JP2019526663A5 - - Google Patents
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- Publication number
- JP2019526663A5 JP2019526663A5 JP2019508862A JP2019508862A JP2019526663A5 JP 2019526663 A5 JP2019526663 A5 JP 2019526663A5 JP 2019508862 A JP2019508862 A JP 2019508862A JP 2019508862 A JP2019508862 A JP 2019508862A JP 2019526663 A5 JP2019526663 A5 JP 2019526663A5
- Authority
- JP
- Japan
- Prior art keywords
- curable composition
- component
- acrylate
- composition according
- printing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 44
- 238000010146 3D printing Methods 0.000 claims 21
- 239000000463 material Substances 0.000 claims 19
- 239000002243 precursor Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 8
- 239000000178 monomer Substances 0.000 claims 6
- 238000001723 curing Methods 0.000 claims 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims 2
- FVWIZBUNTMSPLO-UHFFFAOYSA-N 1-ethenyl-3-nonylpyrrolidin-2-one Chemical compound C(CCCCCCCC)C1C(N(CC1)C=C)=O FVWIZBUNTMSPLO-UHFFFAOYSA-N 0.000 claims 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims 2
- -1 ethoxy(ethoxyethyl) Chemical group 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 239000000976 ink Substances 0.000 claims 2
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 claims 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 2
- 229920000058 polyacrylate Polymers 0.000 claims 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- PHPRWKJDGHSJMI-UHFFFAOYSA-N 1-adamantyl prop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C=C)C3 PHPRWKJDGHSJMI-UHFFFAOYSA-N 0.000 claims 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims 1
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 claims 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000012963 UV stabilizer Substances 0.000 claims 1
- 239000006096 absorbing agent Substances 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 125000005250 alkyl acrylate group Chemical group 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 239000002216 antistatic agent Substances 0.000 claims 1
- 229920001400 block copolymer Polymers 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000002270 dispersing agent Substances 0.000 claims 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000314 lubricant Substances 0.000 claims 1
- 239000003605 opacifier Substances 0.000 claims 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 claims 1
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical class OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920000193 polymethacrylate Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical compound [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 claims 1
- 238000003847 radiation curing Methods 0.000 claims 1
- 239000006254 rheological additive Substances 0.000 claims 1
- 238000007142 ring opening reaction Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims 1
- 239000013008 thixotropic agent Substances 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662375487P | 2016-08-16 | 2016-08-16 | |
| US62/375,487 | 2016-08-16 | ||
| PCT/EP2017/066965 WO2018033296A1 (en) | 2016-08-16 | 2017-07-06 | Polymerization-induced phase-separating compositions for acrylate-based networks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019526663A JP2019526663A (ja) | 2019-09-19 |
| JP2019526663A5 true JP2019526663A5 (enExample) | 2020-07-16 |
Family
ID=59384134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019508862A Pending JP2019526663A (ja) | 2016-08-16 | 2017-07-06 | アクリレート系ネットワーク用の重合誘起相分離組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11001664B2 (enExample) |
| EP (1) | EP3500608B1 (enExample) |
| JP (1) | JP2019526663A (enExample) |
| KR (1) | KR102287447B1 (enExample) |
| CN (1) | CN109641998B (enExample) |
| CA (1) | CA3032215A1 (enExample) |
| ES (1) | ES2971285T3 (enExample) |
| TW (1) | TWI659047B (enExample) |
| WO (1) | WO2018033296A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017179176A (ja) * | 2016-03-31 | 2017-10-05 | ナミックス株式会社 | フィルム状半導体封止剤、および半導体装置 |
| JP7576978B2 (ja) * | 2017-07-31 | 2024-11-01 | ダウ シリコーンズ コーポレーション | 湿分硬化性組成物 |
| TWI684606B (zh) * | 2017-10-31 | 2020-02-11 | 法商阿科瑪法國公司 | 以不混溶之反應性組分及嵌段共聚物為主的可固化組成物 |
| JP2022508828A (ja) * | 2018-10-17 | 2022-01-19 | インクビット， エルエルシー | インクジェット３ｄ印刷に用いられる強化されたポリマー材料 |
| AU2019360133A1 (en) | 2018-10-17 | 2021-05-20 | Inkbit, LLC | Thiol-ene printable resins for inkjet 3D printing |
| CA3122394A1 (en) | 2018-12-10 | 2020-06-18 | Inkbit, LLC | Precision system for additive fabrication |
| KR102602511B1 (ko) * | 2019-02-14 | 2023-11-14 | 주식회사 엘지화학 | 우수한 인성을 제공하는 3d 잉크젯 프린팅용 잉크 조성물 |
| AU2021286632A1 (en) | 2020-06-10 | 2023-01-19 | Inkbit, LLC | Materials for photoinitiated cationic ring-opening polymerization and uses thereof |
| FR3111902B1 (fr) | 2020-06-30 | 2023-03-10 | Arkema France | Oligomères contenant un amide fonctionnalisés par (méth)acrylate |
| US20220177624A1 (en) * | 2020-12-08 | 2022-06-09 | University Of Iowa Research Foundation | Polymer networks with unique properties |
| FR3118051A1 (fr) | 2020-12-21 | 2022-06-24 | Arkema France | Compositions durcissables par rayonnement actinique contenant un polyamide |
| CN116694128B (zh) * | 2023-06-28 | 2023-11-24 | 鹤山市炎墨科技有限公司 | 一种含有嵌段共聚物的防焊油墨及其制备方法 |
| CN117325449B (zh) * | 2023-10-08 | 2025-09-19 | 吉林大学 | 基于聚合诱导微相分离的结构化材料的3d打印方法 |
| WO2025169200A1 (en) * | 2024-02-06 | 2025-08-14 | Nano Dimension Technologies, Ltd. | Compositions eliminating onset of translational mobility in cured polymers |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001068769A1 (en) | 2000-03-16 | 2001-09-20 | Kraton Polymers Research B.V. | Polymeric composition |
| JP2005506430A (ja) * | 2001-10-18 | 2005-03-03 | クレイトン・ポリマーズ・リサーチ・ベー・ベー | 固体の硬化性重合体組成物 |
| KR101261847B1 (ko) | 2005-01-20 | 2013-05-07 | 아르끄마 프랑스 | 개선된 내충격성을 갖는 열경화성 물질 |
| US9676899B2 (en) | 2006-05-01 | 2017-06-13 | Dsm Ip Assets B.V. | Radiation curable resin composition and rapid three dimensional imaging process using the same |
| KR20090076916A (ko) * | 2006-10-11 | 2009-07-13 | 헥시온 스페셜티 케미칼즈 인코퍼레이티드 | 방사선 경화성 잉크 |
| US8362148B2 (en) | 2007-03-14 | 2013-01-29 | 3D Systems, Inc. | Curable composition |
| US8754144B2 (en) * | 2012-10-15 | 2014-06-17 | Rohitha Muthumala Jayasuriya | Radiation cureable heat seal blister-coating compositions |
| CN104937000B (zh) * | 2013-03-28 | 2019-07-05 | 太阳油墨制造株式会社 | 活性能量射线固化性树脂组合物及其固化物 |
| JP6343439B2 (ja) * | 2013-09-30 | 2018-06-13 | 太陽インキ製造株式会社 | プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板 |
| WO2015165363A1 (zh) * | 2014-04-30 | 2015-11-05 | 中国科学院化学研究所 | 一种用于3d打印的材料及其制备方法和制品 |
| CN104788625A (zh) | 2015-04-27 | 2015-07-22 | 北京印刷学院 | 制作柔性版的自由基光固化材料及其制备方法和应用 |
-
2017
- 2017-07-06 EP EP17742666.5A patent/EP3500608B1/en active Active
- 2017-07-06 US US16/325,770 patent/US11001664B2/en active Active
- 2017-07-06 CN CN201780050473.4A patent/CN109641998B/zh active Active
- 2017-07-06 WO PCT/EP2017/066965 patent/WO2018033296A1/en not_active Ceased
- 2017-07-06 JP JP2019508862A patent/JP2019526663A/ja active Pending
- 2017-07-06 CA CA3032215A patent/CA3032215A1/en active Pending
- 2017-07-06 ES ES17742666T patent/ES2971285T3/es active Active
- 2017-07-06 KR KR1020197007365A patent/KR102287447B1/ko active Active
- 2017-07-18 TW TW106123999A patent/TWI659047B/zh active
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