JP2019527468A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019527468A5 JP2019527468A5 JP2018567886A JP2018567886A JP2019527468A5 JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5 JP 2018567886 A JP2018567886 A JP 2018567886A JP 2018567886 A JP2018567886 A JP 2018567886A JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing composition
- compounds
- cobalt
- oxidizing agent
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 44
- 239000000203 mixture Substances 0.000 claims 39
- -1 hydroxylamine compound Chemical class 0.000 claims 22
- 238000000034 method Methods 0.000 claims 19
- 229910017052 cobalt Inorganic materials 0.000 claims 16
- 239000010941 cobalt Substances 0.000 claims 16
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 16
- 239000007800 oxidant agent Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 8
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 claims 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 4
- 238000005260 corrosion Methods 0.000 claims 4
- 230000007797 corrosion Effects 0.000 claims 4
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 239000003112 inhibitor Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 239000006061 abrasive grain Substances 0.000 claims 3
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims 2
- QZTKDVCDBIDYMD-UHFFFAOYSA-N 2,2'-[(2-amino-2-oxoethyl)imino]diacetic acid Chemical compound NC(=O)CN(CC(O)=O)CC(O)=O QZTKDVCDBIDYMD-UHFFFAOYSA-N 0.000 claims 2
- JKMHFZQWWAIEOD-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanesulfonic acid Chemical compound OCC[NH+]1CCN(CCS([O-])(=O)=O)CC1 JKMHFZQWWAIEOD-UHFFFAOYSA-N 0.000 claims 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims 2
- 150000003973 alkyl amines Chemical class 0.000 claims 2
- 150000001413 amino acids Chemical class 0.000 claims 2
- 125000004408 aryl N-oxide group Chemical group 0.000 claims 2
- 239000007998 bicine buffer Substances 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M nitrite group Chemical group N(=O)[O-] IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims 2
- 150000002826 nitrites Chemical class 0.000 claims 2
- 150000002828 nitro derivatives Chemical class 0.000 claims 2
- 150000002832 nitroso derivatives Chemical class 0.000 claims 2
- 229940081066 picolinic acid Drugs 0.000 claims 2
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022064299A JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662362222P | 2016-07-14 | 2016-07-14 | |
| US62/362,222 | 2016-07-14 | ||
| PCT/US2017/041988 WO2018013847A1 (en) | 2016-07-14 | 2017-07-13 | Alternative oxidizing agents for cobalt cmp |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Division JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019527468A JP2019527468A (ja) | 2019-09-26 |
| JP2019527468A5 true JP2019527468A5 (cg-RX-API-DMAC7.html) | 2020-08-06 |
| JP7253924B2 JP7253924B2 (ja) | 2023-04-07 |
Family
ID=60942463
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018567886A Active JP7253924B2 (ja) | 2016-07-14 | 2017-07-13 | コバルトｃｍｐ用の代替的な酸化剤 |
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11851584B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3484971B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP7253924B2 (cg-RX-API-DMAC7.html) |
| KR (3) | KR20230014887A (cg-RX-API-DMAC7.html) |
| CN (1) | CN109415599B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI660017B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2018013847A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020066786A1 (ja) * | 2018-09-28 | 2020-04-02 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP7326048B2 (ja) * | 2018-09-28 | 2023-08-15 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| WO2021076352A1 (en) * | 2019-10-15 | 2021-04-22 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| JP2022061016A (ja) * | 2020-10-05 | 2022-04-15 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
| MY144587A (en) * | 2001-06-21 | 2011-10-14 | Kao Corp | Polishing composition |
