CN109952768B - 用于超声阵列的具有冗余连接点的柔性电路 - Google Patents

用于超声阵列的具有冗余连接点的柔性电路 Download PDF

Info

Publication number
CN109952768B
CN109952768B CN201780068758.0A CN201780068758A CN109952768B CN 109952768 B CN109952768 B CN 109952768B CN 201780068758 A CN201780068758 A CN 201780068758A CN 109952768 B CN109952768 B CN 109952768B
Authority
CN
China
Prior art keywords
conductive
insulating layer
pads
conductive pads
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201780068758.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN109952768A (zh
Inventor
K·J·科斯基
J·D·魏茨施泰因
G·涅米宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EchoNous Inc
Original Assignee
EchoNous Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EchoNous Inc filed Critical EchoNous Inc
Publication of CN109952768A publication Critical patent/CN109952768A/zh
Application granted granted Critical
Publication of CN109952768B publication Critical patent/CN109952768B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B06B1/0215—Driving circuits for generating pulses, e.g. bursts of oscillations, envelopes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/071—Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Pathology (AREA)
  • Medical Informatics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biophysics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
CN201780068758.0A 2016-09-09 2017-09-08 用于超声阵列的具有冗余连接点的柔性电路 Expired - Fee Related CN109952768B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662385806P 2016-09-09 2016-09-09
US62/385,806 2016-09-09
PCT/US2017/050768 WO2018049222A1 (en) 2016-09-09 2017-09-08 Flexible circuit with redundant connection points for ultrasound array

Publications (2)

Publication Number Publication Date
CN109952768A CN109952768A (zh) 2019-06-28
CN109952768B true CN109952768B (zh) 2021-01-08

Family

ID=61558909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780068758.0A Expired - Fee Related CN109952768B (zh) 2016-09-09 2017-09-08 用于超声阵列的具有冗余连接点的柔性电路

Country Status (9)

Country Link
US (1) US10973494B2 (enExample)
EP (1) EP3510794A4 (enExample)
JP (1) JP7049323B2 (enExample)
KR (1) KR102397119B1 (enExample)
CN (1) CN109952768B (enExample)
AU (1) AU2017323625B2 (enExample)
CA (1) CA3035915A1 (enExample)
RU (1) RU2751578C2 (enExample)
WO (1) WO2018049222A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11596812B2 (en) 2018-04-06 2023-03-07 Regents Of The University Of Minnesota Wearable transcranial dual-mode ultrasound transducers for neuromodulation
FR3107651B1 (fr) * 2020-03-02 2022-03-11 Carthera Procede et systeme pour la detection d’un defaut de couplage acoustique entre un dispositif ultrasonore et un tissu a traiter
WO2024186572A1 (en) * 2023-03-09 2024-09-12 Fujifilm Sonosite, Inc. Multi-layer flexible array interconnect for an ultrasound transducer, and methods of manufacture

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396199B1 (en) * 1999-07-02 2002-05-28 Prosonic Co., Ltd. Ultrasonic linear or curvilinear transducer and connection technique therefore
CN101361664A (zh) * 2007-08-03 2009-02-11 迈瑞控股（香港）有限公司 诊断超声换能器
CN105358070A (zh) * 2013-02-08 2016-02-24 阿库图森医疗有限公司 带有柔性印刷电路板的可膨胀导管组件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894425B1 (en) * 1999-03-31 2005-05-17 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound phased array transducer
US7288069B2 (en) * 2000-02-07 2007-10-30 Kabushiki Kaisha Toshiba Ultrasonic probe and method of manufacturing the same
EP1915753B1 (en) * 2005-08-08 2019-04-10 Koninklijke Philips N.V. Wide-bandwidth matrix transducer with polyethylene third matching layer
US7791252B2 (en) * 2007-01-30 2010-09-07 General Electric Company Ultrasound probe assembly and method of fabrication
US20080315331A1 (en) 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
KR101151844B1 (ko) * 2011-01-14 2012-06-01 경북대학교 산학협력단 전도성 흡음층 제조 방법 및 이를 구비하는 2차원 배열 초음파 트랜스듀서
US8836203B2 (en) * 2012-03-30 2014-09-16 Measurement Specialties, Inc. Signal return for ultrasonic transducers
JP6147532B2 (ja) * 2013-03-21 2017-06-14 東芝メディカルシステムズ株式会社 超音波プローブ
US9419202B2 (en) 2013-06-21 2016-08-16 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
JP6252280B2 (ja) * 2014-03-20 2017-12-27 セイコーエプソン株式会社 超音波デバイスユニットおよびプローブ並びに電子機器および超音波画像装置
KR102293575B1 (ko) * 2014-09-04 2021-08-26 삼성메디슨 주식회사 초음파 영상장치용 프로브 및 그 제조방법
JP2016086956A (ja) * 2014-10-31 2016-05-23 セイコーエプソン株式会社 超音波プローブ並びに電子機器および超音波画像装置
KR101685104B1 (ko) * 2014-11-25 2016-12-09 주식회사 모다이노칩 압전 장치 및 그 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396199B1 (en) * 1999-07-02 2002-05-28 Prosonic Co., Ltd. Ultrasonic linear or curvilinear transducer and connection technique therefore
CN101361664A (zh) * 2007-08-03 2009-02-11 迈瑞控股（香港）有限公司 诊断超声换能器
CN105358070A (zh) * 2013-02-08 2016-02-24 阿库图森医疗有限公司 带有柔性印刷电路板的可膨胀导管组件

Also Published As

Publication number Publication date
EP3510794A1 (en) 2019-07-17
KR20190040513A (ko) 2019-04-18
EP3510794A4 (en) 2020-04-29
RU2019110260A (ru) 2020-10-09
RU2751578C2 (ru) 2021-07-15
US20180070920A1 (en) 2018-03-15
JP2019530326A (ja) 2019-10-17
WO2018049222A1 (en) 2018-03-15
AU2017323625A1 (en) 2019-03-28
KR102397119B1 (ko) 2022-05-12
CN109952768A (zh) 2019-06-28
AU2017323625B2 (en) 2022-07-21
US10973494B2 (en) 2021-04-13
CA3035915A1 (en) 2018-03-15
RU2019110260A3 (enExample) 2021-01-15
JP7049323B2 (ja) 2022-04-06

Similar Documents

Publication Publication Date Title
CN1327976C (zh) 用于将声学元件装接到集成电路上的系统
JP4043882B2 (ja) 可変の音響インピーダンスを有する超音波変換器ウェハー
CN102205310B (zh) 超声波转换器、超声波探头、超声波转换器的制造方法
CN103635264B (zh) 超声换能组件及其制造方法
CN102497938B (zh) 带有整体的电连接的超声波成像转换器声学叠层
JP5738671B2 (ja) 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法
US7757389B2 (en) Method of manufacturing an ultrasonic probe
US8405281B2 (en) Transducer for ultrasonic diagnosis device and method for manufacturing the same
CN109952768B (zh) 用于超声阵列的具有冗余连接点的柔性电路
CN1874615B (zh) 超声波探头以及超声波探头制造方法
JP4468599B2 (ja) 超音波探触子
CN111147989A (zh) 具有用于多维换能器阵列的中介层的阵列上芯片
KR102256909B1 (ko) 초음파 트랜스듀서 및 그 제조 방법
JPH0614396A (ja) 超音波探触子
JP4769127B2 (ja) 超音波プローブ及び超音波プローブ製造方法
JP5349141B2 (ja) 超音波プローブ
JP2012065914A (ja) 配線基板及び超音波プローブ
US20180143310A1 (en) 2d ultrasound transducer array and methods of making the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210108