JP2019515853A5 - - Google Patents
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- Publication number
- JP2019515853A5 JP2019515853A5 JP2018544121A JP2018544121A JP2019515853A5 JP 2019515853 A5 JP2019515853 A5 JP 2019515853A5 JP 2018544121 A JP2018544121 A JP 2018544121A JP 2018544121 A JP2018544121 A JP 2018544121A JP 2019515853 A5 JP2019515853 A5 JP 2019515853A5
- Authority
- JP
- Japan
- Prior art keywords
- zro
- weight
- enhanced
- aluminum oxide
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16157594 | 2016-02-26 | ||
| EP16157594.9 | 2016-02-26 | ||
| PCT/EP2017/053450 WO2017144332A1 (de) | 2016-02-26 | 2017-02-16 | Kupfer-keramik-verbund |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019515853A JP2019515853A (ja) | 2019-06-13 |
| JP2019515853A5 true JP2019515853A5 (enExample) | 2020-05-14 |
| JP6858786B2 JP6858786B2 (ja) | 2021-04-14 |
Family
ID=55443148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018544121A Active JP6858786B2 (ja) | 2016-02-26 | 2017-02-16 | 銅−セラミックス複合材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11584696B2 (enExample) |
| EP (1) | EP3419949B1 (enExample) |
| JP (1) | JP6858786B2 (enExample) |
| KR (1) | KR102250917B1 (enExample) |
| CN (1) | CN108698935B (enExample) |
| HU (1) | HUE053549T2 (enExample) |
| WO (1) | WO2017144332A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016203112B4 (de) | 2016-02-26 | 2019-08-29 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund |
| DE102016203058B3 (de) * | 2016-02-26 | 2017-05-18 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund und Modul |
| CN113929486B (zh) * | 2020-06-29 | 2022-12-09 | 比亚迪股份有限公司 | 一种陶瓷覆铜板及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3744120A (en) | 1972-04-20 | 1973-07-10 | Gen Electric | Direct bonding of metals with a metal-gas eutectic |
| US3766634A (en) | 1972-04-20 | 1973-10-23 | Gen Electric | Method of direct bonding metals to non-metallic substrates |
| US3994430A (en) | 1975-07-30 | 1976-11-30 | General Electric Company | Direct bonding of metals to ceramics and metals |
| DE3204167A1 (de) | 1982-02-06 | 1983-08-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten |
| DE4004844C1 (de) | 1990-02-16 | 1991-01-03 | Abb Ixys Semiconductor Gmbh | Verfahren zur Herstellung einer strukturierten Kupfermetallisierung auf einem Keramiksubstrat |
| DE4318241C2 (de) | 1993-06-02 | 1995-06-29 | Schulz Harder Juergen | Metallbeschichtetes Substrat mit verbesserter Widerstandsfähigkeit gegen Temperaturwechselbeanspruchung |
| DE4319944C2 (de) | 1993-06-03 | 1998-07-23 | Schulz Harder Juergen | Mehrfach-Substrat sowie Verfahren zu seiner Herstellung |
| JP2000239542A (ja) * | 1999-02-18 | 2000-09-05 | Matsushita Electric Ind Co Ltd | 粉体組成物及びその製造方法、並びに、熱伝導基板及びその製造方法 |
| DE19927046B4 (de) | 1999-06-14 | 2007-01-25 | Electrovac Ag | Keramik-Metall-Substrat als Mehrfachsubstrat |
| JP3929660B2 (ja) * | 1999-10-29 | 2007-06-13 | 京セラ株式会社 | 絶縁性アルミナ質基板およびアルミナ質銅貼回路基板 |
| JP4206915B2 (ja) * | 2002-12-27 | 2009-01-14 | 三菱マテリアル株式会社 | パワーモジュール用基板 |
| DE102004012231B4 (de) | 2004-03-09 | 2006-03-23 | Curamik Electronics Gmbh | Metall-Keramik-Substrat |
| JP2010120801A (ja) * | 2008-11-19 | 2010-06-03 | Panasonic Corp | セラミックス基板 |
| CN102395540A (zh) | 2009-04-03 | 2012-03-28 | 株式会社住友金属电设备 | 陶瓷烧结体及采用其的半导体装置用基板 |
| WO2011152363A2 (ja) * | 2010-05-31 | 2011-12-08 | 西村陶業株式会社 | 熱放射部材用セラミックスの製造方法、熱放射部材用セラミックス、該セラミックスを用いてなる太陽電池モジュールおよびｌｅｄ発光モジュール |
| JP2012026863A (ja) | 2010-07-23 | 2012-02-09 | Toray Ind Inc | フィルムの検査装置、検査方法、及び製造方法 |
| JP5534610B2 (ja) | 2011-03-31 | 2014-07-02 | Ｊｘ日鉱日石金属株式会社 | Ｃｕ−Ｃｏ−Ｓｉ系合金条 |
| JP2013032265A (ja) * | 2011-07-01 | 2013-02-14 | Maruwa Co Ltd | 半導体装置用アルミナジルコニア焼結基板及びその製造方法 |
| JP6129738B2 (ja) * | 2011-07-14 | 2017-05-17 | 株式会社東芝 | セラミックス回路基板 |
| WO2013015355A1 (ja) | 2011-07-28 | 2013-01-31 | 株式会社東芝 | 酸化物系セラミックス回路基板の製造方法および酸化物系セラミックス回路基板 |
| DE102012110322B4 (de) * | 2012-10-29 | 2014-09-11 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
| CN104072186B (zh) | 2013-03-27 | 2016-03-30 | 比亚迪股份有限公司 | 一种陶瓷覆铜板的制备方法 |
| WO2015129302A1 (ja) | 2014-02-26 | 2015-09-03 | 日本碍子株式会社 | 半導体用複合基板のハンドル基板 |
| DE102016203030B4 (de) | 2016-02-26 | 2025-05-08 | Heraeus Electronics Gmbh & Co. Kg | Kupfer-Keramik-Verbund und ein diesen Verbund enthaltendes Modul |
| DE102016203112B4 (de) | 2016-02-26 | 2019-08-29 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund |
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2017
- 2017-02-16 CN CN201780012066.4A patent/CN108698935B/zh active Active
- 2017-02-16 KR KR1020187025786A patent/KR102250917B1/ko active Active
- 2017-02-16 JP JP2018544121A patent/JP6858786B2/ja active Active
- 2017-02-16 EP EP17708176.7A patent/EP3419949B1/de active Active
- 2017-02-16 US US16/078,662 patent/US11584696B2/en active Active
- 2017-02-16 HU HUE17708176A patent/HUE053549T2/hu unknown
- 2017-02-16 WO PCT/EP2017/053450 patent/WO2017144332A1/de not_active Ceased