CN108698935B - 铜-陶瓷复合物 - Google Patents

铜-陶瓷复合物 Download PDF

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Publication number
CN108698935B
CN108698935B CN201780012066.4A CN201780012066A CN108698935B CN 108698935 B CN108698935 B CN 108698935B CN 201780012066 A CN201780012066 A CN 201780012066A CN 108698935 B CN108698935 B CN 108698935B
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copper
ceramic
ceramic substrate
particle size
alumina
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Chinese (zh)
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CN108698935A (zh
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K·赫布斯特
C·穆舍尔克瑙茨
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Heli Electronics Co ltd
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Heraeus Deutschland GmbH and Co KG
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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
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    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5111—Ag, Au, Pd, Pt or Cu
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    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201780012066.4A 2016-02-26 2017-02-16 铜-陶瓷复合物 Active CN108698935B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16157594.9 2016-02-26
EP16157594 2016-02-26
PCT/EP2017/053450 WO2017144332A1 (de) 2016-02-26 2017-02-16 Kupfer-keramik-verbund

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CN108698935A CN108698935A (zh) 2018-10-23
CN108698935B true CN108698935B (zh) 2021-05-25

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US (1) US11584696B2 (enExample)
EP (1) EP3419949B1 (enExample)
JP (1) JP6858786B2 (enExample)
KR (1) KR102250917B1 (enExample)
CN (1) CN108698935B (enExample)
HU (1) HUE053549T2 (enExample)
WO (1) WO2017144332A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016203058B3 (de) * 2016-02-26 2017-05-18 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund und Modul
DE102016203112B4 (de) 2016-02-26 2019-08-29 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
CN113929486B (zh) * 2020-06-29 2022-12-09 比亚迪股份有限公司 一种陶瓷覆铜板及其制备方法

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DE4004844C1 (de) 1990-02-16 1991-01-03 Abb Ixys Semiconductor Gmbh Verfahren zur Herstellung einer strukturierten Kupfermetallisierung auf einem Keramiksubstrat
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HUE053549T2 (hu) 2021-07-28
KR20180111938A (ko) 2018-10-11
WO2017144332A1 (de) 2017-08-31
JP2019515853A (ja) 2019-06-13
EP3419949B1 (de) 2020-12-16
CN108698935A (zh) 2018-10-23
JP6858786B2 (ja) 2021-04-14
KR102250917B1 (ko) 2021-05-12
EP3419949A1 (de) 2019-01-02

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