TWI758323B - 化學機械拋光智慧環及使用該化學機械拋光智慧環的化學機械拋光系統與方法 - Google Patents

化學機械拋光智慧環及使用該化學機械拋光智慧環的化學機械拋光系統與方法 Download PDF

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Publication number
TWI758323B
TWI758323B TW106131336A TW106131336A TWI758323B TW I758323 B TWI758323 B TW I758323B TW 106131336 A TW106131336 A TW 106131336A TW 106131336 A TW106131336 A TW 106131336A TW I758323 B TWI758323 B TW I758323B
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TW
Taiwan
Prior art keywords
sensor
chemical mechanical
carrier head
mechanical polishing
support ring
Prior art date
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TW106131336A
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English (en)
Chinese (zh)
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TW201822952A (zh
Inventor
黃祖濱
史蒂芬Ａ 威爾斯
拉梅許 勾帕蘭
甘嘉哈 席拉溫
賽蒙 亞維格
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美商應用材料股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C2201/00—Transmission systems of control signals via wireless link
    • G08C2201/50—Receiving or transmitting feedback, e.g. replies, status updates, acknowledgements, from the controlled devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/43—Arrangements in telecontrol or telemetry systems using a wireless architecture using wireless personal area networks [WPAN], e.g. 802.15, 802.15.1, 802.15.4, Bluetooth or ZigBee
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/47—Arrangements in telecontrol or telemetry systems using a wireless architecture using RFID associated with sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/80—Arrangements in the sub-station, i.e. sensing device
    • H04Q2209/88—Providing power supply at the sub-station

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW106131336A 2016-09-15 2017-09-13 化學機械拋光智慧環及使用該化學機械拋光智慧環的化學機械拋光系統與方法 TWI758323B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN201641031439 2016-09-15
IN201641031439 2016-09-15

Publications (2)

Publication Number Publication Date
TW201822952A TW201822952A (zh) 2018-07-01
TWI758323B true TWI758323B (zh) 2022-03-21

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW106131336A TWI758323B (zh) 2016-09-15 2017-09-13 化學機械拋光智慧環及使用該化學機械拋光智慧環的化學機械拋光系統與方法
TW110133687A TW202200308A (zh) 2016-09-15 2017-09-13 化學機械拋光智慧環及使用該化學機械拋光智慧環的化學機械拋光系統與方法

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Country Status (7)

Country Link
US (1) US10513008B2 (cg-RX-API-DMAC7.html)
JP (1) JP7312103B2 (cg-RX-API-DMAC7.html)
KR (2) KR102564376B1 (cg-RX-API-DMAC7.html)
CN (1) CN109689295B (cg-RX-API-DMAC7.html)
SG (1) SG11201901352XA (cg-RX-API-DMAC7.html)
TW (2) TWI758323B (cg-RX-API-DMAC7.html)
WO (1) WO2018052816A1 (cg-RX-API-DMAC7.html)

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US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
BR112021019580A2 (pt) 2019-03-29 2021-12-14 Saint Gobain Abrasifs Sa Desempenho de soluções de retificação
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
DE102019207168A1 (de) * 2019-05-16 2020-11-19 Prüftechnik Dieter Busch GmbH Vorrichtung zum Erfassen mechanischer Schwingungen
KR102753436B1 (ko) * 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
KR20240167100A (ko) 2020-06-24 2024-11-26 어플라이드 머티어리얼스, 인코포레이티드 압전 압력 제어를 갖는 연마 캐리어 헤드
JP2023177421A (ja) * 2022-06-02 2023-12-14 株式会社荏原製作所 研磨装置
WO2023234973A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Acoustic monitoring of cmp retaining ring
JP2024047143A (ja) * 2022-09-26 2024-04-05 双葉電子工業株式会社 稼働判定装置、稼働判定方法、プログラム
KR20250092244A (ko) * 2022-10-27 2025-06-23 어플라이드 머티어리얼스, 인코포레이티드 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링
US20240139900A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Acoustic carrier head monitoring

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TW348089B (en) * 1996-01-11 1998-12-21 Luxtron Corp Method and system of monitoring a process of removing material from an article
JP2001035822A (ja) * 1999-07-08 2001-02-09 United Microelectronics Corp 完了点観測デバイスを備えた化学機械研磨ステーション
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Also Published As

Publication number Publication date
JP7312103B2 (ja) 2023-07-20
KR102564376B1 (ko) 2023-08-04
JP2019532825A (ja) 2019-11-14
CN109689295A (zh) 2019-04-26
TW202200308A (zh) 2022-01-01
SG11201901352XA (en) 2019-04-29
KR20220100110A (ko) 2022-07-14
TW201822952A (zh) 2018-07-01
US20180071889A1 (en) 2018-03-15
KR102420044B1 (ko) 2022-07-11
CN109689295B (zh) 2021-08-06
WO2018052816A1 (en) 2018-03-22
US10513008B2 (en) 2019-12-24
KR20190042744A (ko) 2019-04-24

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