JP2019532825A5 - - Google Patents

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Publication number
JP2019532825A5
JP2019532825A5 JP2019514732A JP2019514732A JP2019532825A5 JP 2019532825 A5 JP2019532825 A5 JP 2019532825A5 JP 2019514732 A JP2019514732 A JP 2019514732A JP 2019514732 A JP2019514732 A JP 2019514732A JP 2019532825 A5 JP2019532825 A5 JP 2019532825A5
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JP
Japan
Prior art keywords
carrier head
chemical mechanical
mechanical polishing
sensor
vibration sensor
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JP2019514732A
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English (en)
Japanese (ja)
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JP7312103B2 (ja
JP2019532825A (ja
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Priority claimed from PCT/US2017/050822 external-priority patent/WO2018052816A1/en
Publication of JP2019532825A publication Critical patent/JP2019532825A/ja
Publication of JP2019532825A5 publication Critical patent/JP2019532825A5/ja
Application granted granted Critical
Publication of JP7312103B2 publication Critical patent/JP7312103B2/ja
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JP2019514732A 2016-09-15 2017-09-08 化学機械研磨スマートリング Active JP7312103B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN201641031439 2016-09-15
IN201641031439 2016-09-15
PCT/US2017/050822 WO2018052816A1 (en) 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring

Publications (3)

Publication Number Publication Date
JP2019532825A JP2019532825A (ja) 2019-11-14
JP2019532825A5 true JP2019532825A5 (cg-RX-API-DMAC7.html) 2020-10-15
JP7312103B2 JP7312103B2 (ja) 2023-07-20

Family

ID=61559452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019514732A Active JP7312103B2 (ja) 2016-09-15 2017-09-08 化学機械研磨スマートリング

Country Status (7)

Country Link
US (1) US10513008B2 (cg-RX-API-DMAC7.html)
JP (1) JP7312103B2 (cg-RX-API-DMAC7.html)
KR (2) KR102564376B1 (cg-RX-API-DMAC7.html)
CN (1) CN109689295B (cg-RX-API-DMAC7.html)
SG (1) SG11201901352XA (cg-RX-API-DMAC7.html)
TW (2) TWI758323B (cg-RX-API-DMAC7.html)
WO (1) WO2018052816A1 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
BR112021019580A2 (pt) 2019-03-29 2021-12-14 Saint Gobain Abrasifs Sa Desempenho de soluções de retificação
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
DE102019207168A1 (de) * 2019-05-16 2020-11-19 Prüftechnik Dieter Busch GmbH Vorrichtung zum Erfassen mechanischer Schwingungen
KR102753436B1 (ko) * 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
KR20240167100A (ko) 2020-06-24 2024-11-26 어플라이드 머티어리얼스, 인코포레이티드 압전 압력 제어를 갖는 연마 캐리어 헤드
JP2023177421A (ja) * 2022-06-02 2023-12-14 株式会社荏原製作所 研磨装置
WO2023234973A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Acoustic monitoring of cmp retaining ring
JP2024047143A (ja) * 2022-09-26 2024-04-05 双葉電子工業株式会社 稼働判定装置、稼働判定方法、プログラム
KR20250092244A (ko) * 2022-10-27 2025-06-23 어플라이드 머티어리얼스, 인코포레이티드 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링
US20240139900A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Acoustic carrier head monitoring

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4704312B2 (ja) * 1995-04-26 2011-06-15 富士通株式会社 研磨装置及び研磨方法
TW320591B (cg-RX-API-DMAC7.html) * 1995-04-26 1997-11-21 Fujitsu Ltd
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6106661A (en) 1998-05-08 2000-08-22 Advanced Micro Devices, Inc. Polishing pad having a wear level indicator and system using the same
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6390908B1 (en) 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
JP3573197B2 (ja) * 1999-07-08 2004-10-06 聯華電子股▲分▼有限公司 完了点観測デバイスを備えた化学機械研磨ステーション
US7008310B2 (en) 2001-08-01 2006-03-07 Entegris, Inc. Wafer carrier wear indicator
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
AU2003300375A1 (en) 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
US20040242121A1 (en) * 2003-05-16 2004-12-02 Kazuto Hirokawa Substrate polishing apparatus
US20070235133A1 (en) * 2006-03-29 2007-10-11 Strasbaugh Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
US7840305B2 (en) * 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
JP5301931B2 (ja) 2008-09-12 2013-09-25 株式会社荏原製作所 研磨方法および研磨装置
TWI570791B (zh) * 2011-09-30 2017-02-11 荏原製作所股份有限公司 研磨裝置及基板固持裝置
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
US20140329439A1 (en) * 2013-05-01 2014-11-06 Applied Materials, Inc. Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
JP6030041B2 (ja) * 2013-11-01 2016-11-24 株式会社荏原製作所 研磨装置および研磨方法
US9878421B2 (en) * 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor

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