TW201803674A - 雷射處理設備和雷射處理工件的方法 - Google Patents

雷射處理設備和雷射處理工件的方法 Download PDF

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Publication number
TW201803674A
TW201803674A TW106125299A TW106125299A TW201803674A TW 201803674 A TW201803674 A TW 201803674A TW 106125299 A TW106125299 A TW 106125299A TW 106125299 A TW106125299 A TW 106125299A TW 201803674 A TW201803674 A TW 201803674A
Authority
TW
Taiwan
Prior art keywords
workpiece
laser
pulse
less
laser pulse
Prior art date
Application number
TW106125299A
Other languages
English (en)
Chinese (zh)
Inventor
達瑞 芬恩
麥可 凱斯林卓
Original Assignee
伊雷克托科學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 伊雷克托科學工業股份有限公司 filed Critical 伊雷克托科學工業股份有限公司
Publication of TW201803674A publication Critical patent/TW201803674A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. by grinding, polishing or smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
TW106125299A 2016-07-28 2017-07-27 雷射處理設備和雷射處理工件的方法 TW201803674A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
US62/368,053 2016-07-28

Publications (1)

Publication Number Publication Date
TW201803674A true TW201803674A (zh) 2018-02-01

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106125299A TW201803674A (zh) 2016-07-28 2017-07-27 雷射處理設備和雷射處理工件的方法

Country Status (6)

Country Link
EP (1) EP3490750A4 (https=)
JP (1) JP2019532815A (https=)
KR (1) KR20190025721A (https=)
CN (1) CN109862991A (https=)
TW (1) TW201803674A (https=)
WO (1) WO2018022441A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111902917A (zh) * 2018-03-22 2020-11-06 应用材料公司 对用于半导体器件制造的处理部件的陶瓷表面进行激光抛光
WO2019217180A1 (en) * 2018-05-08 2019-11-14 Lam Research Corporation Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scanner
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
NL2024815A (en) * 2019-02-19 2020-08-27 Asml Holding Nv Laser roughening: engineering the roughness of the burl top
JP7686413B2 (ja) * 2021-03-08 2025-06-02 株式会社東京精密 シリコンウエハのエッジ品質向上方法
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
CN116786993B (zh) * 2023-06-20 2025-08-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
FI20060177A7 (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
EP2252426A4 (en) * 2008-03-21 2014-08-06 Imra America Inc METHOD AND SYSTEMS FOR PROCESSING A LASER BASED MATERIAL
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20160093593A (ko) * 2013-12-05 2016-08-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 거친 표면을 가진 기판을 내부적으로 마킹하는 방법 및 장치
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
CN105108343B (zh) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 一种集装箱焊缝的表面处理工艺
CN105468873B (zh) * 2015-12-24 2018-08-14 中北大学 硅基光波导激光表面光滑化仿真方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法

Also Published As

Publication number Publication date
EP3490750A1 (en) 2019-06-05
JP2019532815A (ja) 2019-11-14
WO2018022441A1 (en) 2018-02-01
EP3490750A4 (en) 2020-04-29
KR20190025721A (ko) 2019-03-11
CN109862991A (zh) 2019-06-07

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