KR20190025721A - 작업물을 레이저 가공하는 레이저 가공 장치 및 방법 - Google Patents

작업물을 레이저 가공하는 레이저 가공 장치 및 방법 Download PDF

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Publication number
KR20190025721A
KR20190025721A KR1020197004389A KR20197004389A KR20190025721A KR 20190025721 A KR20190025721 A KR 20190025721A KR 1020197004389 A KR1020197004389 A KR 1020197004389A KR 20197004389 A KR20197004389 A KR 20197004389A KR 20190025721 A KR20190025721 A KR 20190025721A
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KR
South Korea
Prior art keywords
workpiece
pulse
laser
laser pulse
less
Prior art date
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Ceased
Application number
KR1020197004389A
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English (en)
Korean (ko)
Inventor
다라 핀
마이클 키슬린저
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20190025721A publication Critical patent/KR20190025721A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. by grinding, polishing or smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
KR1020197004389A 2016-07-28 2017-07-21 작업물을 레이저 가공하는 레이저 가공 장치 및 방법 Ceased KR20190025721A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
US62/368,053 2016-07-28
PCT/US2017/043229 WO2018022441A1 (en) 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces

Publications (1)

Publication Number Publication Date
KR20190025721A true KR20190025721A (ko) 2019-03-11

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197004389A Ceased KR20190025721A (ko) 2016-07-28 2017-07-21 작업물을 레이저 가공하는 레이저 가공 장치 및 방법

Country Status (6)

Country Link
EP (1) EP3490750A4 (https=)
JP (1) JP2019532815A (https=)
KR (1) KR20190025721A (https=)
CN (1) CN109862991A (https=)
TW (1) TW201803674A (https=)
WO (1) WO2018022441A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230121932A (ko) * 2018-03-22 2023-08-21 어플라이드 머티어리얼스, 인코포레이티드 반도체 디바이스들의 제조에서 사용될 프로세싱 컴포넌트들의세라믹 표면들의 레이저 폴리싱

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019217180A1 (en) * 2018-05-08 2019-11-14 Lam Research Corporation Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scanner
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
NL2024815A (en) * 2019-02-19 2020-08-27 Asml Holding Nv Laser roughening: engineering the roughness of the burl top
JP7686413B2 (ja) * 2021-03-08 2025-06-02 株式会社東京精密 シリコンウエハのエッジ品質向上方法
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法
CN116786993B (zh) * 2023-06-20 2025-08-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

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CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
FI20060177A7 (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
EP2252426A4 (en) * 2008-03-21 2014-08-06 Imra America Inc METHOD AND SYSTEMS FOR PROCESSING A LASER BASED MATERIAL
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20160093593A (ko) * 2013-12-05 2016-08-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 거친 표면을 가진 기판을 내부적으로 마킹하는 방법 및 장치
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
CN105108343B (zh) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 一种集装箱焊缝的表面处理工艺
CN105468873B (zh) * 2015-12-24 2018-08-14 中北大学 硅基光波导激光表面光滑化仿真方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230121932A (ko) * 2018-03-22 2023-08-21 어플라이드 머티어리얼스, 인코포레이티드 반도체 디바이스들의 제조에서 사용될 프로세싱 컴포넌트들의세라믹 표면들의 레이저 폴리싱

Also Published As

Publication number Publication date
EP3490750A1 (en) 2019-06-05
JP2019532815A (ja) 2019-11-14
WO2018022441A1 (en) 2018-02-01
EP3490750A4 (en) 2020-04-29
TW201803674A (zh) 2018-02-01
CN109862991A (zh) 2019-06-07

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