JP2019530326A5 - - Google Patents

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Publication number
JP2019530326A5
JP2019530326A5 JP2019513798A JP2019513798A JP2019530326A5 JP 2019530326 A5 JP2019530326 A5 JP 2019530326A5 JP 2019513798 A JP2019513798 A JP 2019513798A JP 2019513798 A JP2019513798 A JP 2019513798A JP 2019530326 A5 JP2019530326 A5 JP 2019530326A5
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JP
Japan
Prior art keywords
conductive
insulating layer
conductive pad
pad
pads
Prior art date
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Application number
JP2019513798A
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English (en)
Japanese (ja)
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JP2019530326A (ja
JP7049323B2 (ja
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Priority claimed from PCT/US2017/050768 external-priority patent/WO2018049222A1/en
Publication of JP2019530326A publication Critical patent/JP2019530326A/ja
Publication of JP2019530326A5 publication Critical patent/JP2019530326A5/ja
Application granted granted Critical
Publication of JP7049323B2 publication Critical patent/JP7049323B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019513798A 2016-09-09 2017-09-08 超音波アレイ用の冗長な接続点を有するフレキシブル回路 Active JP7049323B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662385806P 2016-09-09 2016-09-09
US62/385,806 2016-09-09
PCT/US2017/050768 WO2018049222A1 (en) 2016-09-09 2017-09-08 Flexible circuit with redundant connection points for ultrasound array

Publications (3)

Publication Number Publication Date
JP2019530326A JP2019530326A (ja) 2019-10-17
JP2019530326A5 true JP2019530326A5 (enExample) 2020-10-22
JP7049323B2 JP7049323B2 (ja) 2022-04-06

Family

ID=61558909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019513798A Active JP7049323B2 (ja) 2016-09-09 2017-09-08 超音波アレイ用の冗長な接続点を有するフレキシブル回路

Country Status (9)

Country Link
US (1) US10973494B2 (enExample)
EP (1) EP3510794A4 (enExample)
JP (1) JP7049323B2 (enExample)
KR (1) KR102397119B1 (enExample)
CN (1) CN109952768B (enExample)
AU (1) AU2017323625B2 (enExample)
CA (1) CA3035915A1 (enExample)
RU (1) RU2751578C2 (enExample)
WO (1) WO2018049222A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11596812B2 (en) * 2018-04-06 2023-03-07 Regents Of The University Of Minnesota Wearable transcranial dual-mode ultrasound transducers for neuromodulation
FR3107651B1 (fr) * 2020-03-02 2022-03-11 Carthera Procede et systeme pour la detection d’un defaut de couplage acoustique entre un dispositif ultrasonore et un tissu a traiter
US20240306512A1 (en) * 2023-03-09 2024-09-12 Fujifilm Sonosite, Inc. Multi-Layer Flexible Array Interconnect for an Ultrasound Transducer, and Methods of Manufacture

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894425B1 (en) * 1999-03-31 2005-05-17 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound phased array transducer
ATE289223T1 (de) * 1999-07-02 2005-03-15 Prosonic Company Ltd Gerader oder gekrümmter ultraschallwandler und anschlusstechnik dafür
US7288069B2 (en) * 2000-02-07 2007-10-30 Kabushiki Kaisha Toshiba Ultrasonic probe and method of manufacturing the same
JP2009505468A (ja) 2005-08-08 2009-02-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ポリエチレン第三整合層を備える広帯域マトリックストランスデューサ
US7791252B2 (en) * 2007-01-30 2010-09-07 General Electric Company Ultrasound probe assembly and method of fabrication
US20080315331A1 (en) 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
US7834522B2 (en) * 2007-08-03 2010-11-16 Mr Holdings (Hk) Limited Diagnostic ultrasound transducer
KR101151844B1 (ko) * 2011-01-14 2012-06-01 경북대학교 산학협력단 전도성 흡음층 제조 방법 및 이를 구비하는 2차원 배열 초음파 트랜스듀서
US8836203B2 (en) * 2012-03-30 2014-09-16 Measurement Specialties, Inc. Signal return for ultrasonic transducers
CN108209986B (zh) * 2013-02-08 2020-11-10 阿库图森医疗有限公司 带有柔性印刷电路板的可膨胀导管组件
JP6147532B2 (ja) * 2013-03-21 2017-06-14 東芝メディカルシステムズ株式会社 超音波プローブ
US9419202B2 (en) 2013-06-21 2016-08-16 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
JP6252280B2 (ja) * 2014-03-20 2017-12-27 セイコーエプソン株式会社 超音波デバイスユニットおよびプローブ並びに電子機器および超音波画像装置
KR102293575B1 (ko) * 2014-09-04 2021-08-26 삼성메디슨 주식회사 초음파 영상장치용 프로브 및 그 제조방법
JP2016086956A (ja) * 2014-10-31 2016-05-23 セイコーエプソン株式会社 超音波プローブ並びに電子機器および超音波画像装置
KR101685104B1 (ko) * 2014-11-25 2016-12-09 주식회사 모다이노칩 압전 장치 및 그 제조 방법

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