KR102420044B1 - 화학 기계적 폴리싱 스마트 링 - Google Patents

화학 기계적 폴리싱 스마트 링 Download PDF

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Publication number
KR102420044B1
KR102420044B1 KR1020197010665A KR20197010665A KR102420044B1 KR 102420044 B1 KR102420044 B1 KR 102420044B1 KR 1020197010665 A KR1020197010665 A KR 1020197010665A KR 20197010665 A KR20197010665 A KR 20197010665A KR 102420044 B1 KR102420044 B1 KR 102420044B1
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KR
South Korea
Prior art keywords
chemical mechanical
mechanical polishing
sensor
carrier head
retaining ring
Prior art date
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Application number
KR1020197010665A
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English (en)
Korean (ko)
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KR20190042744A (ko
Inventor
주빈 황
스티븐 에이. 웰스
라메쉬 고팔란
갠가드하르 쉬엘라반트
사이먼 야벨베르그
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Priority to KR1020227023278A priority Critical patent/KR102564376B1/ko
Publication of KR20190042744A publication Critical patent/KR20190042744A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H01L21/30625—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C2201/00—Transmission systems of control signals via wireless link
    • G08C2201/50—Receiving or transmitting feedback, e.g. replies, status updates, acknowledgements, from the controlled devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/43—Arrangements in telecontrol or telemetry systems using a wireless architecture using wireless personal area networks [WPAN], e.g. 802.15, 802.15.1, 802.15.4, Bluetooth® or Zigbee®
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/47—Arrangements in telecontrol or telemetry systems using a wireless architecture using RFID associated with sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/80—Arrangements in the sub-station, i.e. sensing device
    • H04Q2209/88—Providing power supply at the sub-station

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020197010665A 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링 Active KR102420044B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227023278A KR102564376B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN201641031439 2016-09-15
IN201641031439 2016-09-15
PCT/US2017/050822 WO2018052816A1 (en) 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227023278A Division KR102564376B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링

Publications (2)

Publication Number Publication Date
KR20190042744A KR20190042744A (ko) 2019-04-24
KR102420044B1 true KR102420044B1 (ko) 2022-07-11

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KR1020197010665A Active KR102420044B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링
KR1020227023278A Active KR102564376B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링

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Country Status (7)

Country Link
US (1) US10513008B2 (enExample)
JP (1) JP7312103B2 (enExample)
KR (2) KR102420044B1 (enExample)
CN (1) CN109689295B (enExample)
SG (1) SG11201901352XA (enExample)
TW (2) TWI758323B (enExample)
WO (1) WO2018052816A1 (enExample)

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US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
EP3948702A4 (en) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. POWER LOOP SOLUTIONS
WO2020206382A1 (en) 2019-04-03 2020-10-08 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
DE102019207168A1 (de) * 2019-05-16 2020-11-19 Prüftechnik Dieter Busch GmbH Vorrichtung zum Erfassen mechanischer Schwingungen
KR102753436B1 (ko) * 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
US11890715B2 (en) 2020-06-24 2024-02-06 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control
JP7872696B2 (ja) * 2022-06-02 2026-06-10 株式会社荏原製作所 研磨装置
CN119300954A (zh) * 2022-06-03 2025-01-10 应用材料公司 Cmp保持环的声学监测
KR20250019127A (ko) * 2022-06-06 2025-02-07 어플라이드 머티어리얼스, 인코포레이티드 연마 동안의 컨디셔너의 음향 모니터링
JP2024047143A (ja) * 2022-09-26 2024-04-05 双葉電子工業株式会社 稼働判定装置、稼働判定方法、プログラム
JP2025503379A (ja) * 2022-10-27 2025-02-04 アプライド マテリアルズ インコーポレイテッド 音響キャリアヘッドモニタリング
KR20250092244A (ko) * 2022-10-27 2025-06-23 어플라이드 머티어리얼스, 인코포레이티드 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링
US12703057B2 (en) * 2023-03-17 2026-08-11 Applied Materials, Inc. Method for detection of wafer slippage

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JP2001035822A (ja) * 1999-07-08 2001-02-09 United Microelectronics Corp 完了点観測デバイスを備えた化学機械研磨ステーション
JP2009542449A (ja) * 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
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JP2009542449A (ja) * 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
WO2015195284A1 (en) 2014-06-16 2015-12-23 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor

Also Published As

Publication number Publication date
CN109689295A (zh) 2019-04-26
WO2018052816A1 (en) 2018-03-22
US10513008B2 (en) 2019-12-24
SG11201901352XA (en) 2019-04-29
TW201822952A (zh) 2018-07-01
TW202200308A (zh) 2022-01-01
JP7312103B2 (ja) 2023-07-20
KR102564376B1 (ko) 2023-08-04
KR20220100110A (ko) 2022-07-14
JP2019532825A (ja) 2019-11-14
CN109689295B (zh) 2021-08-06
US20180071889A1 (en) 2018-03-15
KR20190042744A (ko) 2019-04-24
TWI758323B (zh) 2022-03-21

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