) 2020-02-10
JP2020019082A (ja) 2020-02-06
CN110842779A (zh) 2020-02-28

Similar Documents

Publication Publication Date Title
KR102221749B1 (ko) 연삭 지석의 드레싱 방법
TW202007479A (zh) 研削裝置的原點位置設定機構以及原點位置設定方法
US20090247050A1 (en) Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
JP4916833B2 (ja) 研削加工方法
KR20180024340A (ko) 평면 연마 장치
JP7127994B2 (ja) ドレッシングボード及びドレッシング方法
JP2016016462A (ja) 研削方法
JP2013141725A (ja) 研削装置
JP2020089930A (ja) クリープフィード研削方法
TW202031424A (zh) 研削裝置
JP6424081B2 (ja) 研削方法
JP6751301B2 (ja) 研削装置
JP3975309B2 (ja) ウェーハ面取り方法及び装置
JP2021146416A (ja) ウェーハの研削方法
JP2015178139A (ja) 被加工物の研削方法
JP2020049593A (ja) 研削方法
JP5654365B2 (ja) 研削装置
JP7291056B2 (ja) ウェーハの研磨方法
JP7348037B2 (ja) 加工装置
JP6487790B2 (ja) 加工装置
JP2019123046A (ja) ドレッシング方法
JP7328099B2 (ja) 研削装置および研削方法
JP7185446B2 (ja) 被加工物の研削装置及び研削方法
JP2022050976A (ja) ウェーハの研削方法
JP2021070127A (ja) ドレッサボードの上面高さ測定方法