JP2019532815A5 - - Google Patents

Download PDF

Info

Publication number
JP2019532815A5
JP2019532815A5 JP2019504698A JP2019504698A JP2019532815A5 JP 2019532815 A5 JP2019532815 A5 JP 2019532815A5 JP 2019504698 A JP2019504698 A JP 2019504698A JP 2019504698 A JP2019504698 A JP 2019504698A JP 2019532815 A5 JP2019532815 A5 JP 2019532815A5
Authority
JP
Japan
Prior art keywords
workpiece
laser pulse
pulse
less
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019504698A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019532815A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/043229 external-priority patent/WO2018022441A1/en
Publication of JP2019532815A publication Critical patent/JP2019532815A/ja
Publication of JP2019532815A5 publication Critical patent/JP2019532815A5/ja
Pending legal-status Critical Current

Links

JP2019504698A 2016-07-28 2017-07-21 レーザ加工装置及びワークピースをレーザ加工する方法 Pending JP2019532815A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
US62/368,053 2016-07-28
PCT/US2017/043229 WO2018022441A1 (en) 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces

Publications (2)

Publication Number Publication Date
JP2019532815A JP2019532815A (ja) 2019-11-14
JP2019532815A5 true JP2019532815A5 (https=) 2020-08-06

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019504698A Pending JP2019532815A (ja) 2016-07-28 2017-07-21 レーザ加工装置及びワークピースをレーザ加工する方法

Country Status (6)

Country Link
EP (1) EP3490750A4 (https=)
JP (1) JP2019532815A (https=)
KR (1) KR20190025721A (https=)
CN (1) CN109862991A (https=)
TW (1) TW201803674A (https=)
WO (1) WO2018022441A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111902917A (zh) * 2018-03-22 2020-11-06 应用材料公司 对用于半导体器件制造的处理部件的陶瓷表面进行激光抛光
WO2019217180A1 (en) * 2018-05-08 2019-11-14 Lam Research Corporation Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scanner
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
NL2024815A (en) * 2019-02-19 2020-08-27 Asml Holding Nv Laser roughening: engineering the roughness of the burl top
JP7686413B2 (ja) * 2021-03-08 2025-06-02 株式会社東京精密 シリコンウエハのエッジ品質向上方法
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法
CN116786993B (zh) * 2023-06-20 2025-08-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
FI20060177A7 (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
EP2252426A4 (en) * 2008-03-21 2014-08-06 Imra America Inc METHOD AND SYSTEMS FOR PROCESSING A LASER BASED MATERIAL
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20160093593A (ko) * 2013-12-05 2016-08-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 거친 표면을 가진 기판을 내부적으로 마킹하는 방법 및 장치
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
CN105108343B (zh) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 一种集装箱焊缝的表面处理工艺
CN105468873B (zh) * 2015-12-24 2018-08-14 中北大学 硅基光波导激光表面光滑化仿真方法

Similar Documents

Publication Publication Date Title
JP2019532815A5 (https=)
CN105081586B (zh) 一种激光加工方法和装置
CN106457467B (zh) 用于将飞秒或皮秒激光束掩模投射到衬底表面上的设备
US11347068B2 (en) Device and method for laser material processing
TWI803934B (zh) 雷射處理系統及其方法
JP2016516584A (ja) テーパ制御のためのビーム角度とワークピース移動の連係方法
CN110753596B (zh) 用于对透明易碎的工件进行基于激光的分离的装置和方法
CN105798455B (zh) 激光加工系统和方法
KR20020085893A (ko) 기판 처리 장치 및 상기 장치를 이용한 기판 처리 방법
CN110877161A (zh) 一种基于空间整形飞秒激光分层扫描的异形孔加工系统
JP2006167804A5 (https=)
CN111151873A (zh) 一种脆性材料激光切割装置及方法
JP2014514164A (ja) レーザベースのマーキングの方法及び装置
CN214867994U (zh) 激光加工装置及晶圆加工设备
WO2020239857A1 (en) Laser hole drilling apparatus and method
CN107962305A (zh) 一种高折射率、低硬度透明材料激光切割装置及切割方法
JP2004268104A5 (https=)
TW201720768A (zh) 使用脈衝雷射於玻璃基板形成孔之方法、及製造具有孔之玻璃基板之方法
CN207656103U (zh) 一种高折射率、低硬度透明材料激光切割装置
JP2017104875A (ja) レーザー加工装置及びレーザー加工方法
JP6744624B2 (ja) 管状脆性部材の分断方法並びに分断装置
JP6753347B2 (ja) ガラス基板の製造方法、ガラス基板に孔を形成する方法、およびガラス基板に孔を形成する装置
JP7351479B2 (ja) レーザー表面処理方法
CN111230288A (zh) 激光加工装置以及被加工物的加工方法
JP2007522946A (ja) レーザービーム形成方法及びレーザー処理方法