| US7029373B2 (en) | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US6692546B2 (en) | 2001-08-14 | 2004-02-17 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| IL154782A0 (en) * | 2003-03-06 | 2003-10-31 | J G Systems Inc | Chemical-mechanical polishing composition containing organic nitro compounds |
| US7736405B2 (en) | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| JP2005056879A (ja) * | 2003-08-01 | 2005-03-03 | Tosoh Corp | 銅系金属用研磨液及び研磨方法 |
| US20090215269A1 (en) | 2005-06-06 | 2009-08-27 | Advanced Technology Materials Inc. | Integrated chemical mechanical polishing composition and process for single platen processing |
| WO2007019342A2 (en) | 2005-08-05 | 2007-02-15 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
| JP2009512194A (ja) * | 2005-10-05 | 2009-03-19 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | ポストエッチング残渣を除去するための酸化性水性洗浄剤 |
| US7732393B2 (en) | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
| WO2009042073A2 (en) * | 2007-09-21 | 2009-04-02 | Cabot Microelectronics Corporation | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
| EP2814895A4 (en) * | 2012-02-15 | 2015-10-07 | Entegris Inc | POST-CMP DISPOSAL USING COMPOSITIONS AND USE PROCESSES |
| US8999193B2 (en) * | 2012-05-10 | 2015-04-07 | Air Products And Chemicals, Inc. | Chemical mechanical polishing composition having chemical additives and methods for using same |
| US10217645B2 (en) * | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
| JP6646051B2 (ja) * | 2014-10-21 | 2020-02-14 | キャボット マイクロエレクトロニクス コーポレイション | コバルト研磨促進剤 |
| EP3209815B1 (en) | 2014-10-21 | 2021-12-29 | CMC Materials, Inc. | Corrosion inhibitors and related compositions and methods |
| WO2016065067A1 (en) * | 2014-10-21 | 2016-04-28 | Cabot Microelectronics Corporation | Cobalt dishing control agents |
| US9944828B2 (en) * | 2014-10-21 | 2018-04-17 | Cabot Microelectronics Corporation | Slurry for chemical mechanical polishing of cobalt |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| US9528030B1 (en) * | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
-
2017
- 2017-07-12 TW TW106123275A patent/TWI660017B/zh active
- 2017-07-13 KR KR1020237002200A patent/KR20230014887A/ko not_active Ceased
- 2017-07-13 CN CN201780041554.8A patent/CN109415599B/zh active Active
- 2017-07-13 EP EP17828487.3A patent/EP3484971B1/en active Active
- 2017-07-13 JP JP2018567886A patent/JP7253924B2/ja active Active
- 2017-07-13 US US15/649,378 patent/US11851584B2/en active Active
- 2017-07-13 KR KR1020197004126A patent/KR20190018751A/ko not_active Ceased
- 2017-07-13 WO PCT/US2017/041988 patent/WO2018013847A1/en not_active Ceased
- 2017-07-13 KR KR1020247040827A patent/KR20250005498A/ko active Pending
-
2022
- 2022-04-08 JP JP2022064299A patent/JP2022097502A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019527468A5 (cg-RX-API-DMAC7.html) | ||
| JP2017538285A5 (cg-RX-API-DMAC7.html) | ||
| JP6603309B2 (ja) | ゲルマニウムの化学機械研磨 | |
| JP6530401B2 (ja) | 窒化ケイ素の選択的な除去のためのｃｍｐ組成物及び方法 | |
| CN106104764B (zh) | 用于钨材料的化学机械抛光的组合物及方法 | |
| US7947130B2 (en) | Troika acid semiconductor cleaning compositions and methods of use | |
| JP2017514295A (ja) | タングステンｃｍｐのための組成物 | |
| CN104934308A (zh) | 切削方法 | |
| KR20170076719A (ko) | 코발트 연마 가속화제 | |
| KR20230144107A (ko) | 텅스텐 cmp용 조성물 | |
| JP2022097502A (ja) | コバルトｃｍｐ用の代替的な酸化剤 | |
| JP2018535230A5 (cg-RX-API-DMAC7.html) | ||
| TW200918656A (en) | Metal polishing slurry and chemical/mechanical polishing method | |
| JP6491208B2 (ja) | カチオン界面活性剤を有するラッピングスラリー | |
| CN104916582B (zh) | 加工方法 | |
| KR101349758B1 (ko) | 화학 기계적 연마 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법 | |
| TWI774889B (zh) | 用於降低磨料顆粒與清潔刷之間的相互作用之組合物及方法 | |
| TWI825357B (zh) | 研磨鎢圖案晶圓之化學機械研磨漿料組成物以及使用其研磨鎢圖案晶圓之方法 | |
| WANG et al. | Surface modified alumina particles and their chemical mechanical polishing (CMP) behavior on C-plane (0001) sapphire substrate | |
| TW202600797A (zh) | 洗淨液、洗淨方法 | |
| JP2015174164A (ja) | ツルーイング用砥石 | |
| JP2015174178A (ja) | バイト切削方法 | |
| WO2021025067A1 (ja) | ウェットブラスト加工方法において用いられるスラリ | |
| TWI880128B (zh) | 矽晶圓拋光組合物及方法 | |
| KR101641564B1 (ko) | 도금 처리 이후에 기판상에 금속 입자 결함 물질의 형성을 방지하기 위한 방법 및 용액 |