SG11201901352XA - Chemical mechanical polishing smart ring - Google Patents

Chemical mechanical polishing smart ring

Info

Publication number
SG11201901352XA
SG11201901352XA SG11201901352XA SG11201901352XA SG11201901352XA SG 11201901352X A SG11201901352X A SG 11201901352XA SG 11201901352X A SG11201901352X A SG 11201901352XA SG 11201901352X A SG11201901352X A SG 11201901352XA SG 11201901352X A SG11201901352X A SG 11201901352XA
Authority
SG
Singapore
Prior art keywords
international
california
chemical mechanical
sensor
mechanical polishing
Prior art date
Application number
SG11201901352XA
Other languages
English (en)
Inventor
Zubin Huang
Stephen A Wells
Ramesh Gopalan
Gangadhar Sheelavant
Simon Yavelberg
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201901352XA publication Critical patent/SG11201901352XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C2201/00—Transmission systems of control signals via wireless link
    • G08C2201/50—Receiving or transmitting feedback, e.g. replies, status updates, acknowledgements, from the controlled devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/43—Arrangements in telecontrol or telemetry systems using a wireless architecture using wireless personal area networks [WPAN], e.g. 802.15, 802.15.1, 802.15.4, Bluetooth or ZigBee
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/47—Arrangements in telecontrol or telemetry systems using a wireless architecture using RFID associated with sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/80—Arrangements in the sub-station, i.e. sensing device
    • H04Q2209/88—Providing power supply at the sub-station

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG11201901352XA 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring SG11201901352XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN201641031439 2016-09-15
PCT/US2017/050822 WO2018052816A1 (en) 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring

Publications (1)

Publication Number Publication Date
SG11201901352XA true SG11201901352XA (en) 2019-04-29

Family

ID=61559452

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901352XA SG11201901352XA (en) 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring

Country Status (7)

Country Link
US (1) US10513008B2 (enExample)
JP (1) JP7312103B2 (enExample)
KR (2) KR102420044B1 (enExample)
CN (1) CN109689295B (enExample)
SG (1) SG11201901352XA (enExample)
TW (2) TW202200308A (enExample)
WO (1) WO2018052816A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
DE102019207168A1 (de) 2019-05-16 2020-11-19 Prüftechnik Dieter Busch GmbH Vorrichtung zum Erfassen mechanischer Schwingungen
KR102753436B1 (ko) * 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
EP4171874A4 (en) * 2020-06-24 2024-11-27 Applied Materials, Inc. POLISHING SUPPORT HEAD WITH PIEZOELECTRIC PRESSURE CONTROL
JP2023177421A (ja) * 2022-06-02 2023-12-14 株式会社荏原製作所 研磨装置
JP2025518293A (ja) * 2022-06-03 2025-06-12 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ保持リングの音響モニタリング
JP2024047143A (ja) * 2022-09-26 2024-04-05 双葉電子工業株式会社 稼働判定装置、稼働判定方法、プログラム
US20240139900A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Acoustic carrier head monitoring
CN120129586A (zh) * 2022-10-27 2025-06-10 应用材料公司 利用平台中的传感器进行载体头声波监测

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4704312B2 (ja) * 1995-04-26 2011-06-15 富士通株式会社 研磨装置及び研磨方法
TW320591B (enExample) * 1995-04-26 1997-11-21 Fujitsu Ltd
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6106661A (en) 1998-05-08 2000-08-22 Advanced Micro Devices, Inc. Polishing pad having a wear level indicator and system using the same
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6390908B1 (en) 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
JP3573197B2 (ja) * 1999-07-08 2004-10-06 聯華電子股▲分▼有限公司 完了点観測デバイスを備えた化学機械研磨ステーション
US7008310B2 (en) 2001-08-01 2006-03-07 Entegris, Inc. Wafer carrier wear indicator
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
WO2004033152A1 (en) 2002-10-11 2004-04-22 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
US20040242121A1 (en) * 2003-05-16 2004-12-02 Kazuto Hirokawa Substrate polishing apparatus
US20070235133A1 (en) * 2006-03-29 2007-10-11 Strasbaugh Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
US7840305B2 (en) * 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
JP5301931B2 (ja) * 2008-09-12 2013-09-25 株式会社荏原製作所 研磨方法および研磨装置
TWI570791B (zh) * 2011-09-30 2017-02-11 荏原製作所股份有限公司 研磨裝置及基板固持裝置
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
US20140329439A1 (en) * 2013-05-01 2014-11-06 Applied Materials, Inc. Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
JP6030041B2 (ja) * 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor

Also Published As

Publication number Publication date
TW201822952A (zh) 2018-07-01
US10513008B2 (en) 2019-12-24
CN109689295B (zh) 2021-08-06
TW202200308A (zh) 2022-01-01
JP7312103B2 (ja) 2023-07-20
WO2018052816A1 (en) 2018-03-22
KR20190042744A (ko) 2019-04-24
JP2019532825A (ja) 2019-11-14
KR102564376B1 (ko) 2023-08-04
KR20220100110A (ko) 2022-07-14
KR102420044B1 (ko) 2022-07-11
TWI758323B (zh) 2022-03-21
CN109689295A (zh) 2019-04-26
US20180071889A1 (en) 2018-03-15

Similar Documents

Publication Publication Date Title
SG11201901352XA (en) Chemical mechanical polishing smart ring
SG11202000149VA (en) Methods and apparatus for srs antenna switching in carrier aggregation
SG11201408022XA (en) Enterprise triggered 2chk association
SG11201908661UA (en) Providing cryptocurrency payments through a browser application programming interface
SG11201908012SA (en) Cyclic sulfamide compounds and methods of using same
SG11201900274VA (en) Event trigger for independent links
SG11201804837PA (en) Electronic devices and method for direct communication
SG11201809535YA (en) Multi -joint tracking combining embedded sensors and an external
SG11201907665QA (en) Intelligent rope or cable termination
SG11201900746RA (en) Engineered antibodies and other fc-domain containing molecules with enhanced agonism and effector functions
SG11201907840RA (en) Fused imidazo-piperidine jak inhibitors
SG11201905461VA (en) Data sealing with a sealing enclave
SG11201810521WA (en) Apparatus and method to form entry bleb for subretinal delivery of therapeutic agent
SG11201903835WA (en) Antibodies directed against programmed death- 1 (pd-1)
SG11201901357WA (en) Reference beam for event trigger in mobility management
SG11201901959YA (en) Modified stem cell memory t cells, methods of making and methods of using same
SG11201408025SA (en) Enhanced 2chk authentication security with query transactions
SG11201900201YA (en) Methods for quantitating individual antibodies from a mixture
SG11201407610WA (en) Cd33 antibodies and use of same to treat cancer
SG11201911770UA (en) Measurement synchronization signals (ss)
SG11201909009TA (en) Catheter securement device with window
CA3015078A1 (en) Extended synchronization signal for symbol index detection
SG11201906630SA (en) Wellhead assembly and method
SG11201907199QA (en) Cancer treatment
SG11201901188VA (en) Metal powder feedstocks for additive manufacturing, and system and methods for producing the same