JP2019532825A5 - - Google Patents

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Publication number
JP2019532825A5
JP2019532825A5 JP2019514732A JP2019514732A JP2019532825A5 JP 2019532825 A5 JP2019532825 A5 JP 2019532825A5 JP 2019514732 A JP2019514732 A JP 2019514732A JP 2019514732 A JP2019514732 A JP 2019514732A JP 2019532825 A5 JP2019532825 A5 JP 2019532825A5
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JP
Japan
Prior art keywords
carrier head
chemical mechanical
mechanical polishing
sensor
vibration sensor
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Application number
JP2019514732A
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English (en)
Japanese (ja)
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JP7312103B2 (ja
JP2019532825A (ja
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Priority claimed from PCT/US2017/050822 external-priority patent/WO2018052816A1/en
Publication of JP2019532825A publication Critical patent/JP2019532825A/ja
Publication of JP2019532825A5 publication Critical patent/JP2019532825A5/ja
Application granted granted Critical
Publication of JP7312103B2 publication Critical patent/JP7312103B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019514732A 2016-09-15 2017-09-08 化学機械研磨スマートリング Active JP7312103B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN201641031439 2016-09-15
IN201641031439 2016-09-15
PCT/US2017/050822 WO2018052816A1 (en) 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring

Publications (3)

Publication Number Publication Date
JP2019532825A JP2019532825A (ja) 2019-11-14
JP2019532825A5 true JP2019532825A5 (enExample) 2020-10-15
JP7312103B2 JP7312103B2 (ja) 2023-07-20

Family

ID=61559452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019514732A Active JP7312103B2 (ja) 2016-09-15 2017-09-08 化学機械研磨スマートリング

Country Status (7)

Country Link
US (1) US10513008B2 (enExample)
JP (1) JP7312103B2 (enExample)
KR (2) KR102420044B1 (enExample)
CN (1) CN109689295B (enExample)
SG (1) SG11201901352XA (enExample)
TW (2) TW202200308A (enExample)
WO (1) WO2018052816A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
DE102019207168A1 (de) 2019-05-16 2020-11-19 Prüftechnik Dieter Busch GmbH Vorrichtung zum Erfassen mechanischer Schwingungen
KR102753436B1 (ko) * 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
EP4171874A4 (en) * 2020-06-24 2024-11-27 Applied Materials, Inc. POLISHING SUPPORT HEAD WITH PIEZOELECTRIC PRESSURE CONTROL
JP2023177421A (ja) * 2022-06-02 2023-12-14 株式会社荏原製作所 研磨装置
JP2025518293A (ja) * 2022-06-03 2025-06-12 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ保持リングの音響モニタリング
JP2024047143A (ja) * 2022-09-26 2024-04-05 双葉電子工業株式会社 稼働判定装置、稼働判定方法、プログラム
US20240139900A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Acoustic carrier head monitoring
CN120129586A (zh) * 2022-10-27 2025-06-10 应用材料公司 利用平台中的传感器进行载体头声波监测

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4704312B2 (ja) * 1995-04-26 2011-06-15 富士通株式会社 研磨装置及び研磨方法
TW320591B (enExample) * 1995-04-26 1997-11-21 Fujitsu Ltd
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6106661A (en) 1998-05-08 2000-08-22 Advanced Micro Devices, Inc. Polishing pad having a wear level indicator and system using the same
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6390908B1 (en) 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
JP3573197B2 (ja) * 1999-07-08 2004-10-06 聯華電子股▲分▼有限公司 完了点観測デバイスを備えた化学機械研磨ステーション
US7008310B2 (en) 2001-08-01 2006-03-07 Entegris, Inc. Wafer carrier wear indicator
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
WO2004033152A1 (en) 2002-10-11 2004-04-22 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
US20040242121A1 (en) * 2003-05-16 2004-12-02 Kazuto Hirokawa Substrate polishing apparatus
US20070235133A1 (en) * 2006-03-29 2007-10-11 Strasbaugh Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
US7840305B2 (en) * 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
JP5301931B2 (ja) * 2008-09-12 2013-09-25 株式会社荏原製作所 研磨方法および研磨装置
TWI570791B (zh) * 2011-09-30 2017-02-11 荏原製作所股份有限公司 研磨裝置及基板固持裝置
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
US20140329439A1 (en) * 2013-05-01 2014-11-06 Applied Materials, Inc. Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
JP6030041B2 (ja) * 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor

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