JP6771647B2 - 複数の目標からのオーバレイ信号の同時取得 - Google Patents
複数の目標からのオーバレイ信号の同時取得 Download PDFInfo
- Publication number
- JP6771647B2 JP6771647B2 JP2019504839A JP2019504839A JP6771647B2 JP 6771647 B2 JP6771647 B2 JP 6771647B2 JP 2019504839 A JP2019504839 A JP 2019504839A JP 2019504839 A JP2019504839 A JP 2019504839A JP 6771647 B2 JP6771647 B2 JP 6771647B2
- Authority
- JP
- Japan
- Prior art keywords
- irradiation
- path
- pupil
- measurement system
- images
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J4/00—Measuring polarisation of light
- G01J4/04—Polarimeters using electric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4792—Polarisation of scatter light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Peptides Or Proteins (AREA)
- Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/222,503 US10048132B2 (en) | 2016-07-28 | 2016-07-28 | Simultaneous capturing of overlay signals from multiple targets |
| US15/222,503 | 2016-07-28 | ||
| PCT/US2017/044528 WO2018023078A1 (en) | 2016-07-28 | 2017-07-28 | Simultaneous capturing of overlay signals from multiple targets |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019526053A JP2019526053A (ja) | 2019-09-12 |
| JP2019526053A5 JP2019526053A5 (enExample) | 2020-09-10 |
| JP6771647B2 true JP6771647B2 (ja) | 2020-10-21 |
Family
ID=61009490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504839A Active JP6771647B2 (ja) | 2016-07-28 | 2017-07-28 | 複数の目標からのオーバレイ信号の同時取得 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10048132B2 (enExample) |
| JP (1) | JP6771647B2 (enExample) |
| KR (1) | KR102180433B1 (enExample) |
| CN (2) | CN112432926B (enExample) |
| SG (2) | SG11201900509YA (enExample) |
| TW (1) | TWI728157B (enExample) |
| WO (1) | WO2018023078A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3528047A1 (en) * | 2018-02-14 | 2019-08-21 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of interest using image plane detection techniques |
| US10809124B2 (en) * | 2018-05-07 | 2020-10-20 | Perkinelmer Health Sciences, Inc. | Spectrometers and instruments including them |
| EP3575875A1 (en) * | 2018-05-31 | 2019-12-04 | ASML Netherlands B.V. | Measurement apparatus and method of measuring a target |
| CN112567296B (zh) * | 2018-08-28 | 2024-03-08 | 科磊股份有限公司 | 使用二衍射级成像的离轴照明覆盖测量 |
| EP3853666B1 (en) * | 2018-09-19 | 2022-08-10 | ASML Netherlands B.V. | Metrology sensor for position metrology |
| US11119417B2 (en) * | 2018-11-21 | 2021-09-14 | Kla-Tencor Corporation | Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s) |
| US11073768B2 (en) | 2019-06-26 | 2021-07-27 | Kla Corporation | Metrology target for scanning metrology |
| US11359916B2 (en) * | 2019-09-09 | 2022-06-14 | Kla Corporation | Darkfield imaging of grating target structures for overlay measurement |
| US11933717B2 (en) | 2019-09-27 | 2024-03-19 | Kla Corporation | Sensitive optical metrology in scanning and static modes |
| US20230064193A1 (en) * | 2020-01-29 | 2023-03-02 | Asml Netherlands B.V. | Metrology method and device for measuring a periodic structure on a substrate |
| US11604149B2 (en) * | 2020-04-23 | 2023-03-14 | Kla Corporation | Metrology methods and optical schemes for measurement of misregistration by using hatched target designs |
| US11966171B2 (en) | 2020-08-17 | 2024-04-23 | Tokyo Electron Limited | Method for producing overlay results with absolute reference for semiconductor manufacturing |
| US11428642B2 (en) * | 2021-01-04 | 2022-08-30 | Kla Corporation | Scanning scatterometry overlay measurement |
| US20220357674A1 (en) * | 2021-05-04 | 2022-11-10 | Kla Corporation | Oblique illumination for overlay metrology |
| US11531275B1 (en) * | 2021-08-25 | 2022-12-20 | Kla Corporation | Parallel scatterometry overlay metrology |
| CN118159913A (zh) * | 2021-10-29 | 2024-06-07 | Asml荷兰有限公司 | 检查装置、可旋转保偏射束移位器和方法 |
| JP2023116048A (ja) * | 2022-02-09 | 2023-08-22 | キオクシア株式会社 | 計測装置および計測方法 |
| KR20250040583A (ko) * | 2022-07-19 | 2025-03-24 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 시스템을 위한 향상된 정렬 장치 |
| WO2024033035A1 (en) * | 2022-08-10 | 2024-02-15 | Asml Netherlands B.V. | Metrology method and associated metrology device |
| KR20240108945A (ko) | 2023-01-03 | 2024-07-10 | 삼성전자주식회사 | 기판 검사 장치 및 기판 검사 방법 |
| US12411420B2 (en) * | 2023-09-29 | 2025-09-09 | Kla Corporation | Small in-die target design for overlay measurement |
