JP2019526053A5 - - Google Patents

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Publication number
JP2019526053A5
JP2019526053A5 JP2019504839A JP2019504839A JP2019526053A5 JP 2019526053 A5 JP2019526053 A5 JP 2019526053A5 JP 2019504839 A JP2019504839 A JP 2019504839A JP 2019504839 A JP2019504839 A JP 2019504839A JP 2019526053 A5 JP2019526053 A5 JP 2019526053A5
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JP
Japan
Prior art keywords
path
irradiation
measurement system
images
light sources
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JP2019504839A
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English (en)
Japanese (ja)
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JP2019526053A (ja
JP6771647B2 (ja
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Priority claimed from US15/222,503 external-priority patent/US10048132B2/en
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JP2019504839A 2016-07-28 2017-07-28 複数の目標からのオーバレイ信号の同時取得 Active JP6771647B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/222,503 2016-07-28
US15/222,503 US10048132B2 (en) 2016-07-28 2016-07-28 Simultaneous capturing of overlay signals from multiple targets
PCT/US2017/044528 WO2018023078A1 (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Publications (3)

Publication Number Publication Date
JP2019526053A JP2019526053A (ja) 2019-09-12
JP2019526053A5 true JP2019526053A5 (enExample) 2020-09-10
JP6771647B2 JP6771647B2 (ja) 2020-10-21

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JP2019504839A Active JP6771647B2 (ja) 2016-07-28 2017-07-28 複数の目標からのオーバレイ信号の同時取得

Country Status (7)

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US (2) US10048132B2 (enExample)
JP (1) JP6771647B2 (enExample)
KR (1) KR102180433B1 (enExample)
CN (2) CN112432926B (enExample)
SG (2) SG10201912512UA (enExample)
TW (1) TWI728157B (enExample)
WO (1) WO2018023078A1 (enExample)

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EP3528047A1 (en) * 2018-02-14 2019-08-21 ASML Netherlands B.V. Method and apparatus for measuring a parameter of interest using image plane detection techniques
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EP3575875A1 (en) 2018-05-31 2019-12-04 ASML Netherlands B.V. Measurement apparatus and method of measuring a target
JP7344954B2 (ja) * 2018-08-28 2023-09-14 ケーエルエー コーポレイション 二回折次数撮像を用いるオフ軸照明オーバレイ計測
EP3853666B1 (en) * 2018-09-19 2022-08-10 ASML Netherlands B.V. Metrology sensor for position metrology
US11119417B2 (en) * 2018-11-21 2021-09-14 Kla-Tencor Corporation Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s)
US11073768B2 (en) * 2019-06-26 2021-07-27 Kla Corporation Metrology target for scanning metrology
US11359916B2 (en) * 2019-09-09 2022-06-14 Kla Corporation Darkfield imaging of grating target structures for overlay measurement
US11933717B2 (en) 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
JP7365510B2 (ja) * 2020-01-29 2023-10-19 エーエスエムエル ネザーランズ ビー.ブイ. 基板上の周期構造を測定するための計測方法およびデバイス
US11604149B2 (en) * 2020-04-23 2023-03-14 Kla Corporation Metrology methods and optical schemes for measurement of misregistration by using hatched target designs
WO2022040221A1 (en) 2020-08-17 2022-02-24 Tokyo Electron Limited Method for producing overlay results with absolute reference for semiconductor manufacturing
US11428642B2 (en) * 2021-01-04 2022-08-30 Kla Corporation Scanning scatterometry overlay measurement
US20220357674A1 (en) * 2021-05-04 2022-11-10 Kla Corporation Oblique illumination for overlay metrology
US11531275B1 (en) * 2021-08-25 2022-12-20 Kla Corporation Parallel scatterometry overlay metrology
CN118159913A (zh) * 2021-10-29 2024-06-07 Asml荷兰有限公司 检查装置、可旋转保偏射束移位器和方法
JP2023116048A (ja) * 2022-02-09 2023-08-22 キオクシア株式会社 計測装置および計測方法
KR20250040583A (ko) * 2022-07-19 2025-03-24 에이에스엠엘 네델란즈 비.브이. 리소그래피 시스템을 위한 향상된 정렬 장치
US20250362617A1 (en) * 2022-08-10 2025-11-27 Asml Netherlands B.V. Metrology method and associated metrology device
KR20240108945A (ko) 2023-01-03 2024-07-10 삼성전자주식회사 기판 검사 장치 및 기판 검사 방법
US12411420B2 (en) * 2023-09-29 2025-09-09 Kla Corporation Small in-die target design for overlay measurement
US20250306477A1 (en) * 2024-03-27 2025-10-02 Kla Corporation Single grab pupil landscape via outside the objective lens broadband illumination

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JPH05157521A (ja) * 1991-08-29 1993-06-22 Nkk Corp エリプソパラメータ測定方法及びエリプソメータ
US5734498A (en) * 1994-05-09 1998-03-31 The Regents Of The University Of California Illuminator elements for conventional light microscopes
US6710876B1 (en) * 2000-08-14 2004-03-23 Kla-Tencor Technologies Corporation Metrology system using optical phase
US6768543B1 (en) 2001-11-01 2004-07-27 Arun Ananth Aiyer Wafer inspection apparatus with unique illumination methodology and method of operation
US7957066B2 (en) * 2003-02-21 2011-06-07 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US7561282B1 (en) * 2006-03-27 2009-07-14 Kla-Tencor Technologies Corporation Techniques for determining overlay and critical dimension using a single metrology tool
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