JP2019527468A5 - - Google Patents
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- Publication number
- JP2019527468A5 JP2019527468A5 JP2018567886A JP2018567886A JP2019527468A5 JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5 JP 2018567886 A JP2018567886 A JP 2018567886A JP 2018567886 A JP2018567886 A JP 2018567886A JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing composition
- compounds
- cobalt
- oxidizing agent
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 44
- 239000000203 mixture Substances 0.000 claims 39
- -1 hydroxylamine compound Chemical class 0.000 claims 22
- 238000000034 method Methods 0.000 claims 19
- 229910017052 cobalt Inorganic materials 0.000 claims 16
- 239000010941 cobalt Substances 0.000 claims 16
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 16
- 239000007800 oxidant agent Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 8
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 claims 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 4
- 238000005260 corrosion Methods 0.000 claims 4
- 230000007797 corrosion Effects 0.000 claims 4
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 239000003112 inhibitor Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 239000006061 abrasive grain Substances 0.000 claims 3
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims 2
- QZTKDVCDBIDYMD-UHFFFAOYSA-N 2,2'-[(2-amino-2-oxoethyl)imino]diacetic acid Chemical compound NC(=O)CN(CC(O)=O)CC(O)=O QZTKDVCDBIDYMD-UHFFFAOYSA-N 0.000 claims 2
- JKMHFZQWWAIEOD-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanesulfonic acid Chemical compound OCC[NH+]1CCN(CCS([O-])(=O)=O)CC1 JKMHFZQWWAIEOD-UHFFFAOYSA-N 0.000 claims 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims 2
- 150000003973 alkyl amines Chemical class 0.000 claims 2
- 150000001413 amino acids Chemical class 0.000 claims 2
- 125000004408 aryl N-oxide group Chemical group 0.000 claims 2
- 239000007998 bicine buffer Substances 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M nitrite group Chemical group N(=O)[O-] IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims 2
- 150000002826 nitrites Chemical class 0.000 claims 2
- 150000002828 nitro derivatives Chemical class 0.000 claims 2
- 150000002832 nitroso derivatives Chemical class 0.000 claims 2
- 229940081066 picolinic acid Drugs 0.000 claims 2
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022064299A JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662362222P | 2016-07-14 | 2016-07-14 | |
| US62/362,222 | 2016-07-14 | ||
| PCT/US2017/041988 WO2018013847A1 (en) | 2016-07-14 | 2017-07-13 | Alternative oxidizing agents for cobalt cmp |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Division JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019527468A JP2019527468A (ja) | 2019-09-26 |
| JP2019527468A5 true JP2019527468A5 (OSRAM) | 2020-08-06 |
| JP7253924B2 JP7253924B2 (ja) | 2023-04-07 |
Family
ID=60942463
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018567886A Active JP7253924B2 (ja) | 2016-07-14 | 2017-07-13 | コバルトｃｍｐ用の代替的な酸化剤 |
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11851584B2 (OSRAM) |
| EP (1) | EP3484971B1 (OSRAM) |
| JP (2) | JP7253924B2 (OSRAM) |
| KR (3) | KR20230014887A (OSRAM) |
| CN (1) | CN109415599B (OSRAM) |
| TW (1) | TWI660017B (OSRAM) |
| WO (1) | WO2018013847A1 (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11814547B2 (en) * | 2018-09-28 | 2023-11-14 | Kao Corporation | Polishing liquid composition for silicon oxide film |
| JP7326048B2 (ja) * | 2018-09-28 | 2023-08-15 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| CN113039039B (zh) * | 2019-10-15 | 2024-07-26 | 富士胶片电子材料美国有限公司 | 抛光组合物及其使用方法 |
| JP2022061016A (ja) * | 2020-10-05 | 2022-04-15 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
| CN100378145C (zh) * | 2001-06-21 | 2008-04-02 | 花王株式会社 | 研磨液组合物 |
| US7029373B2 (en) | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US6692546B2 (en) | 2001-08-14 | 2004-02-17 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| IL154782A0 (en) * | 2003-03-06 | 2003-10-31 | J G Systems Inc | Chemical-mechanical polishing composition containing organic nitro compounds |
| US7736405B2 (en) | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| JP2005056879A (ja) * | 2003-08-01 | 2005-03-03 | Tosoh Corp | 銅系金属用研磨液及び研磨方法 |
| WO2006133249A2 (en) * | 2005-06-06 | 2006-12-14 | Advanced Technology Materials, Inc. | Integrated chemical mechanical polishing composition and process for single platen processing |
| WO2007019342A2 (en) | 2005-08-05 | 2007-02-15 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
| JP2009512194A (ja) | 2005-10-05 | 2009-03-19 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | ポストエッチング残渣を除去するための酸化性水性洗浄剤 |
| US7732393B2 (en) | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
| SG184772A1 (en) * | 2007-09-21 | 2012-10-30 | Cabot Microelectronics Corp | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
| KR102105381B1 (ko) | 2012-02-15 | 2020-04-29 | 엔테그리스, 아이엔씨. | 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법 |
| US8999193B2 (en) * | 2012-05-10 | 2015-04-07 | Air Products And Chemicals, Inc. | Chemical mechanical polishing composition having chemical additives and methods for using same |
| US10217645B2 (en) * | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
| CN116288366A (zh) | 2014-10-21 | 2023-06-23 | Cmc材料股份有限公司 | 腐蚀抑制剂以及相关的组合物及方法 |
| US9688885B2 (en) * | 2014-10-21 | 2017-06-27 | Cabot Microelectronics Corporation | Cobalt polishing accelerators |
| US9944828B2 (en) * | 2014-10-21 | 2018-04-17 | Cabot Microelectronics Corporation | Slurry for chemical mechanical polishing of cobalt |
| CN107075310B (zh) | 2014-10-21 | 2019-04-02 | 嘉柏微电子材料股份公司 | 钴凹陷控制剂 |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| US9528030B1 (en) * | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
-
2017
- 2017-07-12 TW TW106123275A patent/TWI660017B/zh active
- 2017-07-13 EP EP17828487.3A patent/EP3484971B1/en active Active
- 2017-07-13 KR KR1020237002200A patent/KR20230014887A/ko not_active Ceased
- 2017-07-13 KR KR1020197004126A patent/KR20190018751A/ko not_active Ceased
- 2017-07-13 US US15/649,378 patent/US11851584B2/en active Active
- 2017-07-13 KR KR1020247040827A patent/KR20250005498A/ko active Pending
- 2017-07-13 CN CN201780041554.8A patent/CN109415599B/zh active Active
- 2017-07-13 JP JP2018567886A patent/JP7253924B2/ja active Active
- 2017-07-13 WO PCT/US2017/041988 patent/WO2018013847A1/en not_active Ceased
-
2022
- 2022-04-08 JP JP2022064299A patent/JP2022097502A/ja not_active Withdrawn
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