JP2019512045A - 基板の真空処理のための装置、有機材料を有するデバイスの製造のためのシステム、及び処理真空チャンバと保守真空チャンバを互いから密封するための方法 - Google Patents

基板の真空処理のための装置、有機材料を有するデバイスの製造のためのシステム、及び処理真空チャンバと保守真空チャンバを互いから密封するための方法 Download PDF

Info

Publication number
JP2019512045A
JP2019512045A JP2018515212A JP2018515212A JP2019512045A JP 2019512045 A JP2019512045 A JP 2019512045A JP 2018515212 A JP2018515212 A JP 2018515212A JP 2018515212 A JP2018515212 A JP 2018515212A JP 2019512045 A JP2019512045 A JP 2019512045A
Authority
JP
Japan
Prior art keywords
vacuum chamber
processing
permanent magnets
magnetic
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018515212A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019512045A5 (https=
Inventor
セバスチャン グンター ザン，
セバスチャン グンター ザン，
アンドレアス ザウアー，
アンドレアス ザウアー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2019512045A publication Critical patent/JP2019512045A/ja
Publication of JP2019512045A5 publication Critical patent/JP2019512045A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2018515212A 2017-03-17 2017-03-17 基板の真空処理のための装置、有機材料を有するデバイスの製造のためのシステム、及び処理真空チャンバと保守真空チャンバを互いから密封するための方法 Pending JP2019512045A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/056372 WO2018166618A1 (en) 2017-03-17 2017-03-17 Apparatus for vacuum processing of a substrate, system for the manufacture of devices having organic materials, and method for sealing a processing vacuum chamber and a maintenance vacuum chamber from each other

Publications (2)

Publication Number Publication Date
JP2019512045A true JP2019512045A (ja) 2019-05-09
JP2019512045A5 JP2019512045A5 (https=) 2019-10-31

Family

ID=58347393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018515212A Pending JP2019512045A (ja) 2017-03-17 2017-03-17 基板の真空処理のための装置、有機材料を有するデバイスの製造のためのシステム、及び処理真空チャンバと保守真空チャンバを互いから密封するための方法

Country Status (6)

Country Link
US (1) US20200240008A1 (https=)
JP (1) JP2019512045A (https=)
KR (1) KR102069665B1 (https=)
CN (1) CN109072412A (https=)
TW (1) TW201839886A (https=)
WO (1) WO2018166618A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127610B2 (en) * 2019-01-04 2021-09-21 Lam Research Corporation Split chamber assembly
CN110016647B (zh) * 2019-05-29 2020-09-08 昆山国显光电有限公司 蒸镀源清洁设备及蒸镀系统
CN111676454B (zh) * 2020-08-04 2023-09-05 光驰科技(上海)有限公司 一种节省真空镀膜室内空间的蒸发源配置结构及其设计方法
US20220112594A1 (en) * 2020-10-14 2022-04-14 Applied Materials, Inc. Device for sealing a vacuum chamber, vacuum processing system, and method of monitoring a load lock seal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009118888A1 (ja) * 2008-03-28 2009-10-01 キヤノンアネルバ株式会社 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置
JP2010527507A (ja) * 2007-04-27 2010-08-12 エドワーズ株式会社 プレート回転装置、排気路開閉度変更装置、被排気装置、搬送装置、ビーム装置、及び、ゲートバルブ
WO2015189263A1 (de) * 2014-06-10 2015-12-17 Mecatronix Ag Verschluss- oder schleusenvorrichtung für eine vakuumkammer
JP2017500447A (ja) * 2013-12-10 2017-01-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理デバイス用、特に内部に有機材料を含むデバイス用の処理装置、及び処理真空チャンバから保守真空チャンバへ又は保守真空チャンバから処理真空チャンバへ蒸発源を移送するための方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010527507A (ja) * 2007-04-27 2010-08-12 エドワーズ株式会社 プレート回転装置、排気路開閉度変更装置、被排気装置、搬送装置、ビーム装置、及び、ゲートバルブ
WO2009118888A1 (ja) * 2008-03-28 2009-10-01 キヤノンアネルバ株式会社 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置
JP2017500447A (ja) * 2013-12-10 2017-01-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理デバイス用、特に内部に有機材料を含むデバイス用の処理装置、及び処理真空チャンバから保守真空チャンバへ又は保守真空チャンバから処理真空チャンバへ蒸発源を移送するための方法
WO2015189263A1 (de) * 2014-06-10 2015-12-17 Mecatronix Ag Verschluss- oder schleusenvorrichtung für eine vakuumkammer

Also Published As

Publication number Publication date
CN109072412A (zh) 2018-12-21
WO2018166618A1 (en) 2018-09-20
KR20180116219A (ko) 2018-10-24
KR102069665B1 (ko) 2020-01-23
TW201839886A (zh) 2018-11-01
US20200240008A1 (en) 2020-07-30

Similar Documents

Publication Publication Date Title
TWI679081B (zh) 載體、遮罩裝置、真空系統及操作一真空系統之方法
KR101985922B1 (ko) 캐리어에 의해 지지되는 기판 상에 하나 또는 그 초과의 층들을 증착하기 위한 시스템 및 그러한 시스템을 사용하는 방법
KR101920333B1 (ko) 유기 재료를 위한 증발 소스, 진공 챔버에서 유기 재료를 증착하기 위한 증착 장치, 및 유기 재료를 증발시키기 위한 방법
TWI651425B (zh) 用於蒸發源材料的沉積源組件、用於將經蒸發源材料沉積在基板上的沉積裝置及將經蒸發源材料沉積在二或更多個基板上的方法
WO2017074501A1 (en) Apparatus for loading a substrate, system for vacuum processing of a substrate, and method for loading a substrate
TWI687533B (zh) 用於一基板之真空處理之設備、用於具有有機材料之裝置之製造的系統、及用以密封連接二壓力區域之一開孔之方法
KR20120092935A (ko) 자석 수단의 교체가 가능한 마스크 고정장치 및 이를 포함하는 증착장치
KR102069665B1 (ko) 기판의 진공 프로세싱을 위한 장치, 유기 재료들을 갖는 디바이스들의 제조를 위한 시스템, 및 프로세싱 진공 챔버와 유지보수 진공 챔버를 서로 밀봉하기 위한 방법
JP2017115246A (ja) 有機材料用の蒸発源、有機材料用の蒸発源を有する真空チャンバにおいて有機材料を堆積するための堆積装置、及び有機材料を蒸発させるための方法
JP6833610B2 (ja) 有機材料用の蒸発源、有機材料用の蒸発源を有する装置、有機材料用の蒸発源を含む蒸発堆積装置を有するシステム、及び有機材料用の蒸発源を操作するための方法
JP2019512158A (ja) 真空システムで使用するためのキャリア、真空処理のためのシステム、及び基板の真空処理のための方法
JP2020518122A (ja) 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法
JP2018154926A (ja) 有機材料用の蒸発源、有機材料用の蒸発源を有する真空チャンバにおいて有機材料を堆積するための堆積装置、及び有機材料を蒸発させるための方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180514

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190618

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20190918

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20200121