| US20250306477A1 (en) * | 2024-03-27 | 2025-10-02 | Kla Corporation | Single grab pupil landscape via outside the objective lens broadband illumination |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8600638A (nl) * | 1986-03-12 | 1987-10-01 | Philips Nv | Inrichting voor het ten opzichte van elkaar uitrichten van een masker en een substraat. |
| JPH05157521A (ja) * | 1991-08-29 | 1993-06-22 | Nkk Corp | エリプソパラメータ測定方法及びエリプソメータ |
| US5734498A (en) * | 1994-05-09 | 1998-03-31 | The Regents Of The University Of California | Illuminator elements for conventional light microscopes |
| US6710876B1 (en) * | 2000-08-14 | 2004-03-23 | Kla-Tencor Technologies Corporation | Metrology system using optical phase |
| US6768543B1 (en) | 2001-11-01 | 2004-07-27 | Arun Ananth Aiyer | Wafer inspection apparatus with unique illumination methodology and method of operation |
| US7957066B2 (en) * | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US7561282B1 (en) * | 2006-03-27 | 2009-07-14 | Kla-Tencor Technologies Corporation | Techniques for determining overlay and critical dimension using a single metrology tool |
| CN101477313B (zh) * | 2006-04-04 | 2013-04-17 | 特萨斯克里伯斯有限公司 | 用于微构造存储介质的设备和方法以及包括微构造区域的存储介质 |
| US7692792B2 (en) * | 2006-06-22 | 2010-04-06 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| US7701577B2 (en) * | 2007-02-21 | 2010-04-20 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| IL194839A0 (en) * | 2007-10-25 | 2009-08-03 | Asml Netherlands Bv | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| US8441639B2 (en) * | 2009-09-03 | 2013-05-14 | Kla-Tencor Corp. | Metrology systems and methods |
| NL2006229A (en) * | 2010-03-18 | 2011-09-20 | Asml Netherlands Bv | Inspection method and apparatus, and associated computer readable product. |
| US8896832B2 (en) * | 2010-06-17 | 2014-11-25 | Kla-Tencor Corp. | Discrete polarization scatterometry |
| WO2013152878A2 (en) * | 2012-04-12 | 2013-10-17 | Asml Holding N.V. | Position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method, optical element |
| US8817273B2 (en) * | 2012-04-24 | 2014-08-26 | Nanometrics Incorporated | Dark field diffraction based overlay |
| JP6120967B2 (ja) | 2012-08-16 | 2017-04-26 | エーエスエムエル ネザーランズ ビー.ブイ. | 微細構造の非対称性を測定する方法及び装置、位置測定方法、位置測定装置、リソグラフィ装置及びデバイス製造方法 |
| CA2889495A1 (en) * | 2012-10-30 | 2014-05-08 | California Institute Of Technology | Fourier ptychographic imaging systems, devices, and methods |
| US9091650B2 (en) * | 2012-11-27 | 2015-07-28 | Kla-Tencor Corporation | Apodization for pupil imaging scatterometry |
| KR102124204B1 (ko) | 2013-08-07 | 2020-06-18 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| CA2921372A1 (en) * | 2013-08-22 | 2015-02-26 | California Institute Of Technology | Variable-illumination fourier ptychographic imaging devices, systems, and methods |
| US10795144B2 (en) * | 2014-12-06 | 2020-10-06 | Howard Hughes Medical Institute | Microscopy with structured plane illumination and point accumulation for imaging and nanoscale topography |
-
2016
- 2016-07-28 US US15/222,503 patent/US10048132B2/en active Active
-
2017
- 2017-07-28 CN CN202011221908.7A patent/CN112432926B/zh active Active
- 2017-07-28 TW TW106125402A patent/TWI728157B/zh active
- 2017-07-28 JP JP2019504839A patent/JP6771647B2/ja active Active
- 2017-07-28 KR KR1020197005724A patent/KR102180433B1/ko active Active
- 2017-07-28 SG SG11201900509YA patent/SG11201900509YA/en unknown
- 2017-07-28 SG SG10201912512UA patent/SG10201912512UA/en unknown
- 2017-07-28 WO PCT/US2017/044528 patent/WO2018023078A1/en not_active Ceased
- 2017-07-28 CN CN201780046742.XA patent/CN109564160B/zh active Active
-
2018
- 2018-08-01 US US16/052,044 patent/US10401228B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112432926A (zh) | 2021-03-02 |
| TW201805593A (zh) | 2018-02-16 |
| WO2018023078A1 (en) | 2018-02-01 |
| CN109564160B (zh) | 2020-11-10 |
| US20180031424A1 (en) | 2018-02-01 |
| KR102180433B1 (ko) | 2020-11-19 |
| KR20190026039A (ko) | 2019-03-12 |
| SG10201912512UA (en) | 2020-02-27 |
| US20180335346A1 (en) | 2018-11-22 |
| JP2019526053A (ja) | 2019-09-12 |
| SG11201900509YA (en) | 2019-02-27 |
| US10048132B2 (en) | 2018-08-14 |
| CN109564160A (zh) | 2019-04-02 |
| CN112432926B (zh) | 2025-10-10 |
| US10401228B2 (en) | 2019-09-03 |
| TWI728157B (zh) | 2021-05-21 |